MMG3014NT1 NXP | Alldatasheet
Document overview
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Technical content
Features
Frequency: 40- -4000 MHz P1dB: 25 dBm @ 900 MHz Small- -Signal Gain: 19.5 dB @ 900 MHz Third Order Output Intercept Point: 40.5 dBm @ 900 MHz Single 5 V Supply Active Bias Cost- -effective SOT- -89 Surface Mount Plastic Package In Tape and Reel. T1 Suffix = 1,000 Units, 12 mm Tape Width, 7- -inch Reel. 40- -4000 MHz, 19.5 dB 25 dBm InGaP HBT GPA MMG3014NT1 SOT- -89 Table 1. Typical Performance(1)
- VCC =5V d c ,TA =2 5C, 50 ohm system, application circuit
tuned for specified frequency. Table 2. Maximum Ratings Table 3. Thermal Characteristics Freescale Semiconductor, Inc., 2008, 2011, 2014, 2016.All rights reserved.
Freescale Semiconductor, Inc. Table 4. Electrical Characteristics(VCC = 5 Vdc, 900 MHz, TA =2 5C, 50 ohm system, in Freescale Application Circuit) Table 5. Functional Pin Description
1 RFin
2 Ground
3 RFout/DC Supply
Table 6. ESD Protection Characteristics Table 7. Moisture Sensitivity Level Figure 1. Functional Diagram
Freescale Semiconductor, Inc.
50 OHM TYPICAL CHARACTERISTICS
Figure 2. Small- -Signal Gain (S21) versus Figure 3. Input/Output Return Loss versus Figure 4. Small- -Signal Gain versus Output Figure 5. P1dB versus Frequency Figure 6. Collector Current versus Collector Figure 7. Third Order Output Intercept Point
1 MHz Tone Spacing
900 MHz
2140 MHz
1960 MHz
2600 MHz
3500 MHz
Freescale Semiconductor, Inc. Figure 8. Third Order Output Intercept Point Figure 9. Third Order Output Intercept Point Figure 10. Third Order Intermodulation versus Figure 11. MTTF versus Junction Temperature Figure 12. Noise Figure versus Frequency Figure 13. Single- -Carrier W- -CDMA Adjacent
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 800- -1000 MHz
Figure 14. 50 Ohm Test Circuit Schematic Figure 15. S21, S11 and S22 versus Frequency Figure 16. 50 Ohm Test Circuit Component Layout Table 8. 50 Ohm Test Circuit Component Designations and Values
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 1800- -2200 MHz
Figure 17. 50 Ohm Test Circuit Schematic Figure 18. S21, S11 and S22 versus Frequency Figure 19. 50 Ohm Test Circuit Component Layout Table 9. 50 Ohm Test Circuit Component Designations and Values
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 2300- -2700 MHz
Figure 20. 50 Ohm Test Circuit Schematic Figure 21. S21, S11 and S22 versus Frequency Figure 22. 50 Ohm Test Circuit Component Layout Table 10. 50 Ohm Test Circuit Component Designations and Values
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 3400- -3600 MHz
Figure 23. 50 Ohm Test Circuit Schematic Figure 24. S21, S11 and S22 versus Frequency Figure 25. 50 Ohm Test Circuit Component Layout Table 11. 50 Ohm Test Circuit Component Designations and Values
Freescale Semiconductor, Inc. Table 12. Common Emitter S- -Parameters(VCC =5V d c ,TA =2 5C, 50 Ohm System)
Freescale Semiconductor, Inc. Table 12. Common Emitter S- -Parameters(VCC =5V d c ,TA =2 5C, 50 Ohm System)(continued)
Freescale Semiconductor, Inc. MMG3014NT1 PACKAGE DIMENSIONS
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc. MMG3014NT1
Freescale Semiconductor, Inc. PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following documents to aid your design process. Application Notes AN1955: Thermal Measurement Methodology of RF Power Amplifiers AN3100: General Purpose Amplifier Biasing Software .s2p File Development Tools Printed Circuit Boards Reference Designs 2110- -2170 MHz, 4 W, 28 V W- -CDMA Smart Demo Reference Design (Devices MMG3014N, MW7IC2240N) To Download Resources Specific to a Given Part Number: 1. Go tohttp://www.nxp.com/RF 2. Search by part number 3. Click part number link 4. Choose the desired resource from the drop down menu FAILURE ANALYSIS At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third party vendors with moderate success. For updates contact your local Freescale Sales Office.
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description 0 Apr. 2008 Initial Release of Data Sheet 1 Sept. 2008 Updated Fig. 15, “S21, S11 and S22 versus Frequency,” to correct S11 and S22 curve label transposition error, p. 6 Updated data in Table 12, “Common Emitter S-Parameters,” for better simulation response, pp. 9- -10 2 Jan. 2011 Corrected temperature at which ThetaJC is measured from 25Ct o8 1C and added “no RF applied” to Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no RF signal applied, p. 1 Removed ICC bias callout from applicable graphs as bias is not a controlled value, pp. 4- -9 Removed ICC bias callout from Table 12, Common Emitter S- -Parameters heading as bias is not a controlled value, pp. 9- -10 Added .s2p file and Printed Circuit Boards availability to Software and Tools, p. 16 Added Reference Design availability to Development Tools, p. 16 3 Oct. 2011 Table 1, Maximum Ratings, increased Input Power from 15 dBm to 25 dBm to reflect the true capability of the device, p. 1 Changed ESD Human Body Model rating from Class 1C to Class 1B to reflect recent ESD test results of the device, p. 2 Corrected part number for the C7 capacitor in Table 8, 50 Ohm Test Circuit Component Designations and Values, from C0603C189J5GAC to C1206C189D5GAC, p. 5. Replaced the PCB Pad Layout drawing, the packageisometric and mechanical outline for Case 1514- -02 (SOT- -89) with Case 2142- -01 (SOT- -89) as a result of the device transfer from a Freescale wafer fab to an external GaAs wafer fab and new assembly site. The new assembly and test site’s SOT- -89 package has slight dimensional differences, pp. 1, 11- -14. Refer to PCN13337,GaAs Fab Transfer. 4 Aug. 2014 Table 2, Maximum Ratings: updated Junction Temperature from 150C to 175C to reflect recent test results of the device, p. 1 Added Failure Analysis information, p. 15 5 Mar. 2016 Overview paragraph updated to reflect actual matching of the device, p. 1 Fig. 27, Product Marking: updated date code line to reflect improved traceability information, p. 11
Freescale Semiconductor, Inc. MMG3014NT1 Information in this document is provided solely to enablesystem and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particularpurpose, nor does Freescale assume any liability arisingout of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., respective owners. E 2008, 2011, 2014, 2016 Freescale Semiconductor, Inc. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Document Number: MMG3014NT1 Rev. 5, 3/2016