HBAS16 HSMC | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 3
Technical content
Features
- Small SMD Package (SOT-23)
- Low Forward Voltage
- Fast Reverse Recovery Time
- Small Total Capacitance Absolute Maximum Ratings
- Maximum Temperatures
- Maximum Power Dissipation
- Maximum Voltages and Currents (Ta=25°C) Characteristics (Ta=25°C) Characteristic Symbol Condition Min Max. Unit Reverse Breakdown Voltage V(BR) IR=100uA 75 - V VF(1) IF=1mA - 715 MV VF(2) IF=10mA - 855 mV VF(3) IF=50mA - 1000 mVForward Voltage VF(4) IF=150mA - 1250 mV Reverse Current IR VR=75V - 1 uA Total Capacitance CT VR=0, f=1MHZ - 2 pF Reverse Recovery Time Trr IF=IR=10mA, RL=100Ω, measured at IR=1mA -6 n S SOT-23
MICROELECTRONICS CORP. Spec. No. : HE6833 Issued Date : 1994.05.27 Revised Date : 2002.10.24 Page No. : 2/3 HBAS16 HSMC Product Specification Characteristics Curve Forward Biased Voltage & Forward Current 150 300 450 0 500 1000 1500 2000 Forward Biased Voltage-VF (mV) Current-IF (mA) Capacitance & Reverse-Biased Voltage 0.1 0.1 1 10 100 Reverse Biased Voltage-VR (V) Capacitance-Cd (pF)
MICROELECTRONICS CORP. Spec. No. : HE6833 Issued Date : 1994.05.27 Revised Date : 2002.10.24 Page No. : 3/3 HBAS16 HSMC Product Specification SOT-23 Dimension *: Typical H 0.0005 0.0040 0.013 0.10 Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material:
- Lead: 42 Alloy; solder plating
- Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
- All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
- HSMC reserves the right to make changes to its products without notice.
- HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
- HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Tel: 886-3-5983621~5 Fax: 886-3-5982931 H JKD A L GV C B S Style: Pin 1.Anode 2.NC 3.Cathode 3-Lead SOT-23 Plastic Surface Mounted Package Marking: Rank Code A 6 Control Code Diagram: