H1563P HSMC | Alldatasheet

Document overview

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  • PDF pages: 8

Technical content

Features

  • 3V to 40V Input Voltage Operation
  • Internal 2A Peak Current Switch
  • 1.5A Continuous Output Current
  • Bootstrapped Driver
  • High Side Current Sense Capability
  • High Efficiency (up to 90%)
  • Internal ±2% Reference
  • Low Quiescent Current at 1.6mA
  • Frequency Operation from 100Hz to 100KHz

Applications

  • Constant Current Source for Battery Chargers
  • Saver for Cellular Phone
  • Step-Down DC-DC Converter Module Typical Application Circuit Saver Circuit for Cellular Phone SC BST SE IS TC VCC GND FB 120 H1N4148 1uF L 220uH Co 220uF 1K *RS 10uF RB 33KRA 5.6K CT 470pF 220uF Vin H1N5821 H1N5819+ + Io H1563 *Io=300mV/RS

MICROELECTRONICS CORP. Spec. No. : HP200201 HS200207 Issued Date : 2000.10.01 Revised Date : 2002.07.12 Page No. : 2/8 H1563P / H1563S HSMC Product Specification Pin Connections Order No. Pin1: SC-2A Switch Collector Pin5: FB-Feedback Comparator Inverting Input Pin2: SE-Darlington Switch Emitter Pin6: VCC-Power Supply InputH1563P (Plastic DIP) Pin3: TC-Oscillator Timing Capacitor Pin7: IS-Highside Current Sense Input H1563S (Plastic SO) Top View 5678 4321 Pin4: GND-Power Ground Pin8: BST-Bootstrapped Driver Collector Block Diagram Absolute Maxium Rating Rating Symbol Value Unit Power Supply Voltage Vcc 40 Vdc Comparator Input Voltage Range Vir 0.3 ~ +40 Vdc Switch Collector Voltage Vc(switch) 40 Vdc Switch Emitter Voltage (Vpin1=40V) Ve(switch) 40 Vdc Switch Collector to Emitter Voltage Vce(switch) 40 Vdc Driver Collector Voltage Vc(driver) 40 Vdc Switch Current Isw 2 A Operating Junction Temperature Tj 150 °C Operating Ambient Temperature Range Ta 0 to +70 °C Storage Temperature Range Tstg -65 to +150 °C Ta=25°C 1.5 W Thermal Resistance 85 °C/W Ta=25°C 1.2 W Thermal Resistance 105 °C/W 1.25V Reference Voltage S R BST IS VCC FBGND SE TC SC CT Is Oscillator Comparator

MICROELECTRONICS CORP. Spec. No. : HP200201 HS200207 Issued Date : 2000.10.01 Revised Date : 2002.07.12 Page No. : 3/8 H1563P / H1563S HSMC Product Specification Test Circuit Characteristics Curve Vfb Theshold Voltage vs Temperature 1.2 1.22 1.24 1.26 1.28 1.3 0 1 02 03 04 05 06 07 08 0 Temperature (J) Vfb Threshold Voltage (V) VCC=5V Ct=1nF PIN2=GND Standby Supply Current vs Supply Voltage 0.4 0.8 1.2 1.6 0 5 10 15 20 25 30 35 40 Vcc Supply Voltage (V) Icc Supply Current (mA) Common Emitter Configuration Output Switch Saturation Voltage vs Collector Current 0.2 0.4 0.6 0.8 00 . 511 . 52 Ic Collector Current (A) Vce(sat) Saturation Voltage (V) VCC=5V PIN7=VCC PIN2,3,5=GND Forced Beta=20 Emmiter Follower Configuration Output Switch Saturtion Voltage vs Emmiter Current 1.2 1.3 1.4 1.5 1.6 1.7 1.8 00 . 511 . 52 Ie Emitter (A) Vce(sat) Sarurtion Voltage (V) VCC=5V PIN1,7,8=VCC PIN3,5=GND SC BST SE IS TC VCC GND FB CT 1nF H1563 Current Source 2V/0V IDISCHG /ICHG VCC 20mA Current Source 4.55V @VCC=5V 4.75V VCC 1.275V 1.225V

MICROELECTRONICS CORP. Spec. No. : HP200201 HS200207 Issued Date : 2000.10.01 Revised Date : 2002.07.12 Page No. : 4/8 H1563P / H1563S HSMC Product Specification Electrical Characteristics (Vcc=5V, Ta=25°C, unless otherwise specified) Parameter Test Condition Symbol Min. Typ. Max. Unit Oscillator Charging Current 5V≤VCC≤40V Ichg 24 35 42 uA Discharge Current 5V≤VCC≤40V Idischg 140 220 260 uA Voltage Swing Pin3 V OSC -0 . 6- V Discharge to Charge Current Ratio V IS =VCC IDischg/Ichg -6- Current Limit Sense Voltage I Chg=Idischg VCC-VIS 250 300 350 mV Output Switch Saturation Voltage, Emitter Follower Connection ISE=1A, VBST=VSC=VCC VCE(Sat) -1 1 . 3 V Saturation Voltage ISC=1A, IBST=50mA (Forced β ≈ 20) VCE(Sat) -0 . 4 0 . 7 V DC Current Gain I SC=1A, VCE=5V hFE 35 120 - Collector Off-State Current V CE=30V I CC(Off) -1 0-n A Comparator Threshold Voltage Line Regulation 3V≤VCC≤40V REGLine -3 6 m V Input Bias Current V IN=0V I IB - 20 400 nA Supply Current VIS=VCC, VPin5>VFB 5V≤VCC≤40V, CT=1nF Pin2=Gnd Remaining pins open ICC -1 . 63 m A

Application Information

Calculation Step-Down Step-Up ton / toff Vout+VF / (Vin(min) -Vsat-Vout) Vout+V F-Vin(min) / (Vin(min)-Vsat) (ton+toff) max 1 / F min 1 / Fmin CT 4*10-5ton 4*10-5ton IC(switch) 2*Iout(max) 2*Iout(max)*(ton+toff / toff) RS 0.3 / I C(switch) 0.3 / IC(switch) L(min) ((Vin(min)-Vsat-Vout) / IC(switch))*ton(max) ((Vin(min)-Vsat) / IC(switch))*ton(max) CO IC(switch)*(ton+toff) / 8VRipple(P-P) Iout*ton / VRipple(P-P) Vsat: Saturation voltage of the output switch. VF: Forward voltage of the ringback rectifier. The following power supply characteristics must be chosen: Vin: Nominal input voltage. Vout: Desired output voltage. |V out|=1.25*(1+RB/RA) Iout: Desired output current Fmin: Minimum desired switching frequency at selected values for Vin and Iout. VRipple(P-P): Desired peak to peak output ripple voltage in practice, the calculated value will need to be increased due to the capacitor equivalent series resistance and board layout. The ripple voltage should be kept to a low value since it will directly effect the line and load regulation.

MICROELECTRONICS CORP. Spec. No. : HP200201 HS200207 Issued Date : 2000.10.01 Revised Date : 2002.07.12 Page No. : 5/8 H1563P / H1563S HSMC Product Specification Application Information (Continuos) SCBST SEIS TCVCC GNDFB H1N4148 300uH 470uF RB 13K 470pF 1uF Vin H1N5819 H1563 RS 0.22 100uF 16V~25V RA 1.5K 12V/1A SCBST SEIS TCVCC GNDFB 470 H1N4148 300uH 470uF 390K RB 1000pF 1uF Vin H1N5819 H1563 1N1418 2.2M RS 0.22 100uF 8V~25V RA 5V/1A SCBST SEIS TCVCC GNDFB L 200uH Co 220uF RB 47K CT 680pF+ Vin H1N5819 + H1563 RS 0.22 100uF RA 2.2K 28V/200mA 150 Vout Line Regulation: 40mV (Vin=10V~20V, @Io=1A) Load Regulation: 20mV (Vin=15V, @Io=100mA~1A) Short Circuit Current: 1.3A (Vin=15V, @RL=0.1Ω ) Fig.1 Step-Down Converter Fig.2 Step-Down Converter With External 5V Bootstrap Fig.3 Step-Up Converter Line Regulation: 100mV (Vin=8V~16V, @Io=200mA) Load Regulation: 40mV (Vin=12V, @Io=80mA~200mA)

MICROELECTRONICS CORP. Spec. No. : HP200201 HS200207 Issued Date : 2000.10.01 Revised Date : 2002.07.12 Page No. : 6/8 H1563P / H1563S HSMC Product Specification SCBST SEIS TCVCC GNDFB RA 953 CT 600pF Vin H1N5819 H1563 RS 0.25 100uF RB 8.2K -12V/100mA Vout L 100uH Co 470uF 4.5V~6V SCBST SEIS TCVCC GNDFB L Co RB CT+ Vin D1 + H1563 RS RA Vout Fig.4 Step-Up Converter With External NPN Switch Fig.5 Inverting Converter Line Regulation: 20mV (Vin=4.5V~6V, @Io=100mA) Load Regulation: 100mV (Vin=5V, @Io=10mA~100mA)

MICROELECTRONICS CORP. Spec. No. : HP200201 HS200207 Issued Date : 2000.10.01 Revised Date : 2002.07.12 Page No. : 7/8 H1563P / H1563S HSMC Product Specification H1563P Dimension (DIP-8P) *: Typical G 0.1250 0.1400 3.17 3.55 α19 4 ° 97° 94° 97° Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material:

  • Lead: 42 Alloy; solder plating
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIP-8P Plastic Package Marking: HP 15 63 Date Code A B 87 6 5 4321 HI F G J K M L α 1E D C

MICROELECTRONICS CORP. Spec. No. : HP200201 HS200207 Issued Date : 2000.10.01 Revised Date : 2002.07.12 Page No. : 8/8 H1563P / H1563S HSMC Product Specification H1563S Dimension (SOP-8P) *: Typical H 0.1889 0.2007 4.80 5.10 Notes: 1.Dimension and tolerance based on our Spec. dated Mar. 01, 2001. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material:

  • Lead: 42 Alloy; solder plating
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
  • HSMC reserves the right to make changes to its products without notice.
  • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Tel: 886-3-5983621~5 Fax: 886-3-5982931 SOP-8P Plastic Package Marking: HS 15 63 Date Code Top View A B Front View F C D E G Part A I H J K O M L N Right side View Part A