HBA8573S6R CYSTEKEC | Alldatasheet

Document overview

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  • PDF pages: 6

Technical content

Features

  • Two BTA1037 chips in a SOT-363R package.
  • Mounting possible with SOT-323 automatic mounting machines.
  • Transistor elements are independent, eliminating interference.
  • Mounting cost and area can be cut in half.
  • Excellent hFE linearity.
  • Pb-free package. Equivalent Circuit Outline HBA8573S6R SOT-363R Tr1 Tr2 The following characteristics apply to both Tr1 and Tr2 Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit Collector-Base V oltage VCBO -60 V Collector-Emitter V oltage VCEO -50 V Emitter-Base V oltage VEBO -6 V Collector Current IC -150 mA Power Dissipation PD 200(total) *1 mW Junction Temperature Tj 150 °C Storage Temperature Tstg -55~+150 °C Note : *1 150mW per element must not be exceeded

CYStech Electronics Corp. Spec. No. : C306S6R Issued Date : 2010.03.22 Revised Date : 2011.02.22 Page No. : 2/6 HBA8573S6R CYStek Product Specification Characteristics (Ta=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO -60 - - V IC=-50μA BVCEO -50 - - V IC=-1mA BVEBO -6 - - V IE=-50μA ICBO - - -0.1 μA VCB=-60V IEBO - - -0.1 μA VEB=-6V *VCE(sat) - -0.2 -0.5 V IC=-50mA, IB=-5mA *hFE 120 - 820 VCE=-6V , IC=-1mA fT 80 180 - MHz VCE=-10V , IC=-1mA, f=100MHz Cob - 2 3.5 pF VCB=-10V , f=1MHz *Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2%

Ordering Information

Device Package Shipping Marking HBA8573S6R SOT-363 (Pb-free) 3000 pcs / Tape & Reel BL

CYStech Electronics Corp. Spec. No. : C306S6R Issued Date : 2010.03.22 Revised Date : 2011.02.22 Page No. : 3/6 HBA8573S6R CYStek Product Specification Characteristic Curves Current Gain vs Collector Current 100 1000 0.1 1 10 100 1000 Collector Current---IC(mA) Current Gain---HFE HFE@VCE=6V Saturation Voltage vs Collector Current 100 1000 0.1 1 10 100 1000 Collector Current---IC(mA) Saturation Voltage---(mV) VCE(SAT)@IC=10IB Saturation Voltage vs Collector Current 100 1000 10000 0.1 1 10 100 1000 Collector Current---IC(mA) Saturation Voltage---(mV) VBE(SAT)@IC=10IB Cutoff Frequency vs Collector Current 0.1 1 10 100 Collector Current---IC(mA) Cutoff Frequency---FT(GHZ) FT@VCE=12V Power Derating Curves 100 150 200 250 0 50 100 150 200 Ambient Temperature --- Ta(℃ ) Power Dissipation---PD(mW) dual single

CYStech Electronics Corp. Spec. No. : C306S6R Issued Date : 2010.03.22 Revised Date : 2011.02.22 Page No. : 4/6 HBA8573S6R CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C306S6R Issued Date : 2010.03.22 Revised Date : 2011.02.22 Page No. : 5/6 HBA8573S6R CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max.

CYStech Electronics Corp. Spec. No. : C306S6R Issued Date : 2010.03.22 Revised Date : 2011.02.22 Page No. : 6/6 HBA8573S6R CYStek Product Specification SOT-363 Dimension Marking: Date Code: Year + Month Year : 6→2006, 7→2007,…, etc Month : 1→Jan →Feb, …, 9 → Sep, A→Oct, B →Nov, C→Dec D 2.000 2.200 0.079 0.087 θ 0° 8° 0° 8° E 1.150 1.350 0.045 0.053 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :

  • Lead : Pure tin plated.
  • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. 6-Lead SOT-363R Plastic Surface Mounted Package CYStek Package Code: S6R Style: Pin 1. Emitter1 (E1) Pin 2. Emitter1/Emitter (E1/E2) Pin 3. Collector2 (C2) Pin 4. Base2 (B2) Pin 5. Base1 (B1) ctor1 (C1) Pin 6. Colle Device Code BL