HBN3101S6R CYSTEKEC | Alldatasheet

Document overview

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  • PDF pages: 6

Technical content

Features

  • Two BF422 chips in a SOT-363 package.
  • Mounting possible with SOT-323 automatic mounting machines.
  • Transistor elements are independent, eliminating interference.
  • Mounting cost and area can be cut in half.
  • High BVCEO, BVCEO≧300V
  • Pb-free lead plating and halogen-free package. Equivalent Circuit Outline HBN3101S6R Tr2 Tr1 SOT-363

Ordering Information

(Pb-free lead plating and halogen-free package) 3000 pcs / tape & reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name

CYStech Electronics Corp. Spec. No. : C234S6R Issued Date : 2013.10.21 Revised Date : Page No. : 2/6 HBN3101S6R CYStek Product Specification The following characteristics apply to both Tr1 and Tr2 Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit Collector-Base V oltage VCBO 300 V Collector-Emitter V oltage VCEO 300 V Emitter-Base V oltage VEBO 5 V Collector Current (DC) IC 100 mA Collector Current (Pulse) ICP 300 (Note 1) mA Power Dissipation Pd 200 (total) (Note 2) mW Junction Temperature Tj 150 °C Storage Temperature Tstg -55~+150 °C Note : 1.Single pulse, Pw=10ms 2.150mW per element must not be exceeded. Characteristics (Ta=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO 300 - - V IC=100µA BVCEO 300 - - V IC=1mA BVEBO 5 - - V IE=10µA ICBO - - 100 nA IE=0, VCB=300V IEBO - - 100 nA VEB=5V , IC=0 *VCE(sat) - - 300 mV IC=30mA, IB=3mA *VBE(sat) - - 900 mV IC=30mA, IB=3mA *hFE1 100 - 250 - VCE=5V , IC=10mA *hFE2 15 - - - VCE=5V , IC=50mA fT 60 - - MHz VCE=10V , IC=10mA, f=100MHz Cob - - 15 pF VCB=10V , f=1MHz *Pulse Test : Pulse Width ≤380μs, Duty Cycle≤2%

CYStech Electronics Corp. Spec. No. : C234S6R Issued Date : 2013.10.21 Revised Date : Page No. : 3/6 HBN3101S6R CYStek Product Specification Typical Characteristics Current Gain vs Collector Current 100 1000 1 10 100 Collector Current---IC(mA) Current Gain---HFE VCE = 5V VCE = 10V VCE = 20V Saturation Voltage vs Collector Current 100 1000 10000 1 10 100 Collector Current---IC(mA) Saturation Voltage---(mV)VCE(SAT) @ IC = 10IB VCE(SAT) @ IC = 20IB Saturation Voltage vs Collector Current 100 1000 1 10 100 Collector Current---IC(mA) Saturation Voltage---(mV) VBE(SAT) @ IC =10IB Power Derating Curves 100 150 200 250 0 50 100 150 200 Ambient Temperature---TA(℃) Power Dissipation---PD(mW) Dual Single Recommended Soldering Footprint

CYStech Electronics Corp. Spec. No. : C234S6R Issued Date : 2013.10.21 Revised Date : Page No. : 4/6 HBN3101S6R CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C234S6R Issued Date : 2013.10.21 Revised Date : Page No. : 5/6 HBN3101S6R CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C234S6R Issued Date : 2013.10.21 Revised Date : Page No. : 6/6 HBN3101S6R CYStek Product Specification SOT-363 Dimension Marking: Date Code: Year + Month Year : 6→2006, 7→2007,…, etc Month : 1→Jan →Feb, …, 9 → Sep, A→Oct, B →Nov, C→Dec D 2.000 2.200 0.079 0.087 θ 0° 8° 0° 8° E 1.150 1.350 0.045 0.053 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :

  • Lead : Pure tin plated.
  • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. 6-Lead SOT-363 Plastic Surface Mounted Package CYStek Package Code: S6R Style: Pin 1. Emitter1 (E1) Pin 2. Base1 (B1) Pin 3. Collector2 (C2) Pin 4. Emitter2 (E2) Pin 5. Base2 (B2) ctor1 (C1) Pin 6. Colle Device Code K4N