H2N6718L HSMC | Alldatasheet
Document overview
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- PDF pages: 4
Technical content
Features
- High Power: 850mW
- High Current: 1A Absolute Maximum Ratings
- Maximum Temperatures
- Maximum Power Dissipation
- Maximum Voltages and Currents (Ta=25°C) Characteristics (Ta=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO 100 - - V IC=100uA BVCEO 100 - - V IC=1mA BVEBO 5 - - V IE=10uA ICBO - - 100 nA VCB=80V *VCE(sat) - - 350 mV IB=35mA, IC=350mA *hFE1 80 - - VCE=1V, IC=50mA *hFE2 50 - 300 VCE=1V, IC=250mA *hFE3 20 - - VCE=1V, IC=500mA fT 50 - - MHz VCE=10V, IC=50mA, f=100MHz Cob - - 20 pF VCB=10V, IE=0, f=1MHz *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% Classification Of hFE2 Rank A B Range 50-115 95-300
MICROELECTRONICS CORP. Spec. No. : HE6218 Issued Date : 1992.11.25 Revised Date : 2001.04.24 Page No. : 2/4 H2N6718L HSMC Product Specification Characteristics Curve Current Gain & Collector Current 100 1000 0.1 1 10 100 1000 10000 Collector Current-IC (mA) hFE hFE @ VCE=1V hFE @ VCE=2V hFE @ VCE=5V hFE@VCE=10V Saturation Voltage & Collector Current 100 1000 0.1 1 10 100 1000 10000 Collector Current-IC (mA) Saturation Voltage (mV) VCE(sat) @ IC=10IB Saturation Voltage & Collector Current 100 1000 10000 1 10 100 1000 10000 Collector Current-IC (mA) Saturation Voltage (mV) VBE(sat) @ IC=10IB Collector Output Capacitance 100 0.1 1 10 100 Collector Base Voltage (V) Capacitance (pF) Cob Safe Operating Area 0.01 0.1 1 10 100 Forward Voltage-VCE (V) Collector Current-IC (A) 1mS 100mS 1S Cutoff Frequency & Collector Current 100 1000 1 10 100 Collector Current-IC (mA) Cutoff Frequency (MHz) fT @ VCE=10V
MICROELECTRONICS CORP. Spec. No. : HE6218 Issued Date : 1992.11.25 Revised Date : 2001.04.24 Page No. : 3/4 H2N6718L HSMC Product Specification Power Derating 100 200 300 400 500 600 700 800 900 0 50 100 150 200 Ta(oC), Ambient Temperature PD(mW), Power Dissipation
MICROELECTRONICS CORP. Spec. No. : HE6218 Issued Date : 1992.11.25 Revised Date : 2001.04.24 Page No. : 4/4 H2N6718L HSMC Product Specification TO-92 Dimension *:Typical D 0.0142 0.0220 0.36 0.56 α1 - *5° - *5° F 0.1323 0.1480 3.36 3.76 α3 - *2° - *2° Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material :
- Lead : 42 Alloy ; solder plating
- Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice:
- All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
- HSMC reserves the right to make changes to its products without notice.
- HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
- HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 Tel : 886-3-5983621~5 Fax : 886-3-5982931 A D B C I α 1 E F α 2 α 3 GH Style : Pin 1.Emitter 2.Collector 3.Base 3-Lead TO-92 Plastic Package Marking : HSMC Logo Part Number Date Code Product Series Rank Laser Mark HSMC Logo Part Number Product Series Ink Mark