H1117E HSMC | Alldatasheet

Document overview

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Technical content

Features

  • Low Dropout Voltage 1.2V at 1A
  • Adjustable or Fixed Voltage
  • Maximum Line Regulation 0.45%
  • Maximum Load Regulation 0.4%
  • Adjust Pin Current Less Than 90 uA
  • Over Current Protection
  • Thermal Protection

Applications

  • High Efficiency Linear Regulators
  • 5V to 3.3V Voltage Converter
  • Battery Charger General Description The H1117E is a 1A low-dropout positive voltage regulator. It is available in fixed and adjustable output voltage versions. Over current and thermal protection are integrated onto the chip. Output current will decrease while it reaches the pre-set current or temperature limit. The dropout voltage is specified at 1.2V Maximum at full rated output current. H1117E Series provides excellent regulation over variations due to changes in line, load and temperature. H1117E is three terminal regulator and available in popular packages. Device Selection Guide Device Output Voltage Package H1117E(Adj) 1.3V to 4V H1117-3.3E 3.3 TO-220AB Absolute Maximum Ratings Parameter Symbol Maximum Units Input Voltage V IN 20 V Power Dissipation P D Internally Limited W Thermal Resistance Junction To Case TO-220AB θJC 3 °C/W Thermal Resistance Junction To Ambient TO-220AB θJA 50 °C/W Operating Junction Temperature Range T j 0 To 125 °C Storage Temperature Range T STG -65 To 150 °C Lead Temperature (Soldering) 10 Sec T LEAD 260 °C Typical Application H1117E 10uF TAN 10uF TAN 4.75V to 20V DC GND Load Input Range Depends On VO Please Refer To Electrical Characteristics.

MICROELECTRONICS CORP. Spec. No. : Preliminary Data Issued Date : 1998.07.15 Revised Date : 1999.08.01 Page No. : 2/4 HSMC Product Specification Block Diagram

Electrical Characteristics

H1117E (adj version) Parameter Symbol Test Conditions Min Typ Max Units Dropout Voltage V D IO=10mA~1A, Over Temp., ∆VO=±1% -1 1 . 2 V Current Limit I S VIN=2.75~7V, Over Temp. 1 - - A Temperature Coeff. T C VIN=2.75~7V, IO=10mA~1A - 0.005 - %/°C VIN=2.75~7V, IO=10mA~1A,Tj=25°C -5 5-Adjust Pin Current I adj VIN=2.75~7V, IO=10mA~1A, Over Temp. - - 90 Adjust Pin Current Change ∆Iadj VIN=2.75~7V, IO=10mA~1A, Over Temp. - 0.2 5 uA Temperature Stability T S VIN=5V, IO=100mA, Over Temp. - 0.5 - % Minimum Load Current I O VIN=5V - 5 10 mA RMS Output Noise V N Tj=25°C -0 . 0 0 3- % Ripple Rejection Ratio R A VIN=5V, IO=1A, Over Temp. 60 72 - dB H1117-3.3E Parameter Symbol Test Conditions Min Typ Max Units Dropout Voltage V D IO=0A~1A, Over Temp., ∆VO=±1% -1 1 . 2 V Current Limit I S VIN=4.75~7V, Over Temp. 1 - - A Quiescent Current I Q VIN=5V, IO=0A~1A,Over Temp. - 12 13 mA Temperature Coeff. T C VIN=4.75~7V, IO=0A~1A - 0.005 - %/°C Temperature Stability T S VIN=5V, IO=100mA, Over Temp. - 0.5 - % RMS Output Noise V N Tj=25°C -0 . 0 0 3- % Ripple Rejection Ratio R A VIN=5V, IO=1A, Over Temp. 60 72 - dB Current Limiting Amplifier Thermal Protection Error AMP Input Output ADJ/COM Bandcap Reference

MICROELECTRONICS CORP. Spec. No. : Preliminary Data Issued Date : 1998.07.15 Revised Date : 1999.08.01 Page No. : 3/4 HSMC Product Specification Characteristics Curve Load Regulation -0.25 -0.2 -0.15 -0.1 -0.05 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Temperature (ºC) Output Voltage deviation (%) Temperature Stability 1.238 1.24 1.242 1.244 1.246 1.248 1.25 1.252 -50 -25 0 25 50 75 100 125 Temperature (ºC) Reference Voltage(V) Minimum Operating Current -0.5 0.5 1.5 2.5 3.5 0 0.1 1 1.1 1.2 2 3 5 10 15 20 25 30 35 Input / Output Differential (V) Minimum Operating Current (mA) Ajust Pin Current -50 -25 0 25 50 75 100 125 Temperature (ºC) Adjust Pin Current (uA) Short Circuit Current 0.2 0.4 0.6 0.8 1.2 1.4 1.6 1.2 1.3 1.5 1.7 2 5 10 15 Input/Output Differential (V) Short Circuit Current (A) Dropout Voltage 0.2 0.4 0.6 0.8 1.2 1.4 Output Current (A) Minmum Input/Output Differential (V)

MICROELECTRONICS CORP. Spec. No. : Preliminary Data Issued Date : 1998.07.15 Revised Date : 1999.08.01 Page No. : 4/4 HSMC Product Specification TO-220AB Dimension *:Typical Notes : 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material :

  • Lead : 42 Alloy ; solder plating
  • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
  • HSMC reserves the right to make changes to its products without notice.
  • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 Tel : 886-3-5983621~5 Fax : 886-3-5982931 Tel : 886-3-5977061 Fax : 886-3-5979220 A B E G I KM OP C N H D Style : Pin 1.ADJ/COM 2.Vout 3.Vin 4.Vout 3-Lead TO-220AB Plastic Package Marking : HSMC Logo Part Number Date Code Product Series Rank