GADB-AKMA EVERLIGHT | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 10
Technical content
Features
․High luminous intensity output ․Oval Shape ․Well defined spatial radiation ․Wide viewing angle (2θ1/2) : 110o / 50o ․The product itself will remain within RoHS compliant version ․UV resistant epoxy Descriptions ․This precision optical performance oval LED is specifically designed for passenger information signs ․This lamp has matched radiation patterns with red and blue mixing color applications
Applications
․Color Graphic Signs ․Message boards ․Variable message signs (VMS) ․Commercial outdoor advertising Device Selection Guide LED Part No. Chip Material Emitted Color Lens Color Stopper 3474AN/GADB-AKMA/R/MS No 3474AN/GADB-AKMA/PR/MS InGaN Brilliant Green Green Diffused Yes
Everlight Electronics Co., Ltd. http\\\\:www.ev erlight.com Rev 1 Page: 2 of 10 Device Number : DT1-347-022 Prepared date:03-24-2008 Prepared by: Grace Shen Package Dimensions Stopper Type No Stopper Type Notes: ․All dimensions are in millimeters, tolerance is 0.25mm except being specified. ․Protruded resin under flange is 1.5mm Max LED. ․Bare copper alloy is exposed at tie-bar portion after cutting.
Everlight Electronics Co., Ltd. http\\\\:www.ev erlight.com Rev 1 Page: 3 of 10 Device Number : DT1-347-022 Prepared date:03-24-2008 Prepared by: Grace Shen Absolute Maximum Rating (Ta=25℃) Parameter Symbol Absolute Maximum Rating Unit Forward Current I F 30 mA Pulse Forward Current (Duty1/10@ 1KHz) IFP 100 mA Operating Temperature T opr -40 ~ +85 ℃ Storage Temperature T stg -40 ~ +100 ℃ Soldering Temperature T sol 260 ℃ Power Dissipation P d 100 mW Reverse Voltage V R 5 V Electrostatic Discharge ESD 1K V Notes: Soldering time≦5 seconds. Electro-Optical Characteristics (Ta=25℃) Parameter S ymbol Min. T yp. Max. Unit Condition Luminous Intensity I V 1740 -- 3450 mcd Viewing Angle 2θ1/2 -- X:110 Y:50 -- deg Peak Wavelength λp -- 522 -- Dominant Wavelength λd 525 -- 535 Spectrum Half width Δλ -- 35 -- nm Forward Voltage V F 2.8 -- 3.6 V IF=20mA Reverse Current I R -- -- 50 μA VR=5V Rank Combination (IF= 2 0 m A ) Rank K2 L1 L2 M1 Luminous Intensity 1740~2070 2070~2480 2480~2880 2880~3450 *Measurement Uncertainty of Luminous Intensity: ±10% Unit:mcd Rank 1 2 Dominant Wavelength 525~530 530~535 *Measurement Uncertainty of Dominant Wavelength ±1.0nm Unit:nm
Everlight Electronics Co., Ltd. http\\\\:www.ev erlight.com Rev 1 Page: 4 of 10 Device Number : DT1-347-022 Prepared date:03-24-2008 Prepared by: Grace Shen Typical Electro-Optical Characteristics Curves
Everlight Electronics Co., Ltd. http\\\\:www.ev erlight.com Rev 1 Page: 5 of 10 Device Number : DT1-347-022 Prepared date:03-24-2008 Prepared by: Grace Shen Taping Dimensions
Everlight Electronics Co., Ltd. http\\\\:www.ev erlight.com Rev 1 Page: 6 of 10 Device Number : DT1-347-022 Prepared date:03-24-2008 Prepared by: Grace Shen Taping Sizes S p e c i f i c a t i o n s A v g . T o l e r a n c e Symbol Items Symbol mm Inch (mm) Tape Feed Hole Diameter D 4.00 0.157 ±0.2 Component Lead Pitch F 2.54 0.100 ±0.3 Front-to-Read Deflection H △ 2.0 0.078 Max Feed Hole to Button of Component H1 18.5 0.729 ±1.0 Feed Hole to Overall Component Height H2 24.6 0.969 ±1.0 Lead Length after Component Removal L 11.00 0.433 Max Feed Hole Pitch P 12.70 0.500 ±0.3 Lead Location P1 5.10 0.200 ±0.7 Center of Component Location P2 6.35 0.250 ±1.2 Overall Taped Package Thickness T 1.42 0.056 Max Feed Hole Location W0 9.00 0.354 ±0.5 Adhesive Tape Width W1 13.00 0.512 ±0.5 Adhesive Tape Position W2 4.00 0.157 Max Tape Width W3 18.00 0.709 ±0.75
Everlight Electronics Co., Ltd. http\\\\:www.ev erlight.com Rev 1 Page: 7 of 10 Device Number : DT1-347-022 Prepared date:03-24-2008 Prepared by: Grace Shen Packing Specification ■ Inner Carton ■ Outside Carton CPN: P/N:XXXXXXXXXX EVERLIGHT XXX/XXXX-XXXX QTY：XXXX MADE IN TAIWAN CAT:XX HUE:XX REF:XX LOT NO： RoHS ■ Label Form Specification CPN: Customer’s Production Number P/N : Production Number QTY: Packing Quantity CAT: Rank of Luminous Intensity HUE: Rank of Dominant Wavelength REF: Reference LOT No: Lot Number MADE IN TAIWAN: Production Place ■ Packing Quantity 1. 2500 PCS/1 Inner Carton 2. 10Inner Cartons/1 Outside Carton
Everlight Electronics Co., Ltd. http\\\\:www.ev erlight.com Rev 1 Page: 8 of 10 Device Number : DT1-347-022 Prepared date:03-24-2008 Prepared by: Grace Shen Notes 1. Lead Forming During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. Lead forming should be done before soldering. Avoid stressing the LED package during leads form ing. The stress to the base may damage the LED’s characteristics or it may break the LEDs. Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs. When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs. 2. Storage The LEDs should be stored at 30°C or less a nd 70%RH or less after being shipped from Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed c ontainer with a nitrogen atmosphere and moisture absorbent material. Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. 3. Soldering Careful attention should be paid during solderi ng. When soldering, leave more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended. Recommended soldering conditions: Hand Soldering DIP Soldering Temp. at tip of iron 300 Max.℃ (30W Max.) Preheat temp. 100 Max.℃ (60 sec Max.) Soldering time 3 sec Max. Bath temp. & time 260 Max., 5 sec Max Distance 3mm Min.(From solder joint to epoxy bulb) Distance 3mm Min. (From solder joint to epoxy bulb)
Everlight Electronics Co., Ltd. http\\\\:www.ev erlight.com Rev 1 Page: 9 of 10 Device Number : DT1-347-022 Prepared date:03-24-2008 Prepared by: Grace Shen Prehead laminar wave Fluxing Recommended soldering profile Avoiding applying any stress to the lead fr ame while the LEDs are at high temperature particularly when soldering. Dip and hand soldering should not be done more than one time After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. Although the recommended soldering conditions ar e specified in the above table, dip or handsoldering at the lowest possible temperature is desirable for the LEDs. Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. 4. Cleaning When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than one minute. Dry at room temperature before use. Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on f actors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the LED.
Everlight Electronics Co., Ltd. http\\\\:www.ev erlight.com Rev 1 Page: 10 of 10 Device Number : DT1-347-022 Prepared date:03-24-2008 Prepared by: Grace Shen 5. Heat Management Heat management of LEDs must be taken into consideration during the design stage of LED application. The current should be de-rated a ppropriately by referring to the de-rating curve found in each product specification. The temperature surrounding the LED in the app lication should be controlled. Please refer to the data sheet de-rating curve. 6. ESD (Electrostatic Discharge) Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs. An ESD wrist strap, ESD shoe strap or antista tic gloves must be worn whenever handling LEDs. All devices, equipment and machinery must be properly grounded. Use ion blower to neutralize the static char ge which might have built up on surface of the LEDs plastic lens as a result of friction between LEDs during storage and handing. 7. Other Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above specification. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sh eets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. These specification sheets include material s protected under copyright of EVERLIGHT corporation. Please don’t reproduce or cau se anyone to reproduce them without EVERLIGHT’s consent. EVERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936 Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306 Tucheng, Taipei 236, Taiw an, R.O.C http:\\\\www.everlight.com