HBZX55C HSMC | Alldatasheet

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MICROELECTRONICS CORP. Spec. No. : Preliminary Data Issued Date : 1999.05.01 Revised Date : 1999.09.01 Page No. : 1/3 HSMC Product Specification HBZX55C Series ZENER DIODES Maximum Zener Impedance Maximum Reverse Leakage CurrentDevice Type Nominal Zener Voltage Vz at Izt* (V) Test Current IzT (mA) ZzT at IzT (Ω ) Zzk at Izk=1mA (Ω ) Typical Temperature Coefficient (%/°C) IR (uA) Test-Voltage suffix B (V) Maximum Regulator Current IzM (mA) HBZX55C2V4 2.28-2.56 5 85 600 -0.070 50 1.0 150 HBZX55C2V7 2.5-2.9 5 85 600 -0.070 10 1.0 135 HBZX55C3V0 2.8-3.2 5 85 600 -0.070 4 1.0 125 HBZX55C3V3 3.1-3.5 5 85 600 -0.065 2 1.0 115 HBZX55C3V6 3.4-3.8 5 85 600 -0.060 2 1.0 105 HBZX55C3V9 3.7-4.1 5 85 600 -0.050 2 1.0 95 HBZX55C4V3 4.0-4.6 5 75 600 -0.025 1 1.0 90 HBZX55C13 12.4-14.1 5 26 110 +0.070 0.1 10 29 HBZX55C15 13.8-15.6 5 30 110 +0.070 0.1 11 27 HBZX55C16 15.3-17.1 5 40 170 +0.070 0.1 12 24 HBZX55C18 16.8-19.1 5 50 170 +0.070 0.1 14 21 HBZX55C20 18.8-21.2 5 55 220 +0.070 0.1 15 20 HBZX55C22 20.8-23.3 5 55 220 +0.070 0.1 17 18 HBZX55C24 22.8-25.6 5 80 220 +0.080 0.1 18 16 HBZX55C27 25.1-28.9 5 80 220 +0.080 0.1 20 14 HBZX55C30 28-32 5 80 220 +0.080 0.1 22 13 HBZX55C33 31-35 5 80 220 +0.080 0.1 24 12 HBZX55C36 34-38 5 80 220 +0.080 0.1 27 11 HBZX55C39 37-41 2.5 90 500 +0.080 0.1 30 10 HBZX55C43 40-46 2.5 90 600 +0.080 0.1 33 9.2 HBZX55C47 44-50 2.5 110 700 +0.080 0.1 36 8.5 Note : 1.Standard Voltage Tolerance is ±5% and Suffix "A" for ±1%, Suffix "B" for ±2%, Suffix "C" for ±5%, Suffix "D" for ±20% 2.*Measured With Pulses Tp= 20m Sec.

MICROELECTRONICS CORP. Spec. No. : Preliminary Data Issued Date : 1999.05.01 Revised Date : 1999.09.01 Page No. : 2/3 HSMC Product Specification Absolute Maximum Ratings Characteristics Symbol Value Unit Zener Current see Table “Characteristics” Power Dissipation at Tamb=25°C Ptot 500* mW Junction Temperature Tj 175 °C Storage Temperature Range Ts -65 to +175 °C *Valid provided that leads are kept at ambient temperature at a distance of 8mm from case. Characteristics ( Tamb=25°C) Characteristics Symbol Min Typ Max Unit Thermal Resistance Junction to Ambient Air RthA - - 0.3* K/mW Forward Voltage at IF=100mA VF - - 1 V *Valid provided that leads at a distance of 10mm from case are kept at ambient temperature. Characteristics Curve

MICROELECTRONICS CORP. Spec. No. : Preliminary Data Issued Date : 1999.05.01 Revised Date : 1999.09.01 Page No. : 3/3 HSMC Product Specification DO-35(Glass) Dimension *:Typical C 0.1200 0.1700 3.05 4.20 Important Notice:

  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
  • HSMC reserves the right to make changes to its products without notice.
  • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 Tel : 886-3-5983621~5 Fax : 886-3-5982931 Tel : 886-3-5977061 Fax : 886-3-5979220 B C D A E DO-35 Glasses Package, HSMC Package Code : L