HBAT-5400 AVAGO | Alldatasheet

Document overview

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Technical content

Features

  • Ultra-low Series Resistance for Higher Current Handling
  • Low Capacitance
  • Low Series Resistance
  • Lead-free Option Available

Applications

RF and computer designs that require circuit protection, high-speed switching, and voltage clamping. Package Lead Code Identification (Top View)

Description

The HBAT-540x series of Schottky diodes, commonly referred to as clipping /clamping diodes, are optimal for circuit and waveshape preservation applications with high speed switching. Low series resistance, RS, makes them ideal for protecting sensitive circuit elements against high current transients carried on data lines. With picosecond switching, the HBAT-540x can respond to noise spikes with rise times as fast as 1 ns. Low capaci- tance minimizes waveshape loss that causes signal deg- radation. SERIES 2, C SINGLE 0, B1 2 1 2 COMMON□ CATHODE F COMMON□ ANODE E1 2 1 2

Absolute Maximum Ratings, T A= 25ºC Symbol Parameter Unit Absolute Maximum[1] HBAT-5400/-5402 HBAT-540B/-540C I F DC Forward Current mA 0 430 I F- peak Peak Surge Current (1µs pulse) A 1.0 1.0 P T Total Power Dissipation mW 50 85 P INV Peak Inverse Voltage V 30 30 T J Junction Temperature °C 150 150 T STG Storage Temperature °C -65 to 150 -65 to 150 θJC Thermal Resistance, junction to lead °C/W 500 150 Note: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. RS 0.08 pF SPICE model 2 nH Linear and Non-linear SPICE Model [2] Parameter Unit Value BV V 40 CJO pF 3.0 EG eV 0.55 IBV A 10E-4 IS A 1.0E-7 N 1.0 RS Ω .4 PB V 0.6 PT M 0.5 SPICE Parameters Note: . To effectively model the packaged HBAT-540x product, please refer to HBAT-540x DC Electrical Specifications, T A = +25°C [1] Maximum Minimum Typical Maximum Part Package Forward Breakdown Typical Series Eff. Carrier Number Marking Lead Voltage Voltage Capacitance Resistance Lifetime HBAT- Code[2] Code Configuration Package VF (mV) VBR (V) C T (pF) RS (Ω) t (ps) -5400 Single SOT-3 -540B B SOT-33 (3-lead SC-70) -540 SOT-3 -540C V C Series SOT-33 (3-lead SC-70) Notes: 1. TA = +5°C, where TA is defined to be the temperature at the package pins where contact is made to the circuit board. . Package marking code is laser marked. 3. IF = 100 mA; 100% tested 4. IR = 100 µA; 100% tested 5. VF = 0; f =1 MHz 6. Measured with Karkauer method at 0 mA guaranteed by design.

Tape Dimensions and Product Orientation For Outline SOT-23 e B C E XXX L D A Notes: XXX-package marking Drawings are not to scale DIMENSIONS (mm) MIN. 0.79 0.000 0.37 0.086 2.73 1.15 0.89 1.78 0.45 2.10 0.45 MAX. 1.20 0.100 0.54 0.152 3.13 1.50 1.02 2.04 0.60 2.70 0.69 SYMBOL A B C D e E L 9° MAX P D P2 E F W Ko 8° MAX 13.5° MAX DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER P 3.15 ± 0.10 2.77 ± 0.10 1.22 ± 0.10 4.00 ± 0.10 1.00 + 0.05 0.124 ± 0.004 0.109 ± 0.004 0.048 ± 0.004 0.157 ± 0.004 0.039 ± 0.002 CAVITY DIAMETER PITCH POSITION D E 1.50 + 0.10 4.00 ± 0.10 1.75 ± 0.10 0.059 + 0.004 0.157 ± 0.004 0.069 ± 0.004 PERFORATION WIDTH THICKNESS W 8.00 + 0.30 – 0.10 0.229 ± 0.013 0.315 + 0.012 – 0.004 0.009 ± 0.0005 CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) F 3.50 ± 0.05 2.00 ± 0.05 0.138 ± 0.002 0.079 ± 0.002 DISTANCE BETWEEN CENTERLINE Recommended PCB Pad Layout for Avago’s SOT-23 Products 0.039 0.039 0.079 2.0 0.031 0.8 Dimensions in inches mm 0.035 0.9

Outline SOT-323 (SC-70 3 Lead) Tape Dimensions and Product Orientation For Outline SOT-323 (SC-70 3 Lead) e B C E XXX L D A Notes: XXX-package marking Drawings are not to scale DIMENSIONS (mm) MIN. 0.80 0.00 0.15 0.10 1.80 1.10 1.80 MAX. 1.00 0.10 0.40 0.20 2.25 1.40 2.40 SYMBOL A B C D e E L 1.30 typical 0.65 typical 0.425 typical P F W C D E 8° MAX. t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS) 8° MAX. DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER P 2.40 ± 0.10 2.40 ± 0.10 1.20 ± 0.10 4.00 ± 0.10 1.00 + 0.25 0.094 ± 0.004 0.094 ± 0.004 0.047 ± 0.004 0.157 ± 0.004 0.039 + 0.010 CAVITY DIAMETER PITCH POSITION D E 1.55 ± 0.05 4.00 ± 0.10 1.75 ± 0.10 0.061 ± 0.002 0.157 ± 0.004 0.069 ± 0.004 PERFORATION WIDTH THICKNESS W 8.00 ± 0.30 0.254 ± 0.02 0.315 ± 0.012 0.0100 ± 0.0008 CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) F 3.50 ± 0.05 2.00 ± 0.05 0.138 ± 0.002 0.079 ± 0.002 DISTANCE WIDTH TAPE THICKNESS C Tt 5.4 ± 0.10 0.062 ± 0.001 0.205 ± 0.004 0.0025 ± 0.00004 COVER TAPE Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323 Products 0.026 0.039 0.079 0.022 Dimensions in inches

metal is called a Schottky barrier. IF, will increase rapidly as VF increases. voltage, and the temperature. the Schottky diode is carried only by majority carriers. frequencies of 50 GHz and higher. of 0.6 V in p-n junction diodes. See Figure 6. Table 1. HBAT-540x and HSMS-270x SPICE Parameters. ity. The trade-off is a higher value of junction capacitance.

Part Number Ordering Information Part Number No. of Devices Container HBAT-5400-BLKG 100 Antistatic Bag HBAT-5400-TR1G 3,000 7" Reel HBAT-5400-TRG 10,000 13" Reel HBAT-540-BLKG 100 Antistatic Bag HBAT-540-TR1G 3,000 7" Reel HBAT-540-TRG 10,000 13" Reel HBAT-540B-BLKG 100 Antistatic Bag HBAT-540B-TR1G 3,000 7" Reel HBAT-540B-TRG 10,000 13" Reel HBAT-540C-BLKG 100 Antistatic Bag HBAT-540C-TR1G 3,000 7" Reel HBAT-540C-TRG 10,000 13" Reel For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4779EN AV02-1394EN - July 4, 2008 The key factors in these equations are: RS, the series resis- tance of the diode where heat is generated under high current conditions; θchip, the chip thermal resistance of the Schottky die; and θpackage, or the package thermal resistance. RS for the HBAT-540x family of diodes is typically .4Ω, other than the HSMS-70x family, this is the lowest of any Schottky diode available. Chip thermal resistance is typically 40°C/W; the thermal resistance of the iron-alloy- leadframe, SOT-3 package is typically 460°C/W; and the thermal resistance of the copper-leadframe, SOT-33 package is typically 110°C/W. The impact of package thermal resistance on the current handling capability of these diodes can be seen in Figures 3 and 4. Here the computed values of junction temperature vs. forward current are shown for three values of ambient tempera- ture. The SOT-33 products, with their copper leadframes, can safely handle almost twice the current of the larger SOT-3 diodes. Note that the term “ambient temperature” refers to the temperature of the diode’s leads, not the air around the circuit board. It can be seen that the HBAT- 540B and HBAT-540C products in the SOT-33 package will safely withstand a steady-state forward current of 330 mA when the diode’s terminals are maintained at 75°C. For pulsed currents and transient current spikes of less than one microsecond in duration, the junction does not have time to reach thermal steady state. Moreover, the diode junction may be taken to temperatures higher than 150°C for short timeperiods without impacting device MTTF. Because of these factors, higher currents can be safely handled. The HBAT-540x family has the second highest current handling capability of any Avago diode, next to the HSMS-70x series.