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Metal Package Full Size DIP and Half DIP, TTL / HC-MOS HCOF/HCOH Series ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com 12/10_A Specifications subject to change without notice Page 1 12.6 20.7 5.1 Max. 6 Min. 0.048 0.36 6 Min. 5.1 Max. 0.36 0.48 7.62 7.62 7.62 15.24 12.6 12.6 1 2 Dimension Units: mm Pin Connection 1 Enable / N.C.
2 GND
3 Output
4 Vcc
Product Features: Applications: Low Jitter, Non-PLL Based Output Fibre Channel CMOS/TTL Compatible Logic Levels Server & Storage Compatible with Leadfree Processing Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 S y s t e m C l o c k NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise. * Not available at all frequencies. Not available for all temperature ranges. * Frequency, supply, and load related parameters. Frequency 1 MHz to 160.000 MHz Output Level HC-MOS TTL ‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min. ‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min. Duty Cycle Specify 50% ±10% or ±5% See Table in Part Number Guide Rise / Fall Time 5 nS Max. @ Vcc = +3.3 VDC, 10 nS Max. @ Vcc = +5 VDC * Output Load Fo < 50 MHz = 10 TTL, Fo > 50 MHz = 5 LSTTL See Table in Part Number Guide Frequency Stability See Frequency Stability Table (Includes room temperature tolerance and stability over operating temperature) Start-up Time 10 mS Max. Enable / Disable Time 100 nS Max. Supply Voltage See Input Voltage Table, tolerance ±5 % Current 40 mA Max. @ 3.3 VDC, 85 mA Max. @ 5.0 VDC * Operating See Operating Temperature Table in Part Number Guide Storage -55 C to +125 C Jitter: RMS(1sigma)
1 MHz-75 MHz
76 MHz-160 MHz
5 pS RMS (1 sigma) Max. accumulated jitter (20K adjacent periods) 3 pS RMS (1 sigma) Max. accumulated jitter (20K adjacent periods) Max Integrated 1.5 pS RMS (1 sigma -12KHz to 20MHz) 1 pS RMS (1 sigma -12KHz to 20MHz) Max Total Jitter 50 pS p-p (100K adjacent periods) 30 pS p-p (100K adjacent periods) Part Number Guide Sample Part Number: HCOF - 3153BH - 20.000 Package Input Voltage Operating Temperature Symmetry (Duty Cycle) Output Stability (in ppm) Enable / Disable Frequency HCOF - HCOH - 5 = 5.0 V 1 = 0 C to +70 C 5 = 45 / 55 Max. 1 = 10TTL / 15 pF HC-MOS E = 10 H = Enable - 20.000 MHz 3 = 3.3 V 6 = -10 C to +70 C 6 = 40 / 60 Max. 3 = 15 pF HC-MOS D = 15 O = N/C 3 = -20 C to +70 C 6 = 30 pF **F = 20 4 = -30 C to +75 C 5 = 50 pF HC-MOS (<40 MHz) A = 25 2 = -40 C to +85 C B = 50 C = 100
Metal Package Full Size DIP and Half DIP, TTL / HC-MOS HCOF/HCOH Series ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com 12/10_A Specifications subject to change without notice Page 2 Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal). Environmental Specifications Thermal Shock MIL-STD-883, Method 1011, Condition A Moisture Resistance MIL-STD-883, Method 1004 Mechanical Shock MIL-STD-883, Method 2002, Condition B Mechanical Vibration MIL-STD-883, Method 2007, Condition A Resistance to Soldering Heat J-STD-020C, Tabl e 5-2 Pb-free devices (except 2 cycles max) Hazardous Substance Pb-Free / RoHS / Green Compliant Solderability JESD22-B102-D Method 2 (Preconditioning E) Terminal Strength MIL-STD-883, Method 2004, Test Condition D Gross Leak MIL-STD-883, Method 1014, Condition C Fine Leak MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s Solvent Resistance MIL-STD-202, Method 215 Marking Line 1: ILSI and Date Code Line 2: XXXXXX (Part Number detail = HCOH-XXXXXX-Freq.) Line 3: Frequency