HDSP-078X AVAGO | Alldatasheet

Document overview

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Technical content

Features

  • Three character options Numeric, hexadecimal, over range
  • Three colors; High Efficiency Red, Yellow, High Performance Green
  • 4 x 7 dot matrix character
  • Two high efficiency red options Low power, high brightness
  • Performance guaranteed over temperature
  • High temperature stabilized
  • Memory latch/decoder/driver TTL compatible
  • Categorized for luminous intensity

Description

These standard solid state displays have a 7.4 mm (0.29 inch) dot matrix character and an on-board IC with data memory latch/decoder and LED drivers in a glass/ ceramic package. The hermetic HDSP-078x,-079x/ -088x displays utilize a solder glass frit seal. The HDSP-098X displays utilize an epoxy glass-to-ceramic seal. The numeric devices decode positive BCD logic into char- acters “0-9, ” a “–” sign, decimal point, and a test pattern. The hexadecimal devices decode positive BCD logic into 16 characters, “0-9, A-F. ” An input is provided on the hexa- decimal devices to blank the display (all LEDS off) without losing the contents of the memory. The over range device displays “±1” and right hand decimal point and is typically driven via external switch- ing transistors. HDSP-078x, HDSP-079x, HDSP-088x, HDSP-098x Glass/Ceramic Numeric and Hexadecimal Displays for Industrial Applications Data Sheet

13.5 (0.53) 3.0 (0.12) COLOR CODE(3) LUMINOUS INTENSITY CATEGORY DATE CODE COUNTRY CODE TYP. 0-10° PIN 1 KEY 4.8 (0.19) 10.2 (0.400) 5.6 (0.22) 1.5 (0.06) 7.4 (0.29) MAX. PIN NUMERIC Input 2 Input 4 Input 8 Decimal Point Latch Enable Ground VCC Input 1 HEXADECIMAL Input 2 Input 4 Input 8 Blanking Control Latch Enable Ground VCC Input 1 NOTES: 1. DIMENSIONS IN MILLIMETERS AND (INCHES). 2. UNLESS OTHERWISE SPECIFIED, THE TOLERANCE ON ALL DIMENSIONS IS ± 0.38 mm (± 0.015 INCH). 3. DIGIT CENTER LINE IS ± 0.25 mm (± 0.01 INCH) FROM PACKAGE CENTER LINE. 4. COLOR CODE FOR HDSP-088X/-098X SERIES. REAR VIEW SIDE VIEW END VIEW 10.2 (0.400) 15.2 (0.600) HDSP XXXX YYWW SYYWW X Z 6 7 8 4 3 2 1 13.5 (0.53) 3.6 (0.14) 4.8 (0.19) 4.3 (0.17) 0.3 ± 0.08 (0.012 ± 0.003) TYP.2.5 ± 0.13 (0.100 ± 0.005) TYP.0.5 ± 0.08 SEATING PLANE 1.3 (0.050) 3.8 (0.15) 1.5 (0.06) 3.4 (0.135) 2.8 (0.11) 10.2 (0.400) 5.6 (0.22) 1.5 (0.06) 7.4 (0.29) MAX. 13.5 (0.53) 4.8 (0.19) 10.2 (0.400) 1.5 (0.06) 7.4 (0.29) MAX. SEATING PLANE FUNCTION FRONT VIEW A FRONT VIEW B FRONT VIEW D

Description Symbol Min. Max. Unit Storage T emperature, Ambient HDSP-078x/-079x/-088x TS -65 +125 °C HDSP-098x -55 +100 Operating T emperature, Ambient[1] TA -55 +100 °C Supply Voltage[2] VCC -0.5 +7.0 V Voltage Applied to Input Logic, dp and Enable Pins VI, VDP, VE -0.5 VCC V Voltage Applied to Blanking Input[2] VR -0.5 VCC V Soldering T emperature [1.59 mm (0.063 inch) Below Body] Solder Dipping, max 5 seconds 260 °C Wave Soldering, max. 3 seconds 250 Recommended Operating Conditions Description Symbol Min. Nom. Max. Unit Supply Voltage[2] VCC 4.5 5.0 5.5 V Operating T emperature, Ambient[1] TA -55 +100 °C Enable Pulse Width tW 100 nsec Time Data Must Be Held Before Positive Transition of Enable Line t SETUP 50 nsec Time Data Must Be Held After Positive Transition of Enable Line tHOLD 50 nsec Enable Pulse Rise Time tTLH 1.0 msec Optical Characterstics at TA = 25°C, VCC = 5.0 V Device Description Symbol Min. Typ. Max. Unit HDSP-078x Series Luminous Intensity per LED I V 65 140 µcd (Digit Average)[3,4] Peak Wavelength lPEAK 635 nm Dominant Wavelength[5] ld 626 nm HDSP-079x Series Luminous Intensity per LED I V 260 620 µcd (Digit Average)[3,4] Peak Wavelength lPEAK 635 nm Dominant Wavelength[5] ld 626 nm HDSP-088x Series Luminous Intensity per LED lV 215 490 µcd (Digit Average)[3,4] Peak Wavelength lPEAK 583 nm Dominant Wavelength[5,6] ld 585 nm HDSP-098x Series Luminous Intensity per LED I V 298 1100 µcd (Digit Average)[3,4] Peak Wavelength lPEAK 568 nm Dominant Wavelength ld 574 nm Notes: 1. The nominal thermal resistance of a display mounted in a socket that is soldered onto a printed circuit board is RqJA = 50°C/W/device. The device package thermal resistance is RqJ-PIN = 15°C/W/device. The thermal resistance device pin-to-ambient through the PC board should not exceed 35°C/ W/device for operation up to TA = +100°C. 2. Voltage values are with respect to device ground, pin 6. 3. These displays are categorized for luminous intensity with the intensity category designated by a letter code located on the back of the display package. Case temperature of the device immediately prior to the light measurement is equal to 25°C.

Electrical/Optical Characteristics TA = –55°C to +100°C Description Symbol Test Conditions Min. Typ.[7] Max. Unit Supply HDSP-078x Series ICC V CC = 5.5 V 78 105 mA Current HDSP-079x/-088x/-098x Series Characters “5.” or 120 175 “B” displayed Power HDSP-078x Series PT V CC = 5.5 V 390 573 mW Dissipation HDSP-079x/-088x/-098x Series Characters “5.” or 690 963 “B” displayed Logic, Enable and Blanking Low-Level VIL V CC = 4.5 V 0.8 V Input Voltage Logic, Enable High-Level Input Voltage VIH 2.0 V Blanking High-Voltage; Display Blanked VBH 2.3 V Logic and Enable Low-Level Input Current IIL V CC = 5.5 V –1.6 mA Blanking Low-Level Input Current IBL V IL = 0.4 V –10 µA Logic, Enable and Blanking High-Level IIH V CC = 5.5 V +40 µA Input Current VIH = 2.4 V Weight 1.0 gm Leak Rate 5 x 10 -8 cc/sec Notes: 4. The luminous intensity at a specific operating ambient temperature, Iv(TA), may be approximated from the following exponential equation: Iv(TA) = Iv(25°C) e[k(TA-25°C)]. Device K HDSP-078 Series –0.0131/°C HDSP-079x Series HDSP-088x Series –0.0112/°C HDSP-098x Series –0.0104/°C 5. The dominant wavelength, ld, is derived from the CIE chromaticity dia- gram and represents the single wavelength which defines the color of the device. 6. The HDSP-088X and HDSP-098X series devices are categorized as to dominant wavelength with the category designated by a number on the back of the display package. 7. All typical values at VCC = 5.0 V and TA = 25°C. Operational Considerations Electrical These devices use a modified 4 x 7 dot matrix of light emitting diodes to display decimal/hexadecimal numeric information. The high efficiency red and yellow displays use GaAsP/GaP LEDs and the high performance green displays use GaP/GaP LEDs. The LEDs are driven by con- stant current drivers, BCD information is accepted by the display memory when the enable line is at logic low and the data is latched when the enable is at logic high. Using the enable pulse width and data setup and hold times listed in the Recommended Operating Conditions allows data to be clocked into an array of displays at a 6.7 MHz rate. The decimal point input is active low true and this data is latched into the display memory in the same fashion as the BCD data. The decimal point LED is driven by the on-board IC. The blanking control input on the hexadecimal displays blanks (turns off ) the displayed information without dis- turbing the contents of display memory. The display is blanked at a minimum threshold level of 2.0 volts. When blanked, the display standby power is nominally 250 mW at TA = 25°C. The ESD susceptibility of the IC devices is Class A of MIL- STD-883 or Class 2 of DOD-STD-1686 and DOD-HDBK- 263.

These displays are hermetically sealed for use in environ- ments that require a high reliability device. These displays are designed and tested to meet a helium leak rate of 5 x 10-8 cc/sec. These displays may be mounted by soldering directly to a printed circuit board or insertion into a socket. The lead-to-lead pin spacing is 2.54 mm (0.100 inch) and the lead row spacing is 15.24 mm (0.600 inch). These displays may be end stacked with 2.54 mm (0.100 inch) spacing between outside pins of adjacent displays. Sockets such as Augat 324-AG2D (3 digits) or Augat 508-AG8D (one digit, right angle mounting) may be used. The primary thermal path for power dissipation is through the device leads. Therefore, to insure reliable operation up to an ambient temperature of +100°C, it is important to maintain a base-to-ambient thermal resistance of less than 35°C watt/device as measured on top of display pin For further information on soldering and post solder cleaning, see Application Note 1027, Soldering LED Com- ponents. Preconditioning These displays are 100% preconditioned by 24 hour storage at 125°C, at 100°C for the HDSP-098x Series. Contrast Enhancement These display devices are designed to provide an optimum ON/OFF contrast when placed behind an appro- priate contrast enhancement filter. For further information on contrast enhancement, see Application Note 1015, Contrast Enhancement for LED Displays. Over Range Display The over range devices display “±1” and decimal point. The character height and package configuration are the same as the numeric and hexadecimal devices. Character selection is obtained via external switching transistors and current limiting resistors. Absolute Maximum Ratings Description Symbol Min Max Unit Storage T emperature, Ambient T S –65 +125 °C Operating T emperature, Ambient T A –55 +100 °C Forward Current, Each LED IF 10 mA Reverse Voltage, Each LED VR 5 V

Figure 3. Typical driving circuit.

1 X 1 X X

0: Line switching transistor in Figure 7 cutoff. 1: Line switching transistor in Figure 7 saturated. NOTE: DIMENSIONS IN MILLIMETERS AND (INCHES).

(Dominant Wavelength) Intensity Range (nm) Color Bin Min. Max. Yellow 1 581.50 585.00 2 584.00 587.50 3 586.50 590.00 Green 1 570.00 574.00 2 573.00 577.00 3 576.00 580.00 Note: Bin categories are established for classification of products. Products may not be available in all bin categories. Please consult your local Avago T echnologies representative. Intensity Bin Limits for HDSP-078x Series Bin Category Min. (mcd) Max. (mcd) Condition A 0.065 0.102 B 0.085 0.138 C 0.114 0.200 Luminous Intensity per D 0.165 0.300 LED. VDD @ 5.0 V E 0.260 0.488 F 0.403 0.756 G 0.625 1.172 Intensity Bin Limits for HDSP-079x Series Bin Category Min. (mcd) Max. (mcd) Condition E 0.260 0.488 F 0.403 0.756 Luminous Intensity per G 0.625 1.172 LED. VDD @ 5.0 V H 0.969 1.820 Intensity Bin Limits for HDSP-088x Series Bin Category Min. (mcd) Max. (mcd) Condition A 0.22 0.34 B 0.28 0.46 C 0.38 0.66 Luminous Intensity per D 0.55 0.99 LED. VDD @ 5.0 V E 0.82 1.54 F 1.27 2.39 Intensity Bin Limits for HDSP-098x Series Bin Category Min. (mcd) Max. (mcd) Condition C 0.30 0.52 D 0.43 0.79 Luminous Intensity per E 0.65 1.18 LED. VDD @ 5.0 V F 0.97 1.76 G 1.45 2.63

Electrical Characteristics

TA = –55°C to +100°C Device Description Symbol Test Conditions Min. Typ. Max. Unit HDSP-0783 Power Dissipation (All LEDs Illuminated) P T I F = 2.8 mA 72 mW I F = 8 mA 224 282 Forward Voltage per LED VF I F = 2.8 mA 1.6 V I F = 8 mA 1.75 2.2 HDSP-0883 Power Dissipation (All LEDs Illuminated) P T I F = 8 mA 237 282 mW Forward Voltage per LED VF 1.90 2.2 V HDSP-0983 Power Dissipation (All LEDs Illuminated) P T I F = 8 mA 243 282 mW Forward Voltage per LED VF 1.85 2.2 V For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-3188EN AV02-1334EN - June 6, 2008