MMH3111NT1 NXP | Alldatasheet
Document overview
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Technical content
Features
Frequency: 250 to 4000 MHz P1dB: 22.5 dBm @ 900 MHz Small- -Signal Gain: 12 dB @ 900 MHz Third Order Output Intercept Point: 44 dBm @ 900 MHz Single 5 V Supply Internally Prematched to 50 Ohms Internally Biased Cost- -effective SOT- -89 Surface Mount Plastic Package In Tape and Reel. T1 Suffix = 1,000 Units, 12 mm Tape Width, 7- -inch Reel. SOT- -89 Table 1. Typical Performance(1)
- VDD =5V d c ,TA =2 5C, 50 ohm system, application circuit tuned
Table 2. Maximum Ratings Table 3. Thermal Characteristics Select Documentation/Application Notes - - AN1955. Freescale Semiconductor, Inc., 2007- -2008, 2010- -2012, 2014. All rights reserved.
Freescale Semiconductor, Inc. Table 4. Electrical Characteristics(VDD = 5 Vdc, 900 MHz, TA =2 5C, 50 ohm system, in Freescale Application Circuit) Table 5. Functional Pin Description
1 RFin
2 Ground
3 RFout/DC Supply
Table 6. ESD Protection Characteristics Table 7. Moisture Sensitivity Level Figure 1. Functional Diagram
Freescale Semiconductor, Inc.
50 OHM TYPICAL CHARACTERISTICS
Figure 2. Small- -Signal Gain (S21) versus Figure 3. Input/Output Loss versus Frequency Figure 4. Small- -Signal Gain versus Output Figure 5. P1dB versus Frequency Figure 6. Drain Current versus Drain Voltage Figure 7. Third Order Output Intercept Point
900 MHz
2140 MHz
1960 MHz
2600 MHz
3500 MHz
Freescale Semiconductor, Inc. Figure 8. Third Order Output Intercept Point Figure 9. Third Order Output Intercept Point Figure 10. Third Order Intermodulation versus Figure 11. MTTF versus Junction Temperature Figure 12. Noise Figure versus Frequency Figure 13. Single- -Carrier W- -CDMA Adjacent
1 MHz Tone Spacing
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 800- -1900 MHz
Figure 14. 50 Ohm Test Circuit Schematic Figure 15. S21, S11 and S22 versus Frequency Figure 16. 50 Ohm Test Circuit Component Layout Table 8. 50 Ohm Test Circuit Component Designations and Values
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 1900- -2200 MHz
Figure 17. 50 Ohm Test Circuit Schematic Figure 18. S21, S11 and S22 versus Frequency Figure 19. 50 Ohm Test Circuit Component Layout Table 9. 50 Ohm Test Circuit Component Designations and Values
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 2500- -3800 MHz
Figure 20. 50 Ohm Test Circuit Schematic Figure 21. S21, S11 and S22 versus Frequency Figure 22. 50 Ohm Test Circuit Component Layout Table 10. 50 Ohm Test Circuit Component Designations and Values
Freescale Semiconductor, Inc. Table 11. Common Source S- -Parameters(VDD =5V d c ,TA =2 5C, 50 Ohm System)
Freescale Semiconductor, Inc. Table 11. Common Source S- -Parameters(VDD =5V d c ,TA =2 5C, 50 Ohm System)(continued)
Freescale Semiconductor, Inc. PACKAGE DIMENSIONS
Freescale Semiconductor, Inc. MMH3111NT1
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc. MMH3111NT1 PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following resources to aid your design process. Application Notes AN1955: Thermal Measurement Methodology of RF Power Amplifiers AN3100: General Purpose Amplifier and MMIC Biasing Software .s2p File Development Tools Printed Circuit Boards For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to Software & Tools on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description 0 Nov. 2007 Initial Release of Data Sheet 1 Apr. 2008 Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings, p. 1 Corrected Fig. 13, Single- -Carrier W- -CDMA Adjacent Channel Power Ratio versus Output Power y- -axis (ACPR) unit of measure to dBc, p. 5 Updated Part Numbers in Tables 8, 9, 10, Component Designations and Values, to latest RoHS compliant part numbers, pp. 6, 7, 8 2 Apr. 2010 Changed Maximum Ratings table value for RF input power from 10 to 20 dBm as a result of improvements made in the measurement method and the capability of the device, p. 1 Added .s2p File availability to Product Software, p. 15 3 Jan. 2011 Corrected temperature at which ThetaJC is measured from 25Ct o9 5C and added “no RF applied” to Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no RF signal applied, p. 1 Removed IDD bias callout from applicable graphs as bias is not a controlled value, pp. 4- -8 Removed IDD bias callout from Table 11, Common SourceS- -Parameters heading as bias is not a controlled value, pp. 9- -10 Added Printed Circuit Boards availability to Development Tools, p. 15 4 Sept. 2012 Replaced the PCB Pad Layout drawing, the packageisometric and mechanical outline for Case 1514- -02 (SOT- -89) with Case 2142- -01 (SOT- -89) as a result of the device transfer from a Freescale wafer fab to an external GaAs wafer fab and new assembly site. The new assembly and test site’s SOT- -89 package has slight dimensional differences, pp. 1, 11- -14. Refer to PCN13337,GaAs Fab Transfer. Table 6, ESD Protection Characteristics, removed the word “Minimum” after the ESD class rating. ESD ratings are characterized during new product development but are not 100% tested during production. ESD ratings provided in the data sheet are intended to beused as a guideline when handling ESD sensitive devices, p. 3 Added Fig. 24, Product Marking, p. 11 Added AN3100, General Purpose Amplifier and MMIC Biasing to Product Documentation, Application Notes, p. 15 4.1 Oct. 2014 Revised Fig. 24, Product Marking, p. 10
Freescale Semiconductor, Inc. Information in this document is provided solely to enablesystem and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particularpurpose, nor does Freescale assume any liability arisingout of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., respective owners. E 2007- -2008, 2010- -2012, 2014 Freescale Semiconductor, Inc. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Document Number: MMH3111NT1 Rev. 4.1, 10/2014