HLB1211 HSMC | Alldatasheet

Document overview

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Technical content

Features

  • High breakdown voltage
  • Low collector saturation voltage
  • Fast switching speed Absolute Maximum Ratings (Ta=25°C)
  • Maximum Temperatures
  • Maximum Power Dissipation
  • Maximum Voltages and Currents Characteristics (Ta=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO 600 - - V IC=100uA BVCEO 400 - - V IC=10mA BVEBO 6 - - V IE=10uA ICBO - - 10 uA VCB=550V ICEO - - 10 uA VCB=400V IEBO - - 10 uA VEB=6V *VCE(sat)1 - - 400 mV IC=50mA, IB=10mA *VCE(sat)2 - - 750 mV IC=100mA, IB=20mA *VBE(sat) - - 1 V IC=50mA, IB=10mA *hFE1 8 - - VCE=10V, IC=10mA *hFE2 10 - 36 VCE=10V, IC=50mA *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%

MICROELECTRONICS CORP. Spec. No. : HE9027-B Issued Date : 1996.11.06 Revised Date : 2000.11.01 Page No. : 2/3 HSMC Product Specification Characteristics Curve Dc Current Gain & Collector Current 100 1 10 100 1000 Collector Current (mA) hFE hFE @ VCE=10V Saturation Voltage & Collector Current 100 1000 10000 100000 1 10 100 1000 Collector Current (mA) Saturation Voltage (mV) VBE(sat) @ IC=5IB VCE(sat) @ IC=5IB On Voltage & Collector Current 100 1000 10000 0 100 200 300 400 500 600 Collector Current (mA) On Voltage-Bton Bton @ VCE=10V Capacitance Reverse Biased Voltage 100 1000 0.1 1 10 100 Reverse Biased Voltage (V) Collector Current (mA) Cib Cob Switching Time & Collector Current 0.1 0 100 200 300 400 500 600 Collector Current (mA) Switching Time (us) Tf VCC=100V, IC=5IB1=-5IB2 Ton Tstg Safe Operating Area 100 1000 10000 0 50 100 150 200 250 Forward Biased Voltage (V) Collector Current (mA) PT=1ms PT=100ms PT=1s

MICROELECTRONICS CORP. Spec. No. : HE9027-B Issued Date : 1996.11.06 Revised Date : 2000.11.01 Page No. : 3/3 HSMC Product Specification TO-251 Dimension *:Typical F 0.2677 0.2835 6.80 7.20 Notes : 1.Dimension and tolerance based on our Spec. dated May. 24,1995. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material :

  • Lead : 42 Alloy ; solder plating
  • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
  • HSMC reserves the right to make changes to its products without notice.
  • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 Tel : 886-3-5983621~5 Fax : 886-3-5982931 Tel : 886-3-5977061 Fax : 886-3-5979220 A E F G H J I K C D B Style : Pin 1.Base 2.Collector 3.Emitter 3-Lead TO-251 Plastic Package Marking : HSMC Logo Part Number Date Code Product Series Rank Ink Mark