HBC3906S6R CYSTEKEC | Alldatasheet

Document overview

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  • PDF pages: 8

Technical content

Features

  • Two BTC3906 chips in a SOT-363 package.
  • Mounting possible with SOT-323 automatic mounting machines.
  • Transistor elements are independent, eliminating interference.
  • Mounting cost and area can be cut in half.
  • Complementary to HBA1514S6R.
  • Pb-free lead plating and halogen-free package. Symbol Outline

Ordering Information

(Pb-free lead plating and halogen-free package) 3000 pcs / tape & reel HBC3906S6R SOT-363 B：Base C：Collector E：Emitter Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name

CYStech Electronics Corp. Spec. No. : C208S6R Issued Date : 2016.09.05 Revised Date : Page No. : 2/8 HBC3906S6R CYStek Product Specification Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit Collector-Base V oltage VCBO 180 V Collector-Emitter V oltage VCEO 160 V Emitter-Base V oltage VEBO 6 V Collector Current IC 600 mA Power Dissipation (TA=25°C) PD 200 mW Thermal Resistance, Junction to Ambient RθJA 625 °C/W Operating Junction Temperature Range Tj -55~+150 °C Storage Temperature Range Tstg -55~+150 °C Characteristics (Ta=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO 180 - - V IC=100μA BVCEO 160 - - V IC=1mA BVEBO 6 - - V IE=10μA ICBO - - 50 nA VCB=120V IEBO - - 50 nA VEB=4V *VCE(sat)1 - 0.1 0.15 V IC=10mA, IB=1mA *VCE(sat)2 - - 0.2 V IC=50mA, IB=5mA *VBE(sat)1 - - 1 V IC=10mA, IB=1mA *VBE(sat)2 - - 1 V IC=50mA, IB=5mA *hFE1 100 - - - VCE=5V , IC=1mA *hFE2 100 - - - VCE=5V , IC=10mA *hFE3 50 - - - VCE=5V , IC=50mA *hFE4 120 - 270 - VCE=6V , IC=2mA fT 100 - - MHz VCE=20V , IC=10mA, f=100MHz Cob - - 6 pF VCB=20V , IE=0A,f=1MHz *Pulse Test: Pulse Width ≤380us, Duty Cycle≤2%

CYStech Electronics Corp. Spec. No. : C208S6R Issued Date : 2016.09.05 Revised Date : Page No. : 3/8 HBC3906S6R CYStek Product Specification Typical Characteristics Emitter Grounded Output Characteristics 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0123456 Collector-to-Emitter Voltage---VCE(V) Collector Current---IC(A) 200uA 300uA 400uA 500uA 1mA IB=100uA Emitter Grounded Output Characteristics 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 0123456 Collector-to-Emitter Voltage---VCE(V) Collector Current---IC(A) 1mA 1.5mA 2mA 2.5mA 5mA IB=500uA Current Gain vs Collector Current 100 1000 0.1 1 10 100 Collector Current---IC(mA) Current Gain---HFE Ta=125°C Ta=75°C Ta=25°C Ta=0°C Ta=-40°C VCE=5V Saturation Voltage vs Collector Current 100 1000 1 10 100 Collector Current---IC(mA) Saturation Voltage---(mV) Ta=125°C Ta=75°C Ta=25°C Ta=0°C Ta=-40°C VCESAT=10IB Saturation Voltage vs Collector Current 100 1000 10000 0.1 1 10 100 Collector Current---IC(mA) Saturation Voltage---(mV) Ta=125°C Ta=75°C Ta=25°C Ta=0°C Ta=-40°C VCESAT=50IB On Voltage vs Collector Current 100 1000 10000 1 10 100 Collector Current---IC(mA) On Voltage---(mV) VBEON@VCE=6V Ta=-40°C Ta=0°C Ta=25°C Ta=75°C Ta=125°C

CYStech Electronics Corp. Spec. No. : C208S6R Issued Date : 2016.09.05 Revised Date : Page No. : 4/8 HBC3906S6R CYStek Product Specification Typical Characteristics(Cont.) Saturation Voltage vs Collector Current 100 1000 10000 1 10 100 Collector Current---IC(mA) Saturation Voltage---(mV) VBESAT@IC=10IB Ta=-40°C Ta=0°C Ta=25°C Ta=75°C Ta=125°C Current Gain vs Collector Current 100 1000 0.1 1 10 100 Collector Current--- IC(mA) Current Gain---HFE VCE=5V VCE=1V VCE=2V Cutoff Frequency vs Collector Current 100 1000 0.1 1 10 100 Collector Current---IC(mA) Cutoff Frequency---fT(MHz) VCE=10V Capacitance vs Reverse-biased Voltage 100 0.1 1 10 100 Reverse-biased Voltage---VR(V) Capacitance---(pF) Cib Cob Power Derating Curves 100 150 200 250 0 50 100 150 200 Ambient Temperature --- Ta(℃ ) Power Dissipation---PD(mW) Dual Single

CYStech Electronics Corp. Spec. No. : C208S6R Issued Date : 2016.09.05 Revised Date : Page No. : 5/8 HBC3906S6R CYStek Product Specification Recommended Soldering Footprint

CYStech Electronics Corp. Spec. No. : C208S6R Issued Date : 2016.09.05 Revised Date : Page No. : 6/8 HBC3906S6R CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C208S6R Issued Date : 2016.09.05 Revised Date : Page No. : 7/8 HBC3906S6R CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C208S6R Issued Date : 2016.09.05 Revised Date : Page No. : 8/8 HBC3906S6R CYStek Product Specification SOT-363 Dimension 6-Lead SOT-363 Plastic Surface Mounted Package CYStek Package Code: S6R Style: Pin 1. Emitter1 (E1) Pin 2. Base1 (B1) Pin 3. Collector2 (C2) Pin 4. Emitter2 (E2) Pin 5. Base2 (B2) Pin 6. Collector1 (C1) Marking: Device Code XX Date Code: Year + Month Year : 6→2006, 7→2007,…, etc Month : 1→Jan 2→Feb, …, 9 → Sep, A→Oct, B →Nov, C→Dec D 2.000 2.200 0.079 0.087 θ 0° 8° 0° 8° E 1.150 1.350 0.045 0.053 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :

  • Lead : Pure tin plated.
  • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.