H1N400X HSMC | Alldatasheet
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Technical content
Features
- High Reliability
- Low Cost
- Low Leakage
- Low forward voltage drop
- High Current Capability
- Glass Passivated Junction Maximum Ratings & Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load. Drate current by 20%. Ratings Symbol 4001 4002 4004 4007 Unit Maximum recurrent peak reverse voltage VRRM 50 100 400 1000 V Maximum RMS voltage VRMS 35 70 280 700 V Maximum DC blocking voltage VDC 50 100 400 1000 V Maximum average forward recitified current .375”(9.5mm) lead length (Ta=75°C) IO 1A Peak forward surge current 8.3ms single half sine-wave superimposed on rated load IFSM 30 A Typical thermal resistance (Note2) RθJA 50 °C/W Typical junction capacitance (Note1) CJ 30 pF Operating & storage temperature Tj Tstg -50 to +175 °C Maximum instantaceous forward voltage at 1.0A DC VF 1.1 V Maximum DC reverse current at rated DC blocking voltage @Ta=25°C @Ta=100°C IR 5 uA Maximum full load reverse current average full cycle .375”(9.5mm) lead at Tj=75°C 30 uA Note 1 : Measured at 1MHz and applied reverse voltage of 4.0 volts. Note 2 : Thermal resistance from junction to ambient 9.5mm lead length.
MICROELECTRONICS CORP. Spec. No. : HE9101-B Issued Date : 1996.03.27 Revised Date : 2000.05.01 Page No. : 2/2 HSMC Product Specification DO-41 Dimension *:Typical C 0.1600 0.2050 4.10 5.20 Notes : 1.Dimension and tolerance based on our Spec. dated May 28,1998.a 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material :
- Lead : 42 Alloy ; solder plating
- Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice:
- All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
- HSMC reserves the right to make changes to its products without notice.
- HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
- HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 Tel : 886-3-5983621~5 Fax : 886-3-5982931 Tel : 886-3-5977061 Fax : 886-3-5979220 E B C A D DO-41 Molded Plastic Package