H288

H288 HSMC | Alldatasheet

Document overview

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• PDF pages: 6

Technical content

Features

• On-chip Hall sensor
• 3.0V to 20V operating voltage
• Internal Temperature compensation
• Special design providing logic race condition immunity, shorter switching time, and good switch reliability
• 300mA output sink current
• Internal on-chip protection diode
• SIP-4L Package

Applications

• Dual-coil Brush-less DC Motor
• Dual-coil Brush-less DC Fan
• Revolution Counting
• Speed Measurement Pin Assignment Name P/I/O Pin # Description VCC P 1 Power Supply Input DO O 2 Output Pin DOB O 3 Output Pin AX277 1234 GND P 4 Ground H288 Typical Application Circuit (Brush-Less DC Fan) AX277H288 C1 C2 VCC Coil1 Coil2 1234

MICROELECTRONICS GROUP. Spec. No. : IC200903 Issued Date : 2009.02.12 Revised Date : Page No. : 2/6 H288 HSMC Product Specification Block Diagram Temperature Compensation Voltage Regulator Logic Control Vcc Hall Effect Sensor Differential Amplifier Hysteresis Control Output Driver Vout2 GND Vout1 GND Test Circuit AX277 1234 14V CL1 CL2 RL1 RL2 Vout1 Vout2 H288 RL1=RL2=820Ω CL1=CL2=20pF Absolute Maximum Ratings (Ta=25oC) Characteristics Symbol Values Unit Supply Voltage VCC 20 V Output breakdown Voltage VOUT(breakdown) 35 V Magnetic Flux Density B Unlimited Output Zener Breakdown VZ 28 V Output ON Current (continuous) IC 300 mA Maximum Output Current ICMAX 1 A Operating Temperature Range TA -20 to +85 oC Storage Temperature Range TS -65 to +150 oC Package Power Dissipation PD 500 mW Maximum Junction Temperature TJ 175 oC

MICROELECTRONICS GROUP. Spec. No. : IC200903 Issued Date : 2009.02.12 Revised Date : Page No. : 3/6 H288 HSMC Product Specification Electrical Characteristics (T=+25oC, VCC=3V~20V) Characteristic Symbol Test Conditions Min. Typ. Max. Units Supply Voltage VCC 3 - 20 V VCC=3V, IL=100mA - 200 - Output Saturation Voltage VCE(sat) VCC=14V, IL=300mA - 300 600 mV Output Leakage Current Icex Vce=14V, VCC=14V - - 2 uA Supply Current Iccq VCC=20V, Output Open - 10 18 mA Output Rise Time Tr VCC=14V, RL=400Ω, CL=20pF - 1 5 uS Output Falling Time Tf VCC=14V, RL=400Ω, CL=20pF - 0.2 1.2 uS Magnetic Characteristics A Grade Characteristic Symbol Min. Typ. max. Units Operate Point BOP - - 70 G Release Point Brp -70 - - G Hysteresis window Bhy - 70 - G B Grade Characteristic Symbol Min. Typ. max. Units Operate Point BOP - - 90 G Release Point Brp -90 - - G Hysteresis window Bhy - 70 - G C Grade Characteristic Symbol Min. Typ. max. Units Operate Point BOP - - 130 G Release Point Brp -130 - - G Hysteresis window Bhy - 70 - G

MICROELECTRONICS GROUP. Spec. No. : IC200903 Issued Date : 2009.02.12 Revised Date : Page No. : 4/6

0 Brp N Bop S

Magnetic Flux Density (gauss) 0BrpN Bop S Bhy on-stateVsat Vout Magnetic Flux Density (gauss) H288 Hysteresis Characteristics curve Vsat off-state Vccoff-state Turn offTurn on DO DOB Characteristics Curve H288 HSMC Product Specification Supply Current & Supply Voltage 2.8 3 3.5 3.6 4 5 6 7 8 9 10 12 14 16 18 20 Supply Voltage (V) Supply Current (mA)... Supply Current & Temperature 12.4 12.5 12.6 12.7 12.8 12.9 13.1 13.2 13.3 13.4 0 20 40 60 80 100 120 Temperature (oC) Supply Current (mA)... Test Conditions: VCC=20V Output Open, RL=∞ (Refer to Test Circuit) Test Conditions: V CC=2.8V~20V Output Open, RL=∞ TA=25oC (Refer to Test Circuit) Hysteresis & Temperature 0 20 40 60 80 100 120 Temperature (oC) Hysteresis (G) SIP-4L Power Dissipation & Temperature 200 250 300 350 400 450 500 550 600 0 2 04 06 08 0 1 0 0 1 2 0 Temperature (oC) Power Dissipation (mW) Test Conditions: VCC=14V, RL=400Ω CL=20pF (Refer to Test Circuit)

MICROELECTRONICS GROUP. Spec. No. : IC200903 Issued Date : 2009.02.12 Revised Date : Page No. : 5/6 H288 HSMC Product Specification Brush-less DC Fan Output Current Curve Time (uS) Current (mA) 180 Icoil 1 Icoil 2 12V, 0.24A Brush-Less DC Fan (Refer to Typical Application Circuit) Test Conditions: V CC=12V, C1=C2=2.2uF Rcoil1=Rcoil2=40ohm Brush-less DC Fan Output Voltage Curve 0 2 4 6 8 1 01 21 41 61 82 Time (mS) Output Voltage (V) Vout 1 Vout 2 12V, 0.24A Brush-Less DC Fan (Refer to Typical Application Circuit) Test Conditions: VCC=12V, C1=C2=2.2uF Rcoil1=Rcoil2=40ohm

MICROELECTRONICS GROUP. Spec. No. : IC200903 Issued Date : 2009.02.12 Revised Date : Page No. : 6/6 H288 HSMC Product Specification SIP-4L Dimension DIM Min. Max. A B C D EF G H Marking Site J I K E 12 34 L Marking: A 3.962 4.216 Mark Halogen Free 288 B 2.870 3.124 C 13.60 15.60 D 1.245 1.753 E 0.750REF F 0.406 0.508 G 0.330 0.432 H 1.27REF Hall Sensor Location: 2.00m m 1.37m m To p Vi ew Material:

• Lead solder plating: Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 *: Typical, Unit: mm 4-Lead SIP-4L Plastic Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of AVANTIC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office: Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• AVANTICS Microelectronics Corp: No. 255, Cai Lun Rd. Zhangjiang Technology Industrial Park Pudong, Shanghai, China Tel: 86-021-58955599 Fax: 86-021-58558038