G6R7C-B01 EVERLIGHT | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 12

Technical content

Features

z Package in 12mm tape on 7” diameter reels. z Compatible with automatic placement equipment. z Compatible with infrared and vapor phase reflow solder process. z EIA std. package. z IC compatible. z Pb-free. z The product itself will remain within RoHS compliant version.

Applications

z Telecommunication: indicator and backlighting in telephone and fax. z Indicator and backlight for audio and video equipment. z Indicator and backlight for battery driven equipment. z Small indicator for outdoor applications. z Indicator and backlight in office equipment. z Flat backlight for LED, switches and symbol. z General use. Device Selection Guide Chip Type Material Emitted Color Lens Color G6 AlGaInP Brilliant Yellow Green R7 AlGaInP Dark-Red Water Clear

EVERLIGHT ELECTRONICS CO.,LTD. Device No. :DSE-932-038 Prepared date:02-Feb-2007 Prepared by: Ray Yuan 93-22/G6R7C-B01/2A0 Package Dimensions 2.7 3.4 1.8 0.5 0.15 2.7 4.5±0.4 1.5±0.15 1.41.4 4.9 0.4 1 2 4 3 Polarity G6 R7 Anode Mark Recommended Soldering Pad design. 22.4 1.5±0.15 Note: The tolerances unless mentioned is ±0.1mm ;Unit = mm

EVERLIGHT ELECTRONICS CO.,LTD. Device No. :DSE-932-038 Prepared date:02-Feb-2007 Prepared by: Ray Yuan 93-22/G6R7C-B01/2A0 Absolute Maximum Ratings @Ta=25℃ Parameter Symbol Rating Unit Reverse Voltage V R 5 V Forward Current I F 25 mA G6 Forward Current (Duty 1/10 @ 1KHz) IFP 60 mA Power Dissipation Peak Pd 60 mW Electrostatic Discharge(HBM) ESD 2000 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40~ +90 ℃ Soldering Temperature Tsol Reflow Soldering : 260 ℃ for 10 sec. Hand Soldering : 350 ℃ for 3 sec.

EVERLIGHT ELECTRONICS CO.,LTD. Device No. :DSE-932-038 Prepared date:02-Feb-2007 Prepared by: Ray Yuan 93-22/G6R7C-B01/2A0 Electro-Optical Characteristics @ Ta=25℃ Parameter Symbol Min. Typ. Max. Unit Condition G6 18.0 ----- 36.0 Luminous Intensity IV R7 28.0 ----- 57.0 mcd I F=5mA Viewing Angle 2θ1/2 ----- 130 ----- deg IF=5mA G6 ----- 575 ----- Peak Wavelength λp R7 ----- 631 ----- nm IF=5mA Dominant Wavelength λd nm IF=5mA G6 ----- 20 ----- Spectrum Radiation Bandwidth △λ R7 ----- 20 ----- nm IF=5mA G6 1.6 ----- 2.2 Forward Voltage VF R7 1.6 ----- 2.2 V I F=5mA Reverse Current IR ----- ----- 10 μA VR=5V Notes: 1.Tolerance of Luminous Intensity ±10% 2.Tolerance of Dominant Wavelength ±1nm 3.Tolerance of Forward Voltage ±0.1V

EVERLIGHT ELECTRONICS CO.,LTD. Device No. :DSE-932-038 Prepared date:02-Feb-2007 Prepared by: Ray Yuan 93-22/G6R7C-B01/2A0 B i n R a n g e O f D o m i n a n t W a v e l e n g t h Chip Bin Code Min. Max. Unit Condition 1 570.5 572.5 G6 2 572.5 574.5 1 621.0 624.5 R7 2 624.5 628.5 nm IF=5mA Bin Range Of Luminous Intensity Chip Bin Min Max Unit Condition M1 18.0 22.5 M2 22.5 28.5 G6 N1 28.5 36.0 N1 28.5 36.0 N2 36.0 45.0 R7 P1 45.0 57.0 mcd I F=5mA Bin Range Of Forward Voltage Chip Bin Min Max Unit Condition C 1.60 1.95 G6 D 1.95 2.20 C 1.60 1.95 R7 D 1.95 2.20 V I F=5mA Notes: 1.Tolerance of Luminous Intensity ±10% 2.Tolerance of Dominant Wavelength ±1nm 3.Tolerance of Forward Voltage ±0.1V

EVERLIGHT ELECTRONICS CO.,LTD. Device No. :DSE-932-038 Prepared date:02-Feb-2007 Prepared by: Ray Yuan 93-22/G6R7C-B01/2A0 Typical Electro-Optical Characteristics Curves(G6)

EVERLIGHT ELECTRONICS CO.,LTD. Device No. :DSE-932-038 Prepared date:02-Feb-2007 Prepared by: Ray Yuan 93-22/G6R7C-B01/2A0 Typical Electro-Optical Characteristics Curves(R7)

EVERLIGHT ELECTRONICS CO.,LTD. Device No. :DSE-932-038 Prepared date:02-Feb-2007 Prepared by: Ray Yuan 93-22/G6R7C-B01/2A0 Label explanation CAT: Luminous Intensity Rank HUE: Dom. Wavelength Rank REF: Forward Voltage Rank Reel Dimensions Note: The tolerances unless mentioned is ±0.1mm,Unit = mm

EVERLIGHT ELECTRONICS CO.,LTD. Device No. :DSE-932-038 Prepared date:02-Feb-2007 Prepared by: Ray Yuan 93-22/G6R7C-B01/2A0 Carrier Tape Dimensions: Loaded quantity per reel 1000 PCS/reel Note: Tolerances Unless Dimension ±0.1mm Unit = mm Moisture Resistant Packaging Label Desiccant LabelAluminum moisture-proof bag

EVERLIGHT ELECTRONICS CO.,LTD. Device No. :DSE-932-038 Prepared date:02-Feb-2007 Prepared by: Ray Yuan 93-22/G6R7C-B01/2A0 Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below. Confidence level：90% LTPD：10% No. Items Test Condition Test Hours/Cycles Sample Size Ac/Re 1 Reflow Soldering Temp. : 260℃±5℃ Min. 5 sec. 6 Min. 22 PCS. 0/1

2 Temperature Cycle

H : +100℃ 15min ∫ 5 min L : -40℃ 15min 300 Cycles 22 PCS. 0/1

3 Thermal Shock

H : +100℃ 5min ∫ 10 sec L : -10℃ 5min 300 Cycles 22 PCS. 0/1

4 High Temperature

Storage Temp. : 100℃ 1000 Hrs. 22 PCS. 0/1

5 Low Temperature

Storage Temp. : -40℃ 1000 Hrs. 22 PCS. 0/1 6 DC Operating Life IF = 20 mA / 25℃ 1000 Hrs. 22 PCS. 0/1

7 High Temperature /

High Humidity 85℃/85%RH 1000 Hrs. 22 PCS. 0/1

EVERLIGHT ELECTRONICS CO.,LTD. Device No. :DSE-932-038 Prepared date:02-Feb-2007 Prepared by: Ray Yuan 93-22/G6R7C-B01/2A0 Precautions For Use 1. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30 ℃ or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages.

2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the

storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours. 3. Soldering Condition

3.1 Pb-free solder temperature profile

120 Sec. Max. 1~5 °C / Sec. Pre-heating 180~200°C 60 Sec. Max. Above 220°C 260°C. Max. 10 Sec. Max. 1~5 °C / Sec. 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. 4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350 ℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder.

EVERLIGHT ELECTRONICS CO.,LTD. Device No. :DSE-932-038 Prepared date:02-Feb-2007 Prepared by: Ray Yuan 93-22/G6R7C-B01/2A0 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. EVERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936 Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306 Tucheng, Taipei 236, Taiw an, R.O.C http://www.everlight.com