H277 HSMC | Alldatasheet

Document overview

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Technical content

Features

  • On-chip Hall sensor
  • 3.0V to 20V operating voltage
  • Internal Temperature compensation
  • Special design providing logic race condition immunity, shorter switching time, and good switch reliability
  • 300mA output sink current
  • Internal on-chip protection diode
  • SIP-4L Package

Applications

  • Dual-coil Brush-less DC Motor
  • Dual-coil Brush-less DC Fan
  • Revolution Counting
  • Speed Measurement Typical Application Circuit (Brush-Less DC Fan) Fig.2 H277 Application Circuit

MICROELECTRONICS CORP. Spec. No. : IC200907 Issued Date : 2009.04.03 Revised Date :2009.10.29 Page No. : 2/7 H277 HSMC Product Specification Pin Configuration Name P/I/O Pin No. Description VCC P 1 Power Supply Input DO O 2 Output Pin DOB O 3 Output Pin GND P 4 Ground Block Diagram Temperature Compensation Voltage Regulator Logic Control Vcc Hall Effect Sensor Differential Amplifier Hysteresis Control Output Driver Vout2 GND Vout1 GND Fig.3 Functional Block Diagram of H277 Absolute Maximum Ratings (Ta=25oC) Characteristics Symbol Values Unit Supply Voltage VCC 20 V Output breakdown Voltage VOUT(breakdown) 35 V Magnetic Flux Density B Unlimited Gauss Output Zener Breakdown VZ 28 V Output ON Current (continuous) IC 300 mA Maximum Output Current ICMAX 1 A Operating Temperature Range TA -20 to +85 ℃ Storage Temperature Range TStg -65 to +150 ℃ Package Power Dissipation PD 500 mW Maximum Junction Temperature TJ 150 ℃

MICROELECTRONICS CORP. Spec. No. : IC200907 Issued Date : 2009.04.03 Revised Date :2009.10.29 Page No. : 3/7 H277 HSMC Product Specification Electrical Characteristics (T=+25℃, VCC=3V~20V) Characteristic Symbol Test Conditions Min. Typ. Max. Unit Supply Voltage VCC 3 - 20 V VCC=3V, IL=100mA - 200 - Output Saturation Voltage VCE(sat) VCC=14V, IL=300mA - 300 600 mV Output Leakage Current Icex Vce=14V, VCC=14V - - 2 uA Supply Current Iccq VCC=20V, Output Open - 14 20 mA Output Rise Time Tr VCC=14V, RL=400Ω, CL=20pF - 1 5 uS Output Falling Time Tf VCC=14V, RL=400Ω, CL=20pF - 0.2 1.2 uS Magnetic Characteristics Characteristic Symbol Min. Max. Unit Grade Operate Point Bop - 50 Gauss H277A Release Point Brp -50 - Gauss A Operate Point Bop - 70 Gauss H277B Release Point Brp -70 - Gauss B Operate Point Bop - 90 Gauss H277C Release Point Brp -90 - Gauss C Operate Point Bop - 130 Gauss H277D Release Point Brp -130 - Gauss D Fig.4 V DO vs. Magnetic Flux Density Fig.5 V DOB vs. Magnetic Flux Density

MICROELECTRONICS CORP. Spec. No. : IC200907 Issued Date : 2009.04.03 Revised Date :2009.10.29 Page No. : 4/7 H277 HSMC Product Specification Characteristics Curve Fig.6 ICC vs. VC C Fig.7 I CC vs. TA Supply Current & Temperature 12.4 12.5 12.6 12.7 12.8 12.9 13.1 13.2 13.3 13.4 0 20 40 60 80 100 120 Temperature (oC) Supply Current (mA)... Test Conditions: VCC=20V Output Open, RL=∞ (Refer to Test Circuit) Output Saturation Voltage & Loading Current 200 400 600 800 1000 1200 1400 1600 300 400 500 600 700 800 900 1000 Loading Current (mA) Output Saturation Voltage (mV)... Test Conditions: VCC=14V, TA=25oC IL=300mA~1200mA Hysteresis & Temperature 0 20 40 60 80 100 120 Temperature (oC) Hysteresis (G) Test Conditions: VCC=14V, RL=400Ω CL=20pF (Refer to Test Circuit) Fig.8 Vsat vs. IC Fig.9 Bhys vs. TA SIP-4L Power Dissipation & Temperature 200 250 300 350 400 450 500 550 600 0 2 04 06 08 0 1 0 0 1 2 0 Temperature (oC) Power Dissipation (mW) Fig.10 PD vs. TA

MICROELECTRONICS CORP. Spec. No. : IC200907 Issued Date : 2009.04.03 Revised Date :2009.10.29 Page No. : 5/7 H277 HSMC Product Specification Brush-less DC Fan Output Current Curve Time (uS) Current (mA) 180 Icoil 1 Icoil 2 12V, 0.24A Brush-Less DC Fan (Refer to Typical Application Circuit) Test Conditions: VCC=12V, C1=C2=2.2uF Rcoil1=Rcoil2=40ohm Fig.11 DC FAN Output Curve Fig.12 DC FAN Output Curve Brush-less DC Fan Output Voltage Curve 0 2 4 6 8 10 12 14 16 18 20 Time (mS) Output Voltage (V) Vout 1 Vout 2 12V, 0.24A Brush-Less DC Fan (Refer to Typical Application Circuit) Test Conditions: VCC=12V, C1=C2=2.2uF Rcoil1=Rcoil2=40ohm Test Circuit F i g . 1 3 T e s t C i r c u i t

MICROELECTRONICS CORP. Spec. No. : IC200907 Issued Date : 2009.04.03 Revised Date :2009.10.29 Page No. : 6/7 H277 HSMC Product Specification SIP-4L Dimension DIM Min. Max. A 5.12 5.32 B 4.10 4.30 C 3.55 3.75 D 0.43 0.49 E 0.35 0.41 F 1.24 1.30 G 3.78 3.84 H 1.32 1.52 I 1.45 1.65 J 0.93 1.13 K 13.00 15.50 L a1 3 o o a2 5 o o *: Typical, Unit: mm A B C D EF G H Marking Site J I K E 12 34 L Marking: Note: Green label is used for Pb-free packing Pin Style: 1.VCC 2.Vout1 3.Vout2 4.GND Hall Sensor Location: 2.00mm 1.25mm To p View Material:

  • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 4-Lead SIP-4L Plastic Package Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of AVANTIC.
  • HSMC reserves the right to make changes to its products without notice.
  • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office:
  • Head Office (Hi-Sincerity Microelectronics Corp.): 5/F., Golden Harvest Building 15 Wang Chiu Road, Kowloon Bay, Hong Kong Tel: +852-2755-7162 Fax: +852-2755- 7795 AVANTICS : Shanghai Address: No.399, Cai Lum Rd. Zhangjiang Technology Industrial Park Pudong, Shanghai 201210, China Tel: +86(21) 61637118 Fax: +86(21)61637006

MICROELECTRONICS CORP. Spec. No. : IC200907 Issued Date : 2009.04.03 Revised Date :2009.10.29 Page No. : 7/7 H277 HSMC Product Specification Soldering Methods for HSMC Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%±15% 2. Reflow soldering of surface-mount devices Figure 1: Temperature profile tP tL Ramp-down Ramp-up Tsmax Tsmin Critical Zone TL to TP tS Preheat TL TP t 25oC to Peak Time Temperature Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) <3 oC/sec <3 oC/sec Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) 100oC 150oC 60~120 sec 150oC 200oC 60~180 sec Tsmax to TL - Ramp-up Rate <3oC/sec <3oC/sec Time maintained above: - Temperature (T - Time (tL) 183oC 60~150 sec 217oC 60~150 sec Peak Temperature (TP) 240 oC +0/-5oC 260 oC +0/-5oC Time within 5oC of actual Peak Temperature (tP) 10~30 sec 20~40 sec Ramp-down Rate <6oC/sec <6 oC/sec Time 25oC to Peak Temperature <6 minutes <8 minutes 3. Flow (wave) soldering (solder dipping) Products Peak temperature Dipping time Pb devices. 245oC ±5oC 5sec ±1sec Pb-Free devices. 260oC +0/-5oC 5sec ±1sec