HLMP-4000 AVAGO | Alldatasheet

Document overview

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Technical content

Features

  • Two color operation
  • Three leads with one common cathode
  • Option of straight or spread leads configuration Selection Guide Package Part Number Color Package lens Min. Luminous Intensity Iv (mcd) Green Red Yellow IF (mA) T-1 3/4 HLMP-4000 Green/HER Non tinted, diffused 4.2 2.1 10 HLMP-4000#xxx 4.2 2.1 10 HLMP-4015 Green/Yellow Non tinted, non-diffused 20.0 20 20 Rectangular HLMP-0800 Green/HER Non tinted, diffused 2.6 2.1 20 HLMP-0805 Green/Yellow Non tinted, diffused 2.6 1.4 20 HLMP-40xx, HLMP-08xx T-1 3/4, 2 mm x 5 mm Rectangular Bicolor LED Lamps Data Sheet

HLMP-40xx Straight Leads HLMP-08xx Straight Leads Notes: 1. All dimensions are in millimeters (inches). 2. Epoxy meniscus may extend about 1 mm (0.040") down the leads. HLMP - X X X X # X X X Mechanical Options 002: Tape & Reel, Straight Leads 010: Right Angle Housing, Even Leads Color Options 00: High Efficiency Red (HER)/High Efficiency Green 05/15: Yellow/High Efficiency Green Package Options 40: T-1 3/4 (5 mm) 08: Rectangular 6.10 (0.240) 5.59 (0.220) 25.40 (1.00) MIN. 0.508 (0.020) SQ. TYP. RED OR YELLOW ANODE (SHORT LEAD) 1.27 (0.050) NOM. 0.89 (0.035) 0.64 (0.025) 9.19 (0.362) 8.43 (0.332) 5.08 (0.200) 4.57 (0.180) 1.27 (0.050) NOM. 2.54 (0.100) NOM. FLAT INDICATES ANODE COMMON CATHODE GREEN ANODE 2.54 (0.100) NOM. 1.27 (0.050) NOM. 0.508 (0.020) SQ. TYP. 2.41 (0.095) 2.03 (0.085) 5.46 (0.215) 4.98 (0.196) 8.00 (0.315) 7.37 (0.290) 2.23 (0.088) 1.98 (0.078) 5.18 (0.204) 4.93 (0.194) 1.27 (0.050) NOM. 25.40 (1.00) MIN.COMMON CATHODE COMMON CATHODE RED OR YELLOW ANODE (SHORT LEAD) COMMON CATHODE GREEN ANODE SIDE VIEW

Absolute Maximum Ratings at TA = 25°C Parameter HER/Green Yellow/Green Units Peak Forward Current 90 60 mA Average Forward Current[1,2] (Total) 25 20 mA DC Current[2] (Total) 30 20 mA Power Dissipation[3] (Total) 135 135 mW Operating Temperature Range –20 to +100 –20 to +100 °C Storage Temperature Range –40 to +100 –40 to +100 °C Reverse Voltage (IR = 100 µA) 5 5 V Transient Forward Current[4] (10 µsec Pulse) 500 500 mA Notes: 1. See Figure 5 to establish pulsed operating conditions. 2. The combined simultaneous current must not exceed the maximum. 3. The combined simultaneous current must not exceed the maximum. 4. The transient peak current is the maximum non-recurring current that can be applied to the device without damaging the LED die and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum Ratings. Electrical/Optical Characteristics at TA = 25˚C Symbol Parameter High Efficiency Red Green Yellow lPEAK Peak Wavelength 635 568 583 nm 20 mA ld Dominant Wavelength[1] 626 570 585 nm 20 mA ts Speed of Response 90 260 90 ns C Capacitance 11 18 15 pF VF = 0, f =1 MHz VF Forward Voltage VR Reverse Voltage 5 5 5 V IR = 100 µA RqJ-PIN Thermal Resistance 210 210 210 °C/W Junction-to- Cathode Lead 2q1/2 Included Angle between half luminous intensity points [2] HLMP-40xx 65 65 65 de- gree HLMP-08xx 100 100 100 hV Luminous Efficacy[3] 145 595 500 lm/W Notes: 1. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the single wavelength which defines the color of the device. 2. q1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. Radiant intensity, le, in watts steradian, may be found from the equation le = Iv/hV, where Iv is the luminous intensity in candelas and h V is the luminous efficacy in lumens/watt.

100 KHz 3 KHz 100 Hz

30 KHz 1 KHz

10 KHz 300 Hz

Figure 1. Relative intensity vs. wavelength. Figure 4. Relative efficiency (luminous intensity per unit current) Figure 5. Maximum tolerable peak current vs. pulse duration.

002 Tape & Reel, straight leads, minimum increment 1300 pcs/bag

010 Right Angle Housing, even leads, minimum increment 500 pcs/bag

tative for further clarification/information. Figure 6. Relative luminous intensity vs. angular displacement for HLMP-40xx. Figure 7. Relative luminous intensity vs. angular displacement for HLMP-08xx.

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

  • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board.
  • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond.
  • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions
  • Care must be taken during PCB assembly and soldering process to prevent damage to LED component.
  • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff.
  • Recommended soldering conditions:
  • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition.
  • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process.
  • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling.
  • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability.
  • Recommended PC board plated through hole sizes for LED component leads: Wave Soldering Manual Solder Dipping Pre-heat Temperature 105 °C Max. – Pre-heat Time 30 sec Max. – Peak Temperature 250 °C Max. 260 °C Max. Dwell Time 3 sec Max. 5 sec Max. LED Component Lead Size Diagonal Plated Through Hole Diameter Note: Refer to application note AN1027 for more information on solder - ing LED components.

Figure 8. Recommended wave soldering profile.