HSB1426 HSMC | Alldatasheet
Document overview
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Technical content
Features
- Low Collector to Emitter Saturation Voltage Absolute Maximum Ratings
- Maximum Temperatures
- Maximum Power Dissipation
- Maximum Voltages and Currents (Ta=25°C) Characteristics (Ta=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO -20 - - V IC=-50uA, IE=0 BVCEO -20 - - V IC=-1mA, IB=0 BVEBO -6 - - V IE=-10uA, IC=0 ICBO - - -100 nA VCB=-20V, IE=0 IEBO - - -100 nA VEB=-5V, IC=0 *VCE(sat) - - -500 mV IC=-2A, IB=-0.1A *hFE 82 - 390 VCE=-2V, IC=-100mA fT - 240 - MHz VCE=-2V, IC=-500mA, f=100MHz Cob - 35 - pF VCB=-10V, IE=0, f=1MHz *Pulse Test: Pulse Width ≤380us, Duty Cycle≤2% Classification Of hFE1 Rank P Q R Range 82-180 120-270 180-390 TO-92
MICROELECTRONICS CORP. Spec. No. : HE6506 Issued Date : 1994.03.25 Revised Date : 2002.02.08 Page No. : 2/3 HSB1426 HSMC Product Specification Characteristics Curve Current Gain & Collector Current 100 1000 1 10 100 1000 10000 Collector Current-IC (mA) hFE hFE @ VCE=2V o C 75oC 125oC Saturation Voltage & Collector Current 100 1000 1 10 100 1000 10000 Collector Current-IC (mA) Saturation Voltage (mV) 25oC 75oC 125 o C VCE(sat) @ IC=20IB Capacitance & Reverse-Biased Voltage 100 0.1 1 10 100 Reverse-Biased Voltage (V) Capacitance (pF) Cob Cutoff Frequency & Collector Current 100 1000 10 100 1000 Collector Current-IC (mA) Cutoff Frequency (MHz)... VCE=2V Safe Operating Area 100 1000 10000 1 10 100 Forward Voltage-VCE (V) Collector Current-I C (mA) PT=1ms PT=100ms PT=1s Power Derating 100 200 300 400 500 600 700 800 0 50 100 150 200 Ambient Temperature-Ta (oC) Power Dissipation-PD (mW)
MICROELECTRONICS CORP. Spec. No. : HE6506 Issued Date : 1994.03.25 Revised Date : 2002.02.08 Page No. : 3/3 HSB1426 HSMC Product Specification TO-92 Dimension *: Typical D 0.0142 0.0220 0.36 0.56 α1 - *5° - *5° F 0.1323 0.1480 3.36 3.76 α3 - *2° - *2° Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material:
- Lead: 42 Alloy; solder plating
- Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
- All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
- HSMC reserves the right to make changes to its products without notice.
- HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
- HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Tel: 886-3-5983621~5 Fax: 886-3-5982931 A D B C I α 1 E F α 2 α 3 GH Style: Pin 1.Emitter 2.Collector 3.Base 3-Lead TO-92 Plastic Package Marking: HB 412 Date Code Control Code S Rank