H2N3417 HSMC | Alldatasheet
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MICROELECTRONICS CORP. Spec. No. : HE6267-B Issued Date : 1992.11.25 Revised Date : 2000.09.01 Page No. : 1/3 HSMC Product Specification H2N3417 NPN SILICON TRANSISTOR
Description
The H2N3417 is a silicon NPN planar epitaxial transistor designed for small signal general purpose and switching applications. Absolute Maximum Ratings
- Maximum Temperatures
- Maximum Power Dissipation
- Maximum Voltages and Currents (Ta=25°C) Characteristics (Ta=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO 50 - - V IC=100uA, IE=0 BVCEO 50 - - V IC=1mA, IB=0 BVEBO 5 - - V IE=10uA, IC=0 ICBO - - 100 nA VCB=50V, IE=0 IEBO - - 100 nA VEB=5V, IC=0 *VCE(sat) - - 300 mV IB=3mA, IC=50mA *VBE(sat) - - 850 mV IB=3mA, IC=50mA *hFE 180 - 540 - VCE=4.5V, IC=2mA *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
MICROELECTRONICS CORP. Spec. No. : HE6267-B Issued Date : 1992.11.25 Revised Date : 2000.09.01 Page No. : 2/3 HSMC Product Specification Characteristics Curve Current Gain & Collector Current 100 1000 0.1 1 10 100 1000 Collector Current (mA) hFE hFE @ VCE=4.5V Saturation Voltage & Collector Current 100 1000 10000 0.1 1 10 100 1000 Collector Current (mA) Saturation Voltage (mV) VBE(sat) @ IC=50/3IB VCE(sat) @ IC=50/3IB Capacitance & Reverse-Biased Voltage 100 0.1 1 10 100 Reverse-Biased Voltage (V) Capacitance (pF) Cob Safe Operating Area 100 1000 10000 1 10 100 Forward Voltage-VCE (V) Collector Current-IC (mA) PT=1ms PT=100ms PT=1s PD-Ta 100 200 300 400 500 600 700 0 20 40 60 80 100 120 140 160 Ambient Temperature-Ta(oC) Power Dissipation-PD(mW)
MICROELECTRONICS CORP. Spec. No. : HE6267-B Issued Date : 1992.11.25 Revised Date : 2000.09.01 Page No. : 3/3 HSMC Product Specification TO-92 Dimension *:Typical D 0.0142 0.0220 0.36 0.56 α1 - *5° - *5° F 0.1323 0.1480 3.36 3.76 α3 - *2° - *2° Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material :
- Lead : 42 Alloy ; solder plating
- Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice:
- All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
- HSMC reserves the right to make changes to its products without notice.
- HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
- HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 Tel : 886-3-5983621~5 Fax : 886-3-5982931 Tel : 886-3-5977061 Fax : 886-3-5979220 A D B C I α 1 E F α 2 α 3 GH Style : Pin 1.Emitter 2.Base 3.Collector 3-Lead TO-92 Plastic Package Marking : HSMC Logo Part Number Date Code Product Series Rank Laser Mark HSMC Logo Part Number Product Series Ink Mark