HDY227 HSMC | Alldatasheet
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MICROELECTRONICS CORP. Spec. No. : HE6401-B Issued Date : 1998.06.21 Revised Date : 2000.09.20 Page No. : 1/3 HSMC Product Specification HDY227 NPN EPITACIAL PLANAR TRANSISTOR
Description
Low frequency power amplifier. Absolute Maximum Ratings
- Maximum Temperatures
- Maximum Power Dissipation
- Maximum Voltages and Currents (Ta=25°C) Characteristics (Ta=25°C) Symbol Min. Max. Unit Test Conditions BVCBO 30 - V IC=100uA, IE=0 BVCEO 25 - V IC=10mA, IB=0 BVEBO 5 - V IE=10uA, IC=0 ICBO - 100 nA VCB=25V, IE=0 IEBO - 100 nA VEB=3V, IC=0 *VCE(sat) - 400 mV IC=300mA, IB=30mA *hFE 70 400 - IC=50mA, VCE=1V *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% Classification of hFE Rank O Y G hFE 70-140 120-240 200-400
MICROELECTRONICS CORP. Spec. No. : HE6401-B Issued Date : 1998.06.21 Revised Date : 2000.09.20 Page No. : 2/3 HSMC Product Specification Characteristics Curve Current Gain & Collector Current 100 1000 0.1 1 10 100 1000 Collector Current (mA) hFE hFE @ VCE=1V Saturation Voltage & Collector Current 100 1000 0.1 1 10 100 1000 Collector Current (mA) Saturation Voltage (mV)VCE(sat) @ IC=10IB Cutoff Frequency & Collector Current 100 1000 1 10 100 1000 Collector Current (mA) Cutoff Frequency (MHz) VCE=5V Capacitance & Reverse-Biased Voltage 0.1 1 10 100 Reverse-Biased Voltage (V) Capacitance (pF) Cob Safe Operating Area 100 1000 10000 1 10 100 Forward Voltage-VCE (V) Collector Current-IC (mA) PT=1ms PT=100ms PT=1s PD-Ta 100 150 200 250 300 350 400 450 0 50 100 150 200 Ambient Temperature-Ta(oC) Power Dissipation-PD(mW)
MICROELECTRONICS CORP. Spec. No. : HE6401-B Issued Date : 1998.06.21 Revised Date : 2000.09.20 Page No. : 3/3 HSMC Product Specification TO-92 Dimension *:Typical D 0.0142 0.0220 0.36 0.56 α1 - *5° - *5° F 0.1323 0.1480 3.36 3.76 α3 - *2° - *2° Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material :
- Lead : 42 Alloy ; solder plating
- Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice:
- All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
- HSMC reserves the right to make changes to its products without notice.
- HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
- HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 Tel : 886-3-5983621~5 Fax : 886-3-5982931 Tel : 886-3-5977061 Fax : 886-3-5979220 A D B C I α 1 E F α 2 α 3 GH Style : Pin 1.Emitter 2.Base 3.Collector 3-Lead TO-92 Plastic Package Marking : HSMC Logo Part Number Date Code Product Series Rank Laser Mark HSMC Logo Part Number Product Series Ink Mark