GTRA260502M CREE | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 5

Technical content

Features

  • GaN on SiC HEMT technology
  • Asymmetric Doherty design - Main: P1dB = 20.5 W Typ - Peak: P1dB = 35 W Typ
  • Typical pulsed CW performance, 2675 MHz, 48 V - Gain = 16.3 dB - Efficiency = 57% - Output power at P3dB = 44.5 W
  • Low thermal resistance

Description

The GTRA260502M is a 45-watt (P3dB) GaN on Sic high electron mobility transistor (HEMT) for use in multi-standard cellular power amplifier applications. It features input matching, high efficiency, and a thermally- enhanced, overmold package. Target RF Characteristics Single-carrier WCDMA Specifications (tested in Wolfspeed Doherty test fixture) VDD = 48 V, IDQ = 25 mA, POUT = 7.94 W avg, VGS(PEAK) = –4.8 V, ƒ = 2675 MHz, 3GPP , channel bandwidth = 3.84 MHz, peak/average = 8.17 dB @ 0.01% CCDF Characteristic Symbol Min Typ Max Unit Gain Gps — 16 — dB Drain Efficiency hD — 57 — % Adjacent Channel Power Ratio ACPR — –28 — dBc GTRA260502M Package PG-DFN-6.5x7-1 Preliminary GTRA260502M Thermally-Enhanced High Power RF GaN on SiC HEMT

45 W, 48 V, 2515 – 2675 MHz

Characteristic Conditions Symbol Min Typ Max Unit Drain-source Breakdown Voltage (main) VGS = –8 V, ID = TBD mA V(BR)DSS 150 — — V (peak) VGS = –8 V, ID = TBD mA V(BR)DSS 150 — — V Drain-source Leakage Current VGS = –8 V, VDS = 10 V IDSS — — 5 mA Gate Threshold Voltage (main) VDS = 10 V, ID = TBD mA VGS(th) — TBD — V (peak) VDS = 10 V, ID = TBD mA VGS(th) — TBD — V Recommended Operating Conditions Parameter Conditions Symbol Min Typ Max Unit Operating Voltage VDD 0 — 50 V Gate Quiescent Voltage VDS = 48 V, ID = TBD mA VGS(Q) — TBD — V Absolute Maximum Ratings Parameter Symbol Value Unit Drain-source Voltage VDSS 125 V Gate-source Voltage VGS –10 to +2 V Operating Voltage VDD 55 V Gate Current (main) IG TBD mA (peak) IG TBD mA Drain Current (main) ID TBD A (peak) ID TBD A Junction Temperature TJ 225 °C Storage Temperature Range TSTG –65 to +150 °C Operation above the maximum values listed here may cause permanent damage. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the component. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. For reliable continuous operation, the device should be operated within the operating voltage range (VDD) specified above. Thermal Chracteristics Thermal resistance, junction to case (TFLANGE = 70°C) Parameter Symbol Value Unit Thermal Resistance Main: XXX W CW , 48 V, IDQ = XXX mA, XXXX MHz RqJC TBD °C/W Peak: XXX W CW , 48 V, IDQ = XXX mA, XXXX MHz RqJC TBD °C/W Moisture Sensitivity Level Level Test Signal Package Temperature Unit

3 IPC/JEDEC J-STD-020 260 °C

Rev. 01, 2020-07-17 4600 Silicon Drive | Durham, NC 27703 | www.wolfspeed.com

Ordering Information

Type and Version Order Code Package Shipping GTRA260502M V1 (TBD) TBD PG-DFN-6.5x7-1, overmold TBD Pinout Diagram (bottom view) Pin Description

1 Main: Input

2 N/C

3 Peak: Input

4 Peak: Output

5 N/C

6 Main: Output

S Source (flange, bottom metallization) See next page for package mechanical specifications

Package Outline Specifications Package PG-DFN-6.5x7-1 TOP VIEW BOTTOM VIEW SIDE VIEW 3.60±0.10 [.142±.004] 6X 0.02+0.03 -0.02 [.001+.001 -.001 ] SPH 7.00 [.276] 6.50 [.256] 6X 0.90±0.10 [.035±.004] INDEX MARKING S A$C46D902E1.DWG_pg-dfn-6.5x7-1_PO_4-22-20_bn 4X 1.60 [.063] 5.31±0.10 [.209±.004] 6X 1.00±0.10 [.039±.004] 6X 0.80±0.05 [.031±.002] BA 0.05 C 0.05 0.05 C 0.05 C 0.10 C 0.08 C C

0.10 CAB

0.05 C 32 1 45 6 INDEX MARKING RIGHT VIEW 0.40 [.016] 0.40 [.016] C Diagram Notes—unless otherwise specified: 1. Interpret dimensions and tolerances per ASME Y14.5M-1994. 2. Package dimensions: 7.00mm X 6.50mm X 0.90mm 3. Primary dimensions are mm; alternate dimensions are inches 4. Pins: see Pinout Diagram previous page 5. Gold plating thickness: 0.125 – 0.350 micron [5 – 14 microinch] 6. Coplanarity applies to the terminals and all other bottom surface metallization

Rev. 01, 2020-07-17 4600 Silicon Drive | Durham, NC 27703 | www.wolfspeed.com Preliminary GTRA260502M Rev. 01, 2020-07-17 www.wolfspeed.com

Revision History

Revision Date Data Sheet Type Page Subjects (major changes since last revision) 01 2020-07-16 Preliminary All Data Sheet reflects preliminary specification for product development © 2020 Cree, Inc. All rights reserved. Wolfspeed® and the Wolfspeed logo are registered trademarks of Cree, Inc. For more information, please contact:

4600 Silicon Drive

Durham, North Carolina, USA 27703 www.wolfspeed.com/rf Sales Contact rfsales@cree.com Notes & Disclaimer Specifications are subject to change without notice. “Typical” parameters are the average values expected by Cree in large quantities and are provided for information purposes only. Cree products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. No responsibility is assumed by Cree for any infringement of patents or other rights of third parties which may result from use of the information contained herein. No license is granted by implication or otherwise under any patent or patent rights of Cree.