H1117 HSMC | Alldatasheet

Document overview

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  • PDF pages: 8

Technical content

Features

  • Low Dropout Voltage 1.2V at 1.2A
  • Adjustable or Fixed Voltage (1.8V, 2.5V, 3.3V, 5V)
  • Over Current Protection
  • Thermal Overload Protection
  • Maximum Line Regulation 0.45%
  • Maximum Load Regulation 0.4%
  • Adjust Pin Current Less Than 90 uA

Applications

  • SCSI-2 Active Termination
  • High Efficiency Linear Regulators
  • 5V to 3.3V Voltage Converter
  • Battery Charger
  • Battery Management Circuits For Notebook And Palmtop PCs
  • Core Voltage Supply: FPGA, PLD, DSP , CPU General Description The H1117 Series are available in fixed and adjustable output voltage versions. Over current and thermal overload protection are integrated onto the chip. Output current will decrease while it reaches the preset current or temperature limit. The dropout voltage is specified at 1.2V Maximum at full rated output current. H1117 Series provide excellent regulation over variations due to changes in line, load and temperature. H1117 Series are three terminal regulators and available in popular packages. Device Selection Guide Device Output Voltage Package Device Output Voltage Package H1117M-Adj 1.3V to 4V H1117J-Adj 1.3V to 4V H1117M-Fix 1.8V, 2.5V, 3.3V, 5V SOT-89 H1117J-Fix 1.8V, 2.5V, 3.3V, 5V TO-252 H1117SJ-Adj 1.3V to 4V H1117E-Adj 1.3V to 4V H1117SJ-Fix 1.8V, 2.5V, 3.3V, 5V SOT-223 H1117E-Fix 1.8V, 2.5V, 3.3V, 5V TO-220AB Absolute Maximum Ratings Parameter Symbol Maximum Units Input Voltage V IN 20 V Power Dissipation P D Internally Limited * W Operating Junction Temperature Range T OPR 0 To +125 °C Storage Temperature Range T STG -65 To +150 °C Lead Temperature (Soldering) 5 Sec T LEAD 260 °C Electrostatic Discharge Sensitivity 2 KV/Min H1117 Series Pin Assignment 3-Lead Plastic SOT-223 Package Code: SJ Pin 1: ADJ/GND Pin 2 & Tab: V OUT Pin 3: VIN1 2 3 Tab 3-Lead Plastic SOT-89 Package Code: M Pin 1: ADJ/GND Pin 2: V OUT Pin 3: VIN 1 2 3 3-Lead Plastic TO-252 Package Code: J Pin 1: ADJ/GND Pin 2 & Tab: V OUT Pin 3: VIN 1 2 3 Tab 3-Lead Plastic TO-220AB Package Code: E Pin 1: ADJ/GND Pin 2 & Tab: V OUT Pin 3: VIN 1 2 3 Tab

MICROELECTRONICS CORP. Spec. No. : IC200401 Issued Date : 2004.02.01 Revised Date : 2005.07.14 Page No. : 2/8 H1117 Series HSMC Product Specification Electrical Characteristics (Ci=10uF, Co=100uF, unless otherwise noted.) Parameter Test Conditions Min. Typ. Max. Units Output Voltage H1117-2.5 I O =0mA, VIN =4V 2.475 2.5 2.525 V H1117-5 I O =0mA, VIN =6.5V 4.95 5 5.05 V Reference Voltage H1117-Adj I O =10mA, VIN -VO=3V 1.238 1.25 1.262 V Line Regulation H1117-1.8 I O=0mA, VIN=3.3~10V - 1 6 mV H1117-2.5 I O =0mA, VIN =4~10V - 1 7 mV H1117-3.3 I O =0mA, VIN =4.8~10V - 2 7 mV H1117-5 I O =0mA, VIN =6.5~10V - 3 10 mV H1117-Adj I O =10mA, VIN -VO=1.5~10V - 0.1 0.4 % Load Regulation IO=0~800mA, VIN=3.3V, TJ=25oC- - 0 . 4 %H1117-1.8 IO=0~1200mA, VIN=3.3V, NOTE1 --1 % IO=0~800mA, VIN=4V, TJ=25oC- - 0 . 4 %H1117-2.5 IO=0~1200mA, VIN=4V, NOTE1 --1 % IO=0~800mA, VIN=4.8V, TJ=25oC- - 0 . 4 %H1117-3.3 IO=0~1200mA, VIN=4.8V, NOTE1 --1 % IO=0~800mA, VIN=6.5V, TJ=25oC- - 0 . 4 %H1117-5 IO=0~1200mA, VIN=6.5V, NOTE1 --1 % IO=0~800mA, VIN=2.75V, TJ=25oC- - 0 . 4 %H1117-Adj IO=0~1200mA, VIN=2.75V, NOTE1 --1 % Dropout Voltage NOTE3 IO=100mA, TJ=25oC - 1.05 1.15 V IO=500mA, TJ=25oC- 1 . 1 1 . 1 5 V IO=1200mA, TJ=25oC- 1 . 2 1 . 3 VAll H1117 Series IO=1200mA - 1.2 1.55 V Current Limit All H1117 Series V IN -VO=1.5V 2000 2600 3200 mA Minimum Load Current H1117-ADJ NOTE1 & NOTE2 VIN -VO=13.75V NOTE1 & NOTE2 -1 . 75 m A Quiescent Current H1117-Fix NOTE1 VIN -VO=5V NOTE1 -6 1 0 m A Adjust Pin Current NOTE1 & NOTE2 IO =10mA, VIN -VO=1.5V NOTE1 & NOTE2 - 50 120 uA Adjust Pin Current Change I O =10mA, VIN -VO=1.4V~10V - 0.5 5 uA Ripple Rejection All H1117 Series f=120MHz, V IN -VO=3V+1.5Vpp, CO=22uF - 62 - dB Temperature Drift H1117-Fix T J=0~25oC- 0 . 5 - % H1117-Adj T J=0~25oC- 2 - % Note: 1. Specification applies over the full operating junction temperature range, 0~125oC 2. H1117-Adj require a minimum load current for ±3% regulation 3. Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage.

MICROELECTRONICS CORP. Spec. No. : IC200401 Issued Date : 2004.02.01 Revised Date : 2005.07.14 Page No. : 3/8 H1117 Series HSMC Product Specification Characteristics Curve Ripple Rejection & Frequency 10 100 1000 10000 100000 Frequency (Hz) Ripple Rejection (dB) ... Vin-Vout(ic)=3VDC+1Vrms Iout=100mA Tj=25oC Current Range Ouput Current（A） Output Voltage（V） Vin-Vout=3VDC Tj=25oC Output Voltage Change & Temperature -0.6 -0.4 -0.2 0.2 0.4 0.6 0 50 100 150 200 Temperature (oC) ∆V/Vout (%) Iout=10mA Dropout Voltage & Output Current 1.06 1.08 1.10 1.12 1.14 1.16 1.18 1.20 1.22 0 200 400 600 800 1000 1200 1400 Iout (mA) Dropout Voltage (V) Start Time 0 100 200 300 400 500 Time (uS) Vinput 0mA, Voutput 1A, Voutput Load Transient Response -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0 5 10 15 20 25 30 35 40 45 50 Time (uS) Output Voltage Deviation (V) ... 1.0 0.5 Load Current (A) Vin-Vout=1.5V Tj=25oC

MICROELECTRONICS CORP. Spec. No. : IC200401 Issued Date : 2004.02.01 Revised Date : 2005.07.14 Page No. : 4/8 H1117 Series HSMC Product Specification Applications Description

  • Output Voltage Adjustment Like most regulators, H1117 series regulate the output by comparing the output voltage to an internally generated reference voltage. On the adjustable version, the VREF is available externally as 1.25V between VOUT and ADJ. The voltage ratio formed by R1 and R2 should be set to conduct 10mA (minimum output load). The output voltage is given by the following equation: VOUT =VREF (1+R2/R1) + IADJ R2 On fixed versions of H1117 series, the voltage divider is provided internally.
  • Thermal Protection H1117 series have thermal protection which limits junction temperature to 150°C. However, device functionality is only guaranteed to a maximum junction temperature of +125°C. The power dissipation and junction temperature for H1117 in all packages given by P D=(VIN - VOUT) IOUT, TJUNCTION=TAMBIENT+(PDxθJA), Note: TJUNCTION must not exceed 125°C
  • Current Limit Protection H1117 series are protected against overload conditions. Current protection is triggered at typically 1.5A.
  • Stability And Load Regulation H1117 series require a capacitor from V OUT to GND to provide compensation feedback to the internal gain stage. This is to ensure stability at the output terminal. Typically, a 10uF tantalum or 50uF aluminum electrolytic is sufficient. Note : It is important that the ESR for this capacitor does not exceed 0.5Ω . The output capacitor does not have a theoretical upper limit and increasing its value will increase stability. C OUT = 100 uF or more is typical for high current regulator design. H1117 series load regulation are limited by the resistance of the wire connecting it to the load(RP). For the adjustable version, the best load regulation is accomplished when the top of the resistor divider(R 1) is connected directly to the output pin of the H1117 series. When so connected, RP is not multiplied by the divider ratio. For fixed output versions, the top of R1 is internally connected to the output and ground pin can be connected to low side of the load as a negative side sense if, so desired.
  • Thermal Consideration The H1117 series contain thermal limiting circuitry designed to protect itself for over-temperature conditions. Even for normal load conditions, maximum junction temperature ratings must not be exceeded. As mention in thermal protection section, we need to consider all sources of thermal resistance between junction and ambient. It contains junction-to-case, case-to- heat-sink interface and heat sink resistance itself. An additional heat sink is applied externally sometimes. It can increase the maximum power dissipation. For example, the equivalent junction temperature of 300mA output current is 115°C without external heat sink. Under the same junction temperature IC can operates 500mA with an adequate heat sink. Therefore, to attach an extra heat sink is recommended. Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below the die. The bonding wires are appending paths. The former is the lowest resistance path. Proper mounting is required to ensure the best possible thermal flow this area of the package to the heat sink. Thermal compound at the case-to-heat-sink interface is strongly recommended. The case of all devices in this series is electrically connected to the output. Therefore, if the case of the device must be electrically isolated, a thermally conductive spacer can be used, as long its thermal resistance is considered.
  • Protection Diode (The figure is shown as Regulator with Reverse Diode Protection in advanced applications) In general operation, H1117 series don’t need any protection diodes. From the cross-section structure of H1117 sries, the output pin is connected to P+ substrate, and the input pin is connected to N- well. There is a parasitic reverse diode between them. It can handle microsecond surge currents of 5A to 10A. Even with large output capacitance, it is very difficult to get those values of surge currents in normal operation. Only with high value output capacitors, such as 1000uF. And with the input pin instantaneously shorted to ground. can damage occur. A crowbar circuit at the input of the H1117 series can generate those kinds of currents, and a diode from output to input is recommended. Normal power supply cycling or even plugging and unplugging in the system will not generate currents large enough to do any damage. RL Connect R1 to Case Connect R2 to Load OutIn Adj R P Parasitic Line Resistance V IN VOUT =VREF (1+R2/R1) + IADJ R2 VIN V REF In Out ADJ IADJ 10uA VOUT

MICROELECTRONICS CORP. Spec. No. : IC200401 Issued Date : 2004.02.01 Revised Date : 2005.07.14 Page No. : 5/8 H1117 Series HSMC Product Specification SOT-223 Dimension SOT-89 Dimension 321 A B C D E F G H I 321 F B A C D E G H a1 I Marking: Date Code Control Code HS J 1117- Product Series Pb Free Mark Pb-Free: " . " (Note) Normal: None Note: Green label is used for pb-free packing Pin Style: 1.ADJ/GND 2.VOUT 3.VIN Material:

  • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM Min. Max. A 2.90 3.10 B 6.70 7.30 C 3.30 3.70 D 0.60 0.80 E *2.30 - F 6.30 6.70 G 1.40 1.80 H 0.25 0.35 I 0.02 0.10 a1 *13 o - a2 0 o 10 o *: Typical, Unit: mm DIM Min. Max. A 4.40 4.60 B 4.05 4.25 C 1.50 1.70 D 2.40 2.60 E 0.36 0.51 F *1.50 - G *3.00 - H 1.40 1.60 I 0.35 0.41 *: Typical, Unit: mm Marking: Date Code Control Code H111 Pb Free Mark Pb-Free: " " (Note) Normal: None7 Product Series ADJ(A),1.8(B),2.5(C),3.3(D),5(E) Note: Green label is used for pb-free packing Pin Style: 1.ADJ/GND 2.VOUT 3.VIN Material:
  • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 3-Lead SOT-89 Plastic Surface Mounted Package 3-Lead SOT-223 Plastic Surface Mounted Package

MICROELECTRONICS CORP. Spec. No. : IC200401 Issued Date : 2004.02.01 Revised Date : 2005.07.14 Page No. : 6/8 H1117 Series HSMC Product Specification TO-252 Dimension M N A L C 321 G H F A B C D E J K a2 a2 L F G H I y2 y2 M O N y1y1 3-Lead TO-252 Plastic Surface Mount Package Marking: Control CodeDate Code HJ

1117 Product Series

ADJ(A),1.8(B),2.5(C) 3.3(D),5(E) Pb Free Mark Pb-Free: " . " (Note) Normal: None Note: Green label is used for pb-free packing Pin Style: 1.ADJ/GND 2.VOUT 3.VIN Material:

  • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM Min. Max. A 6.35 6.80 C 4.80 5.50 F 1.30 1.70 G 5.40 6.25 H 2.20 3.00 L 0.40 0.90 M 2.20 2.40 N 0.90 1.50 a1 0.40 0.65 a2 - *2.30 a5 0.65 1.05 *: Typical, Unit: mm Marking: Control CodeDate Code HJ

ADJ(A),1.8(B),2.5(C) 3.3(D),5(E) Pb Free Mark Pb-Free: " . " (Note) Normal: None Note: Green label is used for pb-free packing Pin Style: 1.ADJ/GND 2.VOUT 3.VIN Material:

  • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 3-Lead TO-252 Plastic Surface Mount Package DIM Min. Max. A 6.40 6.80 B - 6.00 C 5.04 5.64 D- * 4 . 3 4 E 0.40 0.80 F 0.50 0.90 G 5.90 6.30 H 2.50 2.90 I 9.20 9.80 J 0.60 1.00 K - 0.96 L 0.66 0.86 M 2.20 2.40 N 0.70 1.10 O 0.82 1.22 a1 0.40 0.60 a2 2.10 2.50 y1 - 5 o y2 - 3 o *: Typical, Unit: mm

MICROELECTRONICS CORP. Spec. No. : IC200401 Issued Date : 2004.02.01 Revised Date : 2005.07.14 Page No. : 7/8 H1117 Series HSMC Product Specification TO-220AB Dimension Important Notice:

  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
  • HSMC reserves the right to make changes to its products without notice.
  • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Tel: 886-3-5983621~5 Fax: 886-3-5982931 A B E G I KM OP C N H D Tab F JL DIM Min. Max. A 5.58 7.49 B 8.38 8.90 C 4.40 4.70 D 1.15 1.39 E 0.35 0.60 F 2.03 2.92 G 9.66 10.28 H - *16.25 I- * 3 . 8 3 J 3.00 4.00 K 0.75 0.95 L 2.54 3.42 M 1.14 1.40 N- * 2 . 5 4 O 12.70 14.27 P 14.48 15.87 *: Typical, Unit: mm Marking: Control CodeDate Code HE 1117 Pb Free Mark Pb-Free: " . " (Note) Normal: None Product Series ADJ(A),1.8(B),2.5(C) 3.3(D),5(E) Note: Green label is used for pb-free packing Pin Style: 1.ADJ/GND 2(Tab).VOUT 3.VIN Material:
  • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 3-Lead TO-220AB Plastic Package

MICROELECTRONICS CORP. Spec. No. : IC200401 Issued Date : 2004.02.01 Revised Date : 2005.07.14 Page No. : 8/8 H1117 Series HSMC Product Specification Soldering Methods for HSMC’s Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%±15% 2. Reflow soldering of surface-mount devices Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP)< 3 oC/sec <3 oC/sec Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) 100oC 150oC 60~120 sec 150oC 200oC 60~180 sec Tsmax to TL - Ramp-up Rate <3 oC/sec <3 oC/sec Time maintained above: - Temperature (T - Time (tL) 183oC 60~150 sec 217oC 60~150 sec Peak Temperature (TP) 240 oC +0/-5oC 260 oC +0/-5oC Time within 5oC of actual Peak Temperature (tP) 10~30 sec 20~40 sec Ramp-down Rate <6 oC/sec <6 oC/sec Time 25oC to Peak Temperature <6 minutes <8 minutes 3. Flow (wave) soldering (solder dipping) Products Peak temperature Dipping time Pb devices. 245oC ±5oC 5sec ±1sec Pb-Free devices. 260 oC +0/-5oC 5sec ±1sec Figure 1: Temperature profile tP tL Ramp-down Ramp-up Tsmax Tsmin Critical Zone TL to TP tS Preheat TL TP t 25oC to Peak Time Temperature