HLMP-1301 AVAGO | Alldatasheet

Document overview

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Technical content

Features

  • High intensity
  • Choice of 4 bright colors: – High Efficiency Red – Orange – Yellow – High Performance Green
  • Popular T-1 diameter package
  • Selected minimum intensities
  • Wide viewing angle
  • General purpose leads
  • Reliable and rugged
  • Available on tape and reel 0.65 (0.026) max. 24.1(.95) MIN. 4.70 (.185) 4.19 (.165) 3.43 (.135) 2.92 (.115) 1.52 (.060) 1.02 (.040) 2.79 (.110) 2.29 (.090) 1.14 (.045) 0.51 (.020) (0.016) 0.40 Ø 3.17 (.125) 2.67 (.105) 6.35 (.250) 5.58 (.220) Notes: 1. All dimensions are in mm (inches). 2. An epoxy meniscus may extend about 1 mm (0.040") down the leads. 3. For PCB hole recommendations, see the Precautions section.

Material Color Part Number Luminous Intensity Iv (mcd) at 10 mA Min. Max. GaAsP on GaP Red HLMP-1301 3.4 – HLMP-1301-E00xx 3.4 – HLMP-1301-FG0xx 5.4 17.2 HLMP-1301-G00xx 8.6 – HLMP-1301-GH0xx 8.6 27.6 Yellow HLMP-1401 2.2 – HLMP-1401-D00xx 3.6 – HLMP-1401-E00xx 5.7 – HLMP-1401-EF0xx 5.7 18.4 HLMP-1401-EFBxx 5.7 18.4 Orange HLMP-K401 2.1 – HLMP-K401-E00xx 3.4 – HLMP-K401-EF0xx 3.4 10.8 HLMP-K401-FGDxx 5.4 17.2 GaP Green HLMP-1503 1.0 – HLMP-1503-C00xx 2.6 – HLMP-1503-D00xx 4.2 – HLMP-1503-DE0xx 4.2 13.4 HLMP-1503-DEDxx 4.2 13.4 Emerald Green[1] HLMP-K600 1.0 – Note: 1. Please refer to Application Note 1061 for information comparing standard green and emerald green light output degradation.…

HLMP – X X XX - X X X XX Mechanical Option 00: Bulk 01: Tape & Reel, Crimped Leads 02, Bx: Tape & Reel, Straight Leads A1: Right Angle Housing, Uneven Leads A2: Right Angle Housing, Even Leads Dx, EE: Ammo Pack, Straight Leads R4: Tape & Reel, Counter Clockwise Vx: Ammo Pack, Horizontal Leads FG: Products need inventory control for Customer IDI Color Bin Options 0: Full Color Bin Distribution B: Color Bins 2 & 3 only D: Color Bins 4 & 5 only Maximum Iv Bin Options 0: Open (no max. limit) Others: Please refer to the Iv Bin Table Minimum Iv Bin Options Please refer to the Iv Bin Table Color Options 3: GaP HER 4: GaP Yellow (except K4xx Series) 5: GaP Green 6: GaP Emerald Green Package Options 1: T-1 (3 mm) K: T-1 (3 mm) Orange (K4xx) or Emerald Green (K6xx)

Absolute Maximum Ratings at T A = 25 °C Parameter HER/Orange Yellow Green Units Peak Forward Current 90 60 90 mA Average Forward Current[1] 25 20 25 mA DC Current[2] 30 20 30 A R everse Voltage (IR = 100 μA) 5 5 5 V Transient Forward Current[4] (10 μsec Pulse) 500 500 500 mA LED Junction Temperature 110 110 110 °C Operating Temperature Range -40 to +100 -40 to +100 -20 to +100 °C Storage Temperature Range -40 to +100 -40 to +100 -40 to +100 °C Notes: 1. See Figure 5 (HER/Orange), 10 (Yellow), or 15 (Green/Emerald Green) to establish pulsed operating conditions. 4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum Ratings.

Electrical Characteristics at T A = 25 °C Symbol Description Device HLMP- Min. Typ. Max. Units Test Conditions 2θ1/2 Included Angle Between Half Luminous Intensity Points All 60 Deg. IF = 10 mA See Note 1 lPEAK Peak Wavelength High Efficiency Red 635 nm Measurement at Peak Orange 600 Yellow 583 Green 565 Emerald Green 558 ld Dominant Wavelength High Efficiency Red 626 nm See Note 2 Orange 602 Yellow 585 Green 569 Emerald Green 560 Dl1/2 Spectral Line Halfwidth High Efficiency Red 40 nm Yellow 36 Green 28 Emerald Green 24 ts Speed of Response High Efficiency Red 90 ns Orange 280 Yellow 90 Green 500 Emerald Green 3100 C Capacitance High Efficiency Red 11 pF VF = 0; Orange 4 f = 1 MHz Yellow 15 Green 18 Emerald Green 35 RθJ-PIN Thermal Resistance All 290 °C/W Junction to Cathode Lead VF Forward Voltage HER/Orange 1.5 1.9 2.4 V IF = 10 mA Yellow 1.5 2.0 2.4 Green 1.5 2.1 2.7 Emerald Green 2.1 2.7 VR Reverse Breakdown Voltage All 5.0 V IR = 100 μA hV Luminous Efficacy High Efficiency Red 145 lumens See Note 3 Orange 380 watt Yellow 500 Green 595 Emerald Green 655 Notes: 1. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant intensity, l e, in watts/steradian, may be found from the equation I e= Iv/hv, where I v is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt.

Intensity Range (mcd) Bin Min. Max. D 2.4 3.8 E 3.8 6.1 F 6.1 9.7 G 9.7 15.5 H 15.5 24.8 I 24.8 39.6 J 39.6 63.4 K 63.4 101.5 L 101.5 162.4 M 162.4 234.6 N 234.6 340.0 Red/Orange O 340.0 540.0 P 540.0 850.0 Q 850.0 1200.0 R 1200.0 1700.0 S 1700.0 2400.0 T 2400.0 3400.0 U 3400.0 4900.0 V 4900.0 7100.0 W 7100.0 10200.0 X 10200.0 14800.0 Y 14800.0 21400.0 Z 21400.0 30900.0 C 2.5 4.0 D 4.0 6.5 E 6.5 10.3 F 10.3 16.6 G 16.6 26.5 H 26.5 42.3 I 42.3 67.7 J 67.7 108.2 K 108.2 173.2 Yellow L 173.2 250.0 M 250.0 360.0 N 360.0 510.0 O 510.0 800.0 P 800.0 1250.0 Q 1250.0 1800.0 R 1800.0 2900.0 S 2900.0 4700.0 T 4700.0 7200.0 U 7200.0 11700.0 V 11700.0 18000.0 W 18000.0 27000.0

Intensity Bin Limits, continued Intensity Range (mcd) Color Bin Min. Max. A 1.1 1.8 B 1.8 2.9 C 2.9 4.7 D 4.7 7.6 E 7.6 12.0 F 12.0 19.1 G 19.1 30.7 H 30.7 49.1 I 49.1 78.5 J 78.5 125.7 Green/ K 125.7 201.1 Emerald Green L 201.1 289.0 M 289.0 417.0 N 417.0 680.0 O 680.0 1100.0 P 1100.0 1800.0 Q 1800.0 2700.0 R 2700.0 4300.0 S 4300.0 6800.0 T 6800.0 10800.0 U 10800.0 16000.0 V 16000.0 25000.0 W 25000.0 40000.0 Maximum tolerance for each bin limit is ± 18%.

Lambda (nm) C olor Category # Min. Max. 9 522.5 555.5 Emerald Green 8 555.5 558.5 7 558.5 561.5 6 561.5 564.5 6 561.5 564.5 5 564.5 567.5 Green 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 1 582.0 584.5 3 584.5 587.0 Yellow 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 1 597.0 599.5 2 599.5 602.0 3 602.0 604.5 Orange 4 604.5 607.5 5 607.5 610.5 6 610.5 613.5 7 613.5 616.5 8 616.5 619.5 Tolerance for each bin limit is ± 0.5 nm.

Mechanical Option Code Definition

00 Bulk Packaging, minimum increment 500 pcs/bag

01 Tape & Reel, crimped leads, minimum increment 1800 pcs/bag

02 Tape & Reel, straight leads, minimum increment 1800 pcs/bag

A1 Right Angle Housing, uneven leads, minimum increment 500 pcs/bag A2 Right Angle Housing, even leads, minimum increment 500 pcs/bag BG Tape & Reel, straight leads in 2K increment BJ Tape & Reel, straight leads in 2K increment DD Ammo Pack, straight leads in 2K increment DJ Ammo Pack, straight leads in 2K increment EE Ammo Pack, straight leads in 5K increment R4 Tape & Reel, straight leads, counter clockwise, anode lead leaving the reel first VA Ammo Pack, horizontal leads in 2K increment VB Ammo Pack, horizontal leads in 2K increment FG Inventory Control for Customer IDI Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative for further clarification or information.

Figure 17. Recommended wave soldering profile Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

  • The leads of an LED lamp may be preformed or cut to length before they are inserted and soldered into the PC board.
  • If forming a lead is required before it is soldered, then take care to avoid any excessive mechanical stress induced to the LED package. Otherwise, cut the LED leads to length after soldering at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond.
  • It is recommended that tooling be made precisely and the leads cut to length, rather than relying on your hand. Soldering Conditions
  • Care must be taken during PCB assembly and soldering process to prevent damage to LED component.
  • The closest an LED is allowed to be soldered on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff.
  • Recommended soldering conditions: Wave Soldering Manual Solder Dipping Pre-heat Temperature 105 °C Max. – Pre-heat Time 30 sec Max. – Peak Temperature 250 °C Max. 260 °C Max. Dwell Time 3 sec Max. 5 sec Max.
  • The wave soldering parameter must be set and maintained according to the recommended temperature and dwell time in the solder wave. Customer is advised to periodically check the soldering profile to ensure the soldering profile used always conforms to recommended soldering condition.
  • If necessary, use a fixture during soldering process to hold the LED component in the proper orientation with respect to the PCB.
  • Proper handling is a must to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25 °C, before handling.
  • To ensure solderability, pay special attention to board fabrication, solder masking, surface plating and lead hole size and component orientation.
  • Here are the recommended PC board plated through- hole sizes for LED component leads: LED Component Lead Size Diagonal Plated Through- Hole Diameter Lead size (typ.) 0.45 × 0.45 mm 0.636 mm (0.025 in) 0.98 to 1.08 mm (0.039 to 0.043 in) Dambar shear- off area (max.) 0.65 mm (0.026 in) 0.919 mm (0.036 in) Lead size (typ.) 0.50 × 0.50 mm 0.707 mm (0.028 in) 1.05 to 1.15 mm (0.041 to 0.045 in) Dambar shear- off area (max.) 0.70 mm (0.028 in) 0.99 mm (0.039 in) Note: Refer to application note AN1027 for more information on soldering LED components.