HB54A2569F1-10B

HB54A2569F1 ELPIDA | Alldatasheet

Document overview

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Technical content

Features

• 184-pin socket type package (dual lead out)  Outline: 133.35mm (Length) × 43.18mm (Height) × 4.00mm (Thickness)  Lead pitch: 1.27mm
• 2.5V power supply (VCC/VCCQ)
• SSTL-2 interface for all inputs and outputs
• Clock frequency: 143MHz/133MHz/125MHz (max.)
• Data inputs, outputs and DM are synchronized with DQS
• 4 banks can operate simultaneously and independently (Component)
• Burst read/write operation
• Programmable burst length: 2, 4, 8  Burst read stop capability
• Programmable burst sequence  Sequential  Interleave
• Start addressing capability  Even and Odd
• Programmable /CAS latency (CL): 3, 3.5
• 8192 refresh cycles: 7.8µs (8192/64ms)
• 2 variations of refresh  Auto refresh  Self refresh

HB54A2569F1, HB54A5129F2 Data Sheet E0091H40 (Ver. 4.0)

Ordering Information

MHz (max.) /CAS latency Package Contact pad HB54A2569F1-A75B*1 HB54A2569F1-B75B*2 HB54A2569F1-10B*3 133 133 100 3.0 3.5 3.0 184-pin dual lead out socket type Gold HB54A5129F2-A75B*1 HB54A5129F2-B75B*2 HB54A5129F2-10B*3 133 133 100 3.0 3.5 3.0 Notes: 1. 143MHz operation at /CAS latency = 3.5. 2. 100MHz operation at /CAS latency = 3.0. 3. 125MHz operation at /CAS latency = 3.5. Pin Configurations 1 pin Front side Back side 52 pin 53 pin 92 pin 93 pin 144 pin 145 pin 184 pin Pin No. Pin name Pin No. Pin name Pin No. Pin name Pin No. Pin name

1 VREF 47 DQS8 93 VSS 139 VSS

2 DQ0 48 A0 94 DQ4 140 DM8/DQS17

3 VSS 49 CB2 95 DQ5 141 A10

4 DQ1 50 VSS 96 VCCQ 142 CB6

5 DQS0 51 CB3 97 DM0/DQS9 143 VCCQ

6 DQ2 52 BA1 98 DQ6 144 CB7

7 VCC 53 DQ32 99 DQ7 145 VSS

8 DQ3 54 VCCQ 100 VSS 146 DQ36

9 NC 55 DQ33 101 NC 147 DQ37

10 /RESET 56 DQS4 102 NC 148 VCC

11 VSS 57 DQ34 103 NC 149 DM4/DQS13

12 DQ8 58 VSS 104 VCCQ 150 DQ38

13 DQ9 59 BA0 105 DQ12 151 DQ39

14 DQS1 60 DQ35 106 DQ13 152 VSS

15 VCCQ 61 DQ40 107 DM1/DQS10 153 DQ44

16 NC 62 VCCQ 108 VCC 154 /RAS

17 NC 63 /WE 109 DQ14 155 DQ45

18 VSS 64 DQ41 110 DQ15 156 VCCQ

19 DQ10 65 /CAS 111 CKE1 (NC)* 1 157 /S0

20 DQ11 66 VSS 112 VCCQ 158 /S1 (NC)* 1

21 CKE0 67 DQS5 113 NC 159 DM5/DQS14

22 VCCQ 68 DQ42 114 DQ20 160 VSS

23 DQ16 69 DQ43 115 A12 161 DQ46

24 DQ17 70 VCC 116 VSS 162 DQ47

25 DQS2 71 NC 117 DQ21 163 NC

26 VSS 72 DQ48 118 A11 164 VCCQ

HB54A2569F1, HB54A5129F2 Data Sheet E0091H40 (Ver. 4.0) Pin No. Pin name Pin No. Pin name Pin No. Pin name Pin No. Pin name

27 A9 73 DQ49 119 DM2/DQS11 165 DQ52

28 DQ18 74 VSS 120 VCC 166 DQ53

29 A7 75 NC 121 DQ22 167 NC

30 VCCQ 76 NC 122 A8 168 VCC

31 DQ19 77 VCCQ 123 DQ23 169 DM6/DQS15

32 A5 78 DQS6 124 VSS 170 DQ54

33 DQ24 79 DQ50 125 A6 171 DQ55

34 VSS 80 DQ51 126 DQ28 172 VCCQ

35 DQ25 81 VSS 127 DQ29 173 NC

36 DQS3 82 VCCID 128 VCCQ 174 DQ60

37 A4 83 DQ56 129 DM3/DQS12 175 DQ61

38 VCC 84 DQ57 130 A3 176 VSS

39 DQ26 85 VCC 131 DQ30 177 DM7/DQS16

40 DQ27 86 DQS7 132 VSS 178 DQ62

41 A2 87 DQ58 133 DQ31 179 DQ63

42 VSS 88 DQ59 134 CB4 180 VCCQ

43 A1 89 VSS 135 CB5 181 SA0

44 CB0 90 NC 136 VCCQ 182 SA1

45 CB1 91 SDA 137 CK0 183 SA2

46 VCC 92 SCL 138 /CK0 184 VCCSPD

Note: 1. The HB54A2569F1 assign “NC”.

HB54A2569F1, HB54A5129F2 Data Sheet E0091H40 (Ver. 4.0) Pin Description Pin name Function A0 to A12 Address input Row address A0 to A12 Column address A0 to A9 BA0, BA1 Bank select address DQ0 to DQ63 Data input/output CB0 to CB7 Check bit (Data input/output) /RAS Row address strobe command /CAS Column address strobe command /WE Write enable /S0, /S1 Chip select CKE0, CKE1 Clock enable CK0 Clock input /CK0 Differential clock input DQS0 to DQS8 Input and output data strobe DM0 to DM8/DQS9 to DQS17 Input mask SCL Clock input for serial PD SDA Data input/output for serial PD SA0 to SA2 Serial address input VCC Power for internal circuit VCCQ Power for DQ circuit VCCSPD Power for serial EEPROM VREF Input reference voltage VSS Ground VCCID VCC identification flag /RESET Reset pin (forces register inputs low) NC No connection

HB54A2569F1, HB54A5129F2 Data Sheet E0091H40 (Ver. 4.0) Serial PD Matrix*1 Byte No. Function described Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value Comments

0 Number of bytes utilized by module

manufacturer 1 0 0 0 0 0 0 0 80H 128

1 Total number of bytes in serial PD

device 0 0 0 0 1 0 0 0 08H 256 bytes

2 Memory type 0 0 0 0 0 1 1 1 07H SDRAM DDR

3 Number of row address 0 0 0 0 1 1 0 1 0DH 13

4 Number of column address 0 0 0 0 1 0 1 0 0AH 10

5 Number of DIMM banks

HB54A2569F1 0 0 0 0 0 0 0 1 01H 1 HB54A5129F2 0 0 0 0 0 0 1 0 02H 2

6 Module data width 0 1 0 0 1 0 0 0 48H 72 bits

7 Module data width continuation 0 0 0 0 0 0 0 0 00H 0 (+)

8 Voltage interface level of this assembly 0 0 0 0 0 1 0 0 04H SSTL 2.5V

9 DDR SDRAM cycle time, CL = X

-A75B 0 1 1 1 0 0 0 0 70H CL = 2.5* 5 -B75B 0 1 1 1 0 1 0 1 75H -10B 1 0 0 0 0 0 0 0 80H

10 SDRAM access from clock (tAC)

-A75B, -B75B 0 1 1 1 0 1 0 1 75H 0.75ns* 5 -10B 1 0 0 0 0 0 0 0 80H 0.8ns* 5

11 DIMM configuration type 0 0 0 0 0 0 1 0 02H ECC

12 Refresh rate/type 1 0 0 0 0 0 1 0 82H 7.8 µs Self refresh

13 Primary SDRAM width 0 0 0 0 1 0 0 0 08H × 8

14 Error checking SDRAM width 0 0 0 0 1 0 0 0 08H × 8

SDRAM device attributes: Minimum clock delay back-to-back column access 0 0 0 0 0 0 0 1 01H 1 CLK

16 SDRAM device attributes:

Burst length supported 0 0 0 0 1 1 1 0 0EH 2, 4, 8

17 SDRAM device attributes: Number of

banks on SDRAM device 0 0 0 0 0 1 0 0 04H 4

18 SDRAM device attributes:

/CAS latency 0 0 0 0 1 1 0 0 0CH 2, 2.5

19 SDRAM device attributes:

/CS latency 0 0 0 0 0 0 0 1 01H 0

20 SDRAM device attributes:

/WE latency 0 0 0 0 0 0 1 0 02H 1

21 SDRAM module attributes 0 0 1 0 0 1 1 0 26H Registered

22 SDRAM device attributes: General 1 1 0 0 0 0 0 0 C0H ± 0.2V Minimum clock cycle time at CLX - 0.5 -A75B 0 1 1 1 0 1 0 1 75H CL = 2* 5 -B75B/10B 1 0 1 0 0 0 0 0 A0H Maximum data access time (tAC) from clock at CLX - 0.5 -A75B, -B75B 0 1 1 1 0 1 0 1 75H 0.75ns* -10B 1 0 0 0 0 0 0 0 80H 0.8ns* 5

25 Minimum clock cycle time at

CLX - 1 0 0 0 0 0 0 0 0 00H

26 Maximum data access time (tAC) from

clock at CLX - 1 0 0 0 0 0 0 0 0 00H

HB54A2569F1, HB54A5129F2 Data Sheet E0091H40 (Ver. 4.0) Byte No. Function described Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value Comments

27 Minimum row precharge time (tRP) 0 1 0 1 0 0 0 0 50H 20ns

28 Minimum row active to row active

delay (tRRD) 0 0 1 1 1 1 0 0 3CH 15ns

29 Minimum /RAS to /CAS delay (tRCD) 0 1 0 1 0 0 0 0 50H 20ns

Minimum active to precharge time (tRAS) -A75B, -B75B 0 0 1 0 1 1 0 1 2DH 45ns -10B 0 0 1 1 0 0 1 0 32H 50ns

31 Module bank density 0 1 0 0 0 0 0 0 40H 256MB

Address and command setup time before clock (tIS) -A75B, -B75B 1 0 0 1 0 0 0 0 90H 0.9ns* -10B 1 0 1 1 0 0 0 0 B0H 1.1ns* 5 Address and command hold time after clock (tIH) -A75B, -B75B 1 0 0 1 0 0 0 0 90H 0.9ns* 5 -10B 1 0 1 1 0 0 0 0 B0H 1.1ns* 5 Data input setup time before clock (tDS) -A75B, -B75B 0 1 0 1 0 0 0 0 50H 0.5ns* 5 -10B 0 1 1 0 0 0 0 0 60H 0.6ns* 5

35 Data input hold time after clock (tDH)

-A75B, -B75B 0 1 0 1 0 0 0 0 50H 0.5ns* 5 -10B 0 1 1 0 0 0 0 0 60H 0.6ns* 5 36 to 40 Superset information 0 0 0 0 0 0 0 0 00H Future use

41 Active command period (tRC)

-A75B, -B75B 0 1 0 0 0 0 0 1 41H 65ns* 5 -10B 0 1 0 0 0 1 1 0 46H 70ns* 5 Auto refresh to active/Auto refresh command cycle (tRFC) -A75B, -B75B 0 1 0 0 1 0 1 1 4BH 75ns* 5 -10B 0 1 0 1 0 0 0 0 50H 80ns* 5 43 SDRAM tCK cycle max. (tCK max.) 0 0 1 1 0 0 0 0 30H 12ns* 5

44 Dout to DQS skew

-A75B, -B75B 0 0 1 1 0 0 1 0 32H 500ps* 5 -10B 0 0 1 1 1 1 0 0 3CH 600ps* 5

45 Data hold skew (tQHS)

-A75B, -B75B 0 1 1 1 0 1 0 1 75H 750ps* 5 -10B 1 0 1 0 0 0 0 0 A0H 1000ps* 5 46 to 61 Superset information 0 0 0 0 0 0 0 0 00H Future use

62 SPD revision 0 0 0 0 0 0 0 0 00H Initial

63 Checksum for bytes 0 to 62

HB54A2569F1-A75B 1 1 0 0 1 0 1 0 CAH 202 HB54A2569F1-B75B 1 1 1 1 1 0 1 0 FAH 250 HB54A2569F1-10B 1 0 1 1 1 1 1 1 BFH 191 HB54A5129F2-A75B 1 1 0 0 1 0 1 1 CBH 203 HB54A5129F2-B75B 1 1 1 1 1 0 1 1 FBH 251 HB54A5129F2-10B 1 1 0 0 0 0 0 0 C0H 192

64 Manufacturer’s JEDEC ID code 0 0 0 0 0 1 1 1 07H HITACHI

65 to 71 Manufacturer’s JEDEC ID code 0 0 0 0 0 0 0 0 00H

72 Manufacturing location × × × × × × × × ×× *2 (ASCII-8bit

code)

HB54A2569F1, HB54A5129F2 Data Sheet E0091H40 (Ver. 4.0) Byte No. Function described Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value Comments

73 Module part number 0 1 0 0 1 0 0 0 48H H

74 Module part number 0 1 0 0 0 0 1 0 42H B

75 Module part number 0 0 1 1 0 1 0 1 35H 5

76 Module part number 0 0 1 1 0 1 0 0 34H 4

77 Module part number 0 1 0 0 0 0 0 1 41H A

78 Module part number

HB54A2569F1 0 0 1 1 0 0 1 0 32H 2 HB54A5129F2 0 0 1 1 0 1 0 1 35H 5

79 Module part number

HB54A2569F1 0 0 1 1 0 1 0 1 35H 5 HB54A5129F2 0 0 1 1 0 0 0 1 31H 1

80 Module part number

HB54A2459F1 0 0 1 1 0 1 1 0 36H 6 HB54A5129F2 0 0 1 1 0 0 1 0 32H 2

81 Module part number 0 0 1 1 1 0 0 1 39H 9

82 Module part number 0 1 0 0 0 1 1 0 46H F

83 Module part number

HB54A2569F1 0 0 1 1 0 0 0 1 31H 1 HB54A5129F2 0 0 1 1 0 0 1 0 32H 2

84 Module part number 0 0 1 0 1 1 0 1 2DH —

85 Module part number

-A75B 0 1 0 0 0 0 0 1 41H A -B75B 0 1 0 0 0 0 1 0 42H B -10B 0 0 1 1 0 0 0 1 31H 1

86 Module part number

-A75B, -B75B 0 0 1 1 0 1 1 1 37H 7 -10B 0 0 1 1 0 0 0 0 30H 0

87 Module part number

-A75B, -B75B 0 0 1 1 0 1 0 1 35H 5 -10B 0 1 0 0 0 0 1 0 42H B

88 Module part number

-A75BB, -B75B 0 1 0 0 0 0 1 0 42H B -10B 0 0 1 0 0 0 0 0 20H (Space) 89 to 90 Module part number 0 0 1 0 0 0 0 0 20H (Space)

93 Manufacturing date × × × × × × × × ×× Year code

(BCD)

94 Manufacturing date × × × × × × × × ×× Week code

(BCD) 95 to 98 Module serial number * 3 99 to 127 Manufacturer specific data * 4 Notes: 1. All serial PD data are not protected. 0: Serial data, “driven Low”, 1: Serial data, “driven High” These SPD are based on JEDEC Committee Ballot JC-42.5-99-129. 2. Byte72 is manufacturing location code. (ex: In case of Japan, byte72 is 4AH. 4AH shows “J” on ASCII code.) 3. Bytes 95 through 98 are assembly serial number. 4. All bits of 99 through 127 are not defined (“1” or “0”). 5. These specifications are defined based on component specification, not module.

HB54A2569F1, HB54A5129F2 Data Sheet E0091H40 (Ver. 4.0) Block Diagram (HB54A2569F1) DQ DQS DM DQ0 to DQ7 DQS0 R S R S R S R S R S R S R S R S R S R S R S /CS RS0 DQDQ8 to DQ15 DQS1 R S R S DQDQ16 to DQ23 DQS2 R S R S DQDQ24 to DQ31 DQS3 R S R S DQDQ32 to DQ39 DQS4 R S R S DQDQ40 to DQ47 DQS5 R S R S DQDQ48 to DQ55 DQS6 R S R S DQDQ56 to DQ63 DQS7 R S R S DQCB0 to CB7 DQS8 R S R S DQS DM /CS DQS DM /CS DQS DM /CS DQS DM /CS DQS DM /CS DQS DM /CS DQS DM /CS DQS DM /CS DM0/DQS9 DM1/DQS10 DM2/DQS11 DM3/DQS12 DM4/DQS13 DM5/DQS14 DM6/DQS15 DM7/DQS16 DM8/DQS17 * D0 to D8: HM5425801 U0: 2k-bits EEPROM R S: 22Ω PLL: CDCV857 Register: SSTV16857 R S R S R S R S R S R S R S Serial PD SDA A0 A1 A2 SA0 SA1 SA2 SCL SCL SDA Notes: 1. The SDA pull-up resistor is required due to the open-drain/open-collector output. 2. The SCL pull-up resistor is recommended because of the normal SCL line inacitve "high" state. VCCQ D0 to D8 D0 to D8 D0 to D8 D0 to D8 VCC VSS VREF VCCID open /S0 BA0 to BA1 A0 to A12 /RAS /CAS CKE0 /WE /RS0 -> /CS: SDRAMs D0 to D8 RBA0 to RBA1 -> BA0 to BA1: SDRAMs D0 to D8 RA0 to RA12 -> A0 to A12: SDRAMs D0 to D8 /RRAS -> /RAS: SDRAMs D0 to D8 /RCAS -> /CAS: SDRAMs D0 to D8 RCKE0A -> CKE: SDRAMs D0 to D8 /RWE -> /WE: SDRAMs D0 to D8 R E G I S T E R PCK /PCK CK0, /CK0 PLL* /RESET Note: Wire per Clock loading table/Wiring diagrams.

HB54A2569F1, HB54A5129F2 Data Sheet E0091H40 (Ver. 4.0) Block Diagram (HB54A5129F2) DQ DQS DM DQ0 to DQ7 DQS0 DM0/DQS9R S R S R S /CS /RS0 /RS1 DQDQ8 to DQ15 DQS1 DM1/DQS10R S R S R S DQDQ16 to DQ23 DQS2 DM2/DQS11 R S R S R S DQDQ24 to DQ31 DQS3 DM3/DQS12R S R S R S DQDQ32 to DQ39 DQS4 DM4/DQS13R S R S R S DQDQ40 to DQ47 DQS5 DM5/DQS14R S R S R S DQDQ48 to DQ55 DQS6 DM6/DQS15R S R S R S DQDQ56 to DQ63 DQS7 DM7/DQS16R S R S R S DQCB0 to CB7 DQS8 DM8/DQS17R S R S R S DQS DM /CS DQS DM /CS DQS DM /CS DQS DM /CS DQS DM /CS DQS DM /CS DQS DM /CS DQS DM /CS DQ DQS DM /CS DQ D10 DQ D11 DQ D12 DQ D13 DQ D14 DQ D15 DQ D16 DQ D17 DQS DM /CS DQS DM /CS DQS DM /CS DQS DM /CS DQS DM /CS DQS DM /CS DQS DM /CS DQS DM /CS * D0 to D17: HM5425801 U0: 2k bits EEPROM R S: 22Ω PLL: CDCV857 Register: SSTV16857 /RS0 and /RS1 alternate between the back and front side of the DIMM. R S R S R S R S R S R S R S R S R S Serial PD SDA A0 A1 A2 SA0 SA1 SA2 SCL SCL SDA Notes: 1. The SDA pull-up resistor is required due to the open-drain/open-collector output. 2. The SCL pull-up resistor is recommended because of the normal SCL line inacitve "high" state. VCCQ D0 to D17 D0 to D17 D0 to D17 D0 to D17 VCC VSS VREF VCCID open A0 to A12 BA0 to BA1 /RAS /CAS /WE /S0 CKE0 /S1 CKE1 RA0 to RA12 -> A0 to A12: SDRAMs D0 to D17 RBA0 to RBA1 -> BA0 to BA1: SDRAMs D0 to D17 /RRAS -> /RAS: SDRAMs D0 to D17 /RCAS -> /CAS: SDRAMs D0 to D17 /RWE -> /WE: SDRAMs D0 to D17 /RS0 -> /CS: SDRAMs D0 to D8 RCKE0 -> CKE: SDRAMs D0 to D8 /RS1 -> /CS: SDRAMs D9 to D17 RCKE1 -> CKE: SDRAMs D9 to D17 R E G I S T E R PCK /PCK CK0, /CK0 PLL* /RESET Note: Wire per Clock loading table/Wiring diagrams.

HB54A2569F1, HB54A5129F2 Data Sheet E0091H40 (Ver. 4.0) Differential Clock Net Wiring (CK0, /CK0) 120Ω 240Ω (Typically two registers per DIMM) 0ns (nominal) 240Ω 120Ω 120ΩCK0 Notes: 1. The clock delay from the input of the PLL clock to the input of any SDRAM or register willl be set to 0 ns (nominal). 2. Input, output and feedback clock lines are terminated from line to line as shown, and not from line to ground. 3. Only one PLL output is shown per output type. Any additional PLL outputs will be wired in a similar manner. 4. Termination resistors for feedback path clocks are located after the pins of the PLL. C /CK0 SDRAM stack SDRAM stack Register1 Register2 PLL Feedback IN OUT1 OUT'N'

HB54A2569F1, HB54A5129F2 Data Sheet E0091H40 (Ver. 4.0) Pin Functions (1) CK (CLK), /CK (/CLK) (input pin): The CK and the /CK are the master clock inputs. All inputs except DMs, DQSs and DQs are referred to the cross point of the CK rising edge and the VREF level. When a read operation, DQSs and DQs are referred to the cross point of the CK and the /CK. When a write operation, DMs and DQs are referred to the cross point of the DQS and the VREF level. DQSs for write operation are referred to the cross point of the CK and the /CK. /S (/CS) (input pin): When /S is Low, commands and data can be input. When /S is High, all inputs are ignored. However, internal operations (bank active, burst operations, etc.) are held. /RAS, /CAS, and /WE (input pins): These pins define operating commands (read, write, etc.) depending on the combinations of their voltage levels. See "Command operation". A0 to A12 (input pins): Row address (AX0 to AX12) is determined by the A0 to the A12 level at the cross point of the CK rising edge and the VREF level in a bank active command cycle. Column address (AY0 to AY9) is loaded via the A0 to the A9, the A11 at the cross point of the CK rising edge and the VREF level in a read or a write command cycle. This column address becomes the starting address of a burst operation. A10 (AP) (input pin): A10 defines the precharge mode when a precharge command, a read command or a write command is issued. If A10 = High when a precharge command is issued, all banks are precharged. If A10 = Low when a precharge command is issued, only the bank that is selected by BA1, BA0 is precharged. If A10 = High when read or write command, auto-precharge function is enabled. While A10 = Low, auto-precharge function is disabled. BA0, BA1 (input pin): BA0/BA1 are bank select signals. The memory array is divided into bank 0, bank 1, bank 2 and bank 3. If BA1 = Low and BA0 = Low, bank 0 is selected. If BA1 = High and BA0 = Low, bank 1 is selected. If BA1 = Low and BA0 = High, bank 2 is selected. If BA1 = High and BA0 = High, bank 3 is selected. CKE (input pin): CKE controls power down and self-refresh. The power down and the self-refresh commands are entered when the CKE is driven Low and exited when it resumes to High. The CKE level must be kept for 1 CK cycle (= LCKEPW) at least, that is, if CKE changes at the cross point of the CK rising edge and the VREF level with proper setup time tIS, at the next CK rising edge CKE level must be kept with proper hold time tIH. Pin Functions (2) DM (input pins): DM is the reference signals of the data input mask function. DMs are sampled at the cross point of DQS and VREF. DQ, CB (input and output pins): Data are input to and output from these pins. DQS (input and output pin): DQS provide the read data strobes (as output) and the write data strobes (as input). VCC and VCCQ (power supply pins): 2.5V is applied. (VCC is for the internal circuit and VCCQ is for the output buffer.) VCCSPD (power supply pin): 2.5V is applied (For serial EEPROM). VSS (power supply pin): Ground is connected. /RESET (input pin): LVCMOS reset input. When /RESET is low, all registers are reset and all outputs are low.

HB54A2569F1, HB54A5129F2 Data Sheet E0091H40 (Ver. 4.0) Detailed Operation Part, AC Characteristics and Timing Waveforms Refer to the HM5425161B/HM5425801B/HM5425401B Series datasheet (E0086H). DIMM /CAS latency = Device CL + 1 for registered type. Electrical Specifications Absolute Maximum Ratings Parameter Symbol Value Unit Note Voltage on any pin relative to VSS VT –1.0 to +4.6 V 1 Supply voltage relative to VSS VCC, VCCQ –1.0 to +4.6 V 1 Short circuit output current IOUT 50 mA Power dissipation PT 9 W Operating temperature Topr 0 to +55 °C Storage temperature Tstg –50 to +100 °C Notes: 1. Respect to VSS. DC Operating Conditions (TA = 0 to +55°C) Parameter Symbol min. Typ max. Unit Notes Supply voltage VCC, VCCQ 2.3 2.5 2.7 V 1, 2 VSS 0 0 0 V Input reference voltage VREF 1.15 1.25 1.35 V 1 Termination voltage VTT VREF – 0.04 VREF VREF + 0.04 V 1 DC Input high voltage VIH VREF + 0.18 — VCCQ + 0.3 V 1, 3 DC Input low voltage VIL –0.3 — VREF – 0.18 V 1, 4 DC Input signal voltage VIN (dc) –0.3 — VCCQ + 0.3 V 5 DC differential input voltage VSWING (dc) 0.36 — VCCQ + 0.6 V 6 Notes: 1. All parameters are referred to VSS, when measured. 2. VCCQ must be lower than or equal to VCC. 3. VIH is allowed to exceed VCC up to 4.6V for the period shorter than or equal to 5ns. 4. VIL is allowed to outreach below VSS down to –1.0V for the period shorter than or equal to 5ns. 5. VIN (dc) specifies the allowable dc execution of each differential input. 6. VSWING (dc) specifies the input differential voltage required for switching.

HB54A2569F1, HB54A5129F2 Data Sheet E0091H40 (Ver. 4.0) DC Characteristics 1 (TA = 0 to 55°C, VCC, VCCQ = 2.5V ± 0.2V, VSS = 0V) HB54A2569F1 HB54A5129F2 Parameter Symbol Grade max. max. Unit Test condition Notes Operating current (ACTV-PRE) ICC0 -A75B -B75B -10B 1294 1241 1099 1744 1646 1459 mA CKE ≥ VIH, tRC = min. 1, 2, 5 Operating current (ACTV-READ-PRE) ICC1 -A75B -B75B -10B 1789 1691 1549 2239 2096 1909 mA CKE ≥ VIH, BL = 2, CL = 3.5, tRC = min. 1, 2, 5 Idle power down standby current ICC2P -A75B -B75B -10B 556 521 487 718 656 595 mA CKE ≤ VIL 4 Idle standby current ICC2N -A75B -B75B -10B 754 701 649 1114 1016 919 mA CKE ≥ VIH, /CS ≥ VIH 4 Active power down standby current ICC3P -A75B -B75B -10B 619 556 514 844 746 649 mA CKE ≤ VIL 3 Active standby current ICC3N -A75B -B75B -10B 844 791 739 1294 1196 1099 mA CKE ≥ VIH, /CS ≥ VIH tRAS = max. Operating current (Burst read operation) ICC4R -A75B -B75B -10B 2419 2321 2224 2869 2726 2584 mA CKE ≥ VIH, BL = 2, Operating current (Burst write operation) ICC4W -A75B -B75B -10B 2239 2141 2044 2689 2546 2404 mA CKE ≥ VIH, BL = 2, Auto refresh current ICC5 -A75B -B75B -10B 2239 2186 1999 2689 2591 2359 mA tRFC = min., Input ≤ VIL or ≥ VIH Self refresh current ICC6 -A75B -B75B -10B 421 413 406 448 440 433 mA Input ≥ VCC – 0.2V Input ≤ 0.2V. Notes. 1. These ICC data are measured under condition that DQ pins are not connected. 2. One bank operation. 3. One bank active. 4. All banks idle. 5. Command/Address transition once per one cycle. 6. Data/Data mask transition twice per one cycle. 7. The ICC data on this table are measured with regard to tCK = min. in general. DC Characteristics 2 (TA = 0 to 55°C, VCC, VCCQ = 2.5V ± 0.2V, VSS = 0V) Parameter Symbol min. max. Unit Test condition Notes Input leakage current ILI –10 10 µA VCC ≥ VIN ≥ VSS Output leakage current ILO –10 10 µA VCC ≥ VOUT ≥ VSS Output high voltage VOH VTT + 0.76 — V IOH (max.) = –15.2mA Output low voltage VOL — VTT – 0.76 V IOL (min.) = 15.2mA

HB54A2569F1, HB54A5129F2 Data Sheet E0091H40 (Ver. 4.0) Pin Capacitance (TA = 25°C, VCC, VCCQ = 2.5V ± 0.2V) [HB54A2569F1] Parameter Symbol Pins max. Unit Notes Input capacitance CI1 Address, /RAS, /CAS, /WE, /S, CKE 10 pF 1, 3 Input capacitance CI2 CK, /CK 20 pF 1, 3 Data and DQS input/output capacitance CO DQ, DQS, CB, DM 15 pF 1, 2, 3 [HB54A5129F2] Parameter Symbol Pins max. Unit Notes Input capacitance CI1 Address, /RAS, /CAS, /WE, /S, CKE 10 pF 1, 3 Input capacitance CI2 CK, /CK 20 pF 1, 3 Data and DQS input/output capacitance CO DQ, DQS, CB, DM 20 pF 1, 2, 3 Notes: 1. These parameters are measured on conditions: f = 100MHz, VOUT = VCCQ/2, ∆VOUT = 0.2V. 2. Dout circuits are disabled. 3. This parameter is sampled and not 100% tested. Timing Parameter Measured in Clock Cycle for Registered DIMM Number of clock cycle Parameter Symbol min. max. Write to pre-charge command delay (same bank) tWPD 3 + BL/2 Read to pre-charge command delay (same bank) tRPD BL/2 Write to read command delay (to input all data) tWRD 2 + BL/2 Burst stop command to write command delay (CL = 3) tBSTW 2 (CL = 3.5) tBSTW 3 Burst stop command to DQ High-Z (CL = 3) tBSTZ 3 (CL = 3.5) tBSTZ 3.5 Read command to write command delay (to output all data) (CL = 3) tRWD 2 + BL/2 (CL = 3.5) tRWD 3 + BL/2 Pre-charge command to High-Z (CL = 3) tHZP 3 (CL = 3.5) tHZP 3.5 Write command to data in latency tWCD 2 Write recovery tWR 1 Register set command to active or register set command tMRD 2 Self refresh exit to non-read command tSNR 10 Self refresh exit to read command tSRD 200 Power down entry tPDEN 1 Power down exit to command input tPDEX 1 CKE minimum pulse width tCKEPW 1

HB54A2569F1, HB54A5129F2 Data Sheet E0091H40 (Ver. 4.0) Physical Outline Detail A 0.20 ± 0.15 2.50 ± 0.20 1.27 typ 133.35 ± 0.15 128.95 2.30 64.77 49.53 (64.48) AB 1 92 R 2.00 184 1.00 ± 0.05 Unit: mm Note: Tolerance on all dimensions ± 0.13 unless otherwise specified. 1.27 ± 0.10 3.00 min 4.00 min 10.00 4.00 ± 0.10 17.80 43.18 ± 0.15 4.00 max 2 – φ 2.50 ± 0.10 Component area (Front) Component area (Back) (DATUM -A-) 6.35 Detail B 3.80 1.80 ± 0.10 2.175 6.62 R 0.90 (DATUM -A-) ECA-TS2-0059-01

HB54A2569F1, HB54A5129F2 Data Sheet E0091H40 (Ver. 4.0) CAUTION FOR HANDLING MEMORY MODULES When handling or inserting memory modules, be sure not to touch any components on the modules, such as the memory ICs, chip capacitors and chip resistors. It is necessary to avoid undue mechanical stress on these components to prevent damaging them. In particular, do not push module cover or drop the modules in order to protect from mechanical defects, which would be electrical defects. When re-packing memory modules, be sure the modules are not touching each other. Modules in contact with other modules may cause excessive mechanical stress, which may damage the modules. MDE0202 NOTES FOR CMOS DEVICES

1 PRECAUTION AGAINST ESD FOR MOS DEVICES

Exposing the MOS devices to a strong electric field can cause destruction of the gate oxide and ultimately degrade the MOS devices operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it, when once it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. MOS devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. MOS devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor MOS devices on it.

2 HANDLING OF UNUSED INPUT PINS FOR CMOS DEVICES

No connection for CMOS devices input pins can be a cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to V DD or GND with a resistor, if it is considered to have a possibility of being an output pin. The unused pins must be handled in accordance with the related specifications.

3 STATUS BEFORE INITIALIZATION OF MOS DEVICES

Power-on does not necessarily define initial status of MOS devices. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the MOS devices with reset function have not yet been initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. MOS devices are not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for MOS devices having reset function. CME0107

HB54A2569F1, HB54A5129F2 Data Sheet E0091H40 (Ver. 4.0) M01E0107 No part of this document may be copied or reproduced in any form or by any means without the prior written consent of Elpida Memory, Inc. Elpida Memory, Inc. does not assume any liability for infringement of any intellectual property rights (including but not limited to patents, copyrights, and circuit layout licenses) of Elpida Memory, Inc. or third parties by or arising from the use of the products or information listed in this document. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of Elpida Memory, Inc. or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of the customer's equipment shall be done under the full responsibility of the customer. Elpida Memory, Inc. assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. [Product applications] Elpida Memory, Inc. makes every attempt to ensure that its products are of high quality and reliability. However, users are instructed to contact Elpida Memory's sales office before using the product in aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment, medical equipment for life support, or other such application in which especially high quality and reliability is demanded or where its failure or malfunction may directly threaten human life or cause risk of bodily injury. [Product usage] Design your application so that the product is used within the ranges and conditions guaranteed by Elpida Memory, Inc., including the maximum ratings, operating supply voltage range, heat radiation characteristics, installation conditions and other related characteristics. Elpida Memory, Inc. bears no responsibility for failure or damage when the product is used beyond the guaranteed ranges and conditions. Even within the guaranteed ranges and conditions, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Elpida Memory, Inc. products does not cause bodily injury, fire or other consequential damage due to the operation of the Elpida Memory, Inc. product. [Usage environment] This product is not designed to be resistant to electromagnetic waves or radiation. This product must be used in a non-condensing environment. If you export the products or technology described in this document that are controlled by the Foreign Exchange and Foreign Trade Law of Japan, you must follow the necessary procedures in accordance with the relevant laws and regulations of Japan. Also, if you export products/technology controlled by U.S. export control regulations, or another country's export control laws or regulations, you must follow the necessary procedures in accordance with such laws or regulations. If these products/technology are sold, leased, or transferred to a third party, or a third party is granted license to use these products, that third party must be made aware that they are responsible for compliance with the relevant laws and regulations. The information in this document is subject to change without notice. Before using this document, confirm that this is the latest version.