HLB122D

HLB122D HSMC | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 4

Technical content

Features

• High breakdown voltage
• Low collector saturation voltage
• Fast switching speed Absolute Maximum Ratings (TA=25°C)
• Maximum Temperatures
• Maximum Power Dissipation
• Maximum Voltages and Currents Electrical Characteristics (TA=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO 600 - - V I C=100uA BVCEO 400 - - V I C=10mA BVEBO 6--V I E=10uA ICBO - - 10 uA V CB=600V ICEO - - 10 uA V CE=400V IEBO - - 10 uA V EB=6V *VCE(sat)1 - - 400 mV I C=100mA, IB=20mA *VCE(sat)2 - - 800 mV I C=300mA, IB=60mA *VBE(sat) --1 V I C=100mA, IB=20mA *hFE1 10 - 40 V CE=10V, IC=0.1A *hFE2 10 - - V CE=10V, IC=0.5A tf - - 0.6 uS V CC=100V, IC=0.3A, IB1=-IB2=0.06A *Pulse Test: Pulse Width ≤380us, Duty Cycle≤2% Classification of hFE1 Rank B1 B2 B3 B4 B5 B6 Range 10-17 13-22 18-27 23-32 28-37 33-40 TO-126ML

MICROELECTRONICS CORP. Spec. No. : HD200206 Issued Date : 2002.05.01 Revised Date : 2005.08.16 Page No. : 2/4 HLB122D HSMC Product Specification Characteristics Curve Current Gain & Collector Current 100 1 10 100 1000 Collector Current-IC (mA) hFE hFE @ VCE=10V 25oC o C 125oC Saturation Voltage & Collector Current 100 1000 10000 1 10 100 1000 Collector Current-IC (mA) Saturation Voltage (mV) 25 o C 75oC 125oC VCE(sat) @ IC=5IB Saturation Voltage & Collector Current 100 1000 1 10 100 1000 Collector Current-IC (mA) Saturation Voltage (mV) 125 o C 75oC 25oC VBE(sat) @ IC=5IB

MICROELECTRONICS CORP. Spec. No. : HD200206 Issued Date : 2002.05.01 Revised Date : 2005.08.16 Page No. : 3/4 HLB122D HSMC Product Specification TO-126ML Dimension Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Tel: 886-3-5983621~5 Fax: 886-3-5982931 D I E B G F A N C H 321 M J K L 3-Lead TO-126ML Plastic Package Marking: Control CodeDate Code HB 122 Pb Free Mark Pb-Free: " . " (Note) Normal: NoneL D Note: Green label is used for pb-free packing Pin Style: 1.Emitter 2.Collector 3.Base Material:
• Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM Min. Max. A 7.74 8.24 B 10.87 11.37 C 0.88 1.12 D 1.28 1.52 E 3.50 3.75 F 2.61 3.37 G1 3 - H 1.18 1.42 I 2.88 3.12 J 0.68 0.84 K - 2.30 L 3.44 3.70 M 1.88 2.14 N 0.50 0.51 *: Typical, Unit: mm

MICROELECTRONICS CORP. Spec. No. : HD200206 Issued Date : 2002.05.01 Revised Date : 2005.08.16 Page No. : 4/4 HLB122D HSMC Product Specification Soldering Methods for HSMC’s Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%±15% 2. Reflow soldering of surface-mount devices Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP)< 3 oC/sec <3 oC/sec Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) 100oC 150oC 60~120 sec 150oC 200oC 60~180 sec Tsmax to TL - Ramp-up Rate <3 oC/sec <3 oC/sec Time maintained above: - Temperature (TL) - Time (tL) 183oC 60~150 sec 217oC 60~150 sec Peak Temperature (TP) 240 oC +0/-5oC 260 oC +0/-5oC Time within 5oC of actual Peak Temperature (tP) 10~30 sec 20~40 sec Ramp-down Rate <6 oC/sec <6 oC/sec Time 25oC to Peak Temperature <6 minutes <8 minutes 3. Flow (wave) soldering (solder dipping) Products Peak temperature Dipping time Pb devices. 245oC ±5oC 5sec ±1sec Pb-Free devices. 260 oC +0/-5oC 5sec ±1sec Figure 1: Temperature profile tP tL Ramp-down Ramp-up Tsmax Tsmin Critical Zone TL to TP tS Preheat TL TP t 25oC to Peak Time Temperature