HSB2XXX HSMC | Alldatasheet

Document overview

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Technical content

Features

  • Low Forward Voltage Drop
  • High Current Capability
  • High Reliability
  • High Surge Current Capability Mechanical Data
  • Cases: DO-15 molded plastic
  • Epoxy: UL 94V-0 rate flame retardant
  • Lead: Axial leads, solderable per MIL-STD-202, Method 208 guaranteed
  • Polarity: Color band denotes cathode end
  • High temperature soldering guaranteed: 250°C/10seconds/.375”(9.5mm) lead lengths at 5lbs.,(2.3kg) tension
  • Weight: 0.4 gram Maximum Ratings & Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load. Derate current by 20%. Ratings Symbol HSB 220 HSB 230 HSB 240 HSB 250 HSB 260 HSB 280 HSB

2100 Unit

Repetitive Peak Reverse Voltage VRRM 20 30 40 50 60 80 100 V Surge Peak Reverse Voltage VRSM 14 21 28 35 42 57 71 V DC Blocking Voltage VDC 20 30 40 50 60 80 100 V Average Forward Rectified Current (TA=75oC) I FAV 2 A Peak Forward Surge Current, 50Hz Half Sine-wave (TA=25oC) IFSM 50 A Repetitive Peak Forward C (f>15Hz) IFRM 12 A Instantaneous Forward Voltage VF 0.48 0.52 0.65 0.8 V Leakage Current (TJ=25oC, VR=VRRM) 0.1 mA Leakage Current (TJ=100oC, VR=VRRM) IR 10 mA Typical Junction Capacitance CJ 170 pF Rating for Fusing, t<10ms (TA=25oC) i 2t 12.5 A2s Thermal Resistance Junction to Ambient Air RθJA 50 °C/W Thermal Resistance Junction to Lead RθJL 15 °C/W Operating Junction Temperature Range TJ -65 to +125 °C Storage Temperature Range TSTG -65 to +150 °C ESD Protection Voltage VESD <8 KV Characteristics Curve

MICROELECTRONICS CORP. Spec. No. : HL200707 Issued Date : 2007.04.01 Revised Date : 2009.03.24 Page No. : 2/3 HSB220 thru HSB2100 HSMC Product Specification Forward Current Derating Curve 0.5 1.5 2.5 0 25 50 75 100 125 150 175 Lead Temperature(℃) Average Forwa Current(A) Resi sti ve or I nducti ve Load 0.375” (9.5mm) lead length Maximum Non-repetitive Peak Forward Surge Current 11 0 Number of Cycles at 60Hz Peak Forward Su 100 r Current(A) TJ=TJ max. 8.3ms s ingle half s ine-wave (JEDEC Method) Typical Reverse Characteristics 0.001 0.01 0.1 0 20 40 60 80 100 120 140 Percent of Rated Peak Reverse Voltage(%) Instantaneous Reve Current(mA) Tj=125℃ Tj=75℃ Tj =25℃ Typical Instantaneous Forward Characteri sti cs Per Leg 0.01 0.1 VF,Forward Voltage(V) IF,Forward Curren 20-40V 80-100V 50-60V Typical Transient Thermal Impedance 0.1 100 0.01 0.1 1 10 100 t,Pulse Duration(sec.) Transient Ther m Impedance(℃/ W Typical Junction Capacitance 100 1000 0.1 1 10 100 Reverse Voltage(V) Junction Capacitance TJ=25oC, f=1MHz Vs ig=50mVp-p

MICROELECTRONICS CORP. Spec. No. : HL200707 Issued Date : 2007.04.01 Revised Date : 2009.03.24 Page No. : 3/3 HSB220 thru HSB2100 HSMC Product Specification DO-15 Dimension Important Notice:

  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
  • HSMC reserves the right to make changes to its products without notice.
  • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: Tel: 886-2-25212056 Fax: 886-2-25632712 Tel: 886-3-5983621~5 Fax: 886-3-5982931 Marking: Marking around the surface of cylinder Date Code Control Code HSB2 Product Series Pb Free Mark Pb-Free: " . " (Note) Normal: None Note: Green label is used for pb-free packing 2-Lead DO-15 Molded Plastic Package E B C A D DIM Min. Max. A 0.70 0.90 B 25.40 - C 5.80 7.60 D 25.40 - E 2.60 3.60 Unit: mm