G01

G01 PYCOM | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 27

Technical content

1.0 Overview

With WiFi, BLE and cellular LTE–CAT M1/NB1, the G01 OEM Module is the latest Pycom triple–bearer MicroPython enabled micro controller on the market today – the perfect enterprise grade IoT platform for your connected things. Create and connect your things everywhere, fast.

2.0 Features

– Powerful CPU, BLE and state of the art WiFi radio. 1KM Wifi Range – MicroPython enabled – Can be directly surface mount inside your product like a regular component – Ultra–low power usage: a fraction compared to other connected micro controllers Size 40mm x 16mm x 2.7mm 8MB flash memory ESP32 Dual Core Microcontroller and WiFi/Bluetooth 4.2 radio LTE CAT M1 / NB1 transceiver

3.0 Specifications

3.1 CPU

– Xtensa® dual–core 32–bit LX6 microprocessor(s), up to 600 DMIPS – Hardware floating point acceleration – Python multi–threading – An extra ULP–coprocessor that can monitor GPIOs, the ADC channels and control most of the internal peripherals during deep–sleep mode while only consuming 25uA.

3.2 Memory

– RAM: 520KB + 4MB – External flash: 8MB

3.3 WiFi

– 802.11b/g/n 16mbps

3.4 Bluetooth

– Low energy and classic

3.5 LTE CAT–M1/NB–IoT

– One single chip for both CAT M1 and NB1 – 3GPP release 13 LTE Advanced Pro – Supports narrowband LTE UE categories M1/NB1 – Integrated baseband, RF, RAM memory and power management – Reduced TX power class option – Peak power estimations: TX current = 420mA peak @1.5Watt RX current = 330mA peak @1.2Watt – Extended DRX (eDRX) and PSM features for long sleep duration use cases

3.6 RTC

– Running at 150kHz

3.7 Security

– SSL/TLS support – WPA Enterprise security

3.8 Hash / encryption

– SHA – MD5 – DES – AES

4.0 Block Diagram

Figure 1 – System block diagram

5.0 Pinout

Figure 2 – Module pinout diagram Note: The ESP32 supports remapping its peripherals to alternative pins. See below for a detailed list. Pinout diagram Distributed and manufactured by Pycom Ltd. Registered office: High Point, 9 Sydenham Road, Guildford, Surrey GU1 3RX, UK Copyright © 2017 by Pycom Ltd. All rights reserved. No part of this document may be reproduced, distributed, or transmitted in any form or by any means, including photocopying, recording, or other electronic or mechanical methods, without the prior written permission of Pycom Ltd, except in the case of brief quotations embodied in critical reviews and certain other noncommercial uses permitted by copyright law. T o order contact sales@pycom.io Power GND Serial Pin Analog Pin Control Physical Pin Port Pin Touch Pin DAC Pin PMW Pin Low Level Bootloader P2 + GND Boot modes and safe boot P12 + 3V3 1-3 sec Safe boot, latest firmware is selected 4-6 sec Safe boot, previous user update selected 7-9 sec Safe boot, the factory firmware is selected GND GND GNDGND GNDGND GND GND GND GND GND LTE CAT M1 / NB1 Antenna WiFi / Bluetooth Antenna P11 GPIO22 MISO U0RTS VSPIWP EMACTXD1 P10 GPIO13 SCL CLK MTCK HSPIID SDDATA3 HS2DATA3 EMACRXER ADC2_4 RTCIO14 Touch4 GPIO12 SDA MTDI HSPIQ SDDATA2 HS2DATA2 EMACTXD3 ADC2_5 RTCIO15 Touch5 GPIO2 HSPIWP ADC2_2 RTCIO12 Touch2 GPIO19 U0CTS VSPIQ EMACTXD0 GPIO27 EMACRXDV ADC2_7 RTCIO17 Touch7 GPIO5 VSPICS0 HS1DATA6 EMACRXCLK GPIO15 RX1 MTD0 HSPICS0 SDCMD HS2CMD EMACRXD3 ADC2_3 RTCIO13 Touch3 GPIO4 HSPIHD SDDATA1 HS2DATA1 EMACTXER ADC2_0 RTCIO10 Touch0 TX1 P12 GPIO21 MOSI VSPIHD EMACRXEN GPIO0 CLKOUT1 EMACTXCLK ADC2_1 RTCIO11 Touch1 GPIO1 U0TXD CLKOUT3 EMACRXD2 TX0 GPIO3 CLKOUT2 U0RXD RX0 RST ChipPU PROGRAM Port GND 3V3 Only Input pins! No pullup/pulldown internal resistance Absolute MAX per pin 12mA recommended 6mA! ADC2_6 P23 GPIO14 EMACTXD2 RTCIO16 Touch6 MTMS HSPICLK SDCLK HS2CLK P22 GPIO25 ADC2_8 EMACRXD0 RTCIO6 DAC_1 P21 GPIO26 ADC2_9 EMACRXD1 RTCIO7 DAC_2 P20 GPIO33 ADC1_5 RTCIO8 Touch8 XTAL32 P19 GPIO32 ADC1_4 RTCIO9 Touch9 XTAL32 P18 GPIO34 ADC1_6 RTCIO4 VDET1 P17 GPIO35 ADC1_7 RTCIO5 VDET2 P16 GPIO39 ADC1_3 ADCPA RTCIO3 SensVN P15 GPIO38 ADC1_2 RTCIO2 P14 GPIO37 ADC1_1 RTCIO1 P13 GPIO36 ADCPA ADC1_0 RTCIO0 SensVP GND 1V8 Outputs 1V8 while the module is in active mode, and drops to 0V during deep sleep GND Supply with a stable 3V3 power source capable of delivering at least 950mA Connected to the LTE radio LTE_CTSLTE_WAKE LTE_RX VSIM SIM_RESET SIM_CLK SIM_DATA 3.2-5.5V SDDATA0 23/01/18

6.0 Pin Details

Table 1 – Module pinout Module Pin ESP32 GPIO Pin Name Default Function ADC PWM RTC† Notes 1 – – Ground 2 – – Ground 3 – – Ground 4 – – USIM Clock 5 – – USIM I/O 6 – – Ground 7 – – Ground 8 – – Ground 9 – – Reset Active Low 10 3 P0 RX0 (Programming) Used by the bootloader and to program the module 11 1 P1 TX0 (Programming) Used by the bootloader and to program the module 12 0 P2 2* If tied to GND during boot the device will enter bootloader mode 13 4 P3 TX1 2* 14 15 P4 RX1 2* JTAG TDO, SD card CMD 15 5 – Sequans modem RX Not recommended for external use 16 27 – Sequans modem Interrupt 2* Not recommended for external use 17 19 – Sequans modem CTS Not recommended for external use 18 2 P8 2* SD card DAT0 19 12 P9 SDA 2* JTAG TDI 20 13 P10 SCL (I2C) / CLK (SPI) 2* JTAG TCK 21 22 P11 MOSI

Table 1 – Module pinout Module Pin ESP32 GPIO Pin Name Default Function ADC PWM RTC† Notes 22 21 P12 If tied to 3.3V during boot the device enters safe boot mode, JTAG MISO 23 – – Ground 24 – – Ground 25 – – WiFi/BT antenna 50 Ohm impedance required 26 – – Ground 27 – – Ground 28 – – Ground 29 36 P13 1 Input only 30 37 P14 1 Input only 31 38 P15 1 Input only 32 39 P16 1 Input only 33 35 P17 1 Input only 34 34 P18 1 Input only 35 32 P19 1 36 33 P20 1 Connected to the on–board RGB LED 37 26 P21 2* DAC 38 25 P22 2* DAC 39 14 P23 2* JTAG TMS, SD card SCLK 40 – – 3.3V input This supply should be able to source 650mA 41 – – Ground 42 – – 1.8V Output Only when the device is active, during deep sleep this drops to 0V 43 – – Ground 44 – – Ground

Table 1 – Module pinout † The pins on the RTC power domain can be used during deep sleep, specifically GPIO pins will maintain their state while in deep sleep. * ADC2 is currently not supported in the micropython firmware Module Pin ESP32 GPIO Pin Name Default Function ADC PWM RTC† Notes 45 – – USIM Reset 46 – – USIM Vcc Powers the USIM card at 1.8V 47 – – Ground 48 – – Ground 49 – – 3.2–5.5V input Powers the Sequans cellular modem 50 – – Ground 51 – – LTE CAT–M1/NB– IoT antenna 699–960 and 1710–2170Mhz depending on local carrier bands, 50 Ohm impedance required 52 – – Ground – 23 – Sequans modem TX – 18 – Sequans modem RTS

6.1 Remapping Pins

The ESP32 features comprehensive pin remapping functionality. This allows peripherals to be mapped onto almost any available GPIO pins. The above table merely shows the default assignments. For example, the default mapping has the SPI and I2C clocks overlapping, meaning both cannot be used simultaneously without remapping one to a different pin. For a detailed guide of what peripheral can be assigned to what pins please read “Appendix A – ESP32 Pin Lists” of the ESP32 datasheet.

7.0 ESP32 Peripherals

Table 2 – Peripherals Figure 3 – External RTC crystal circuits * Requires an external CAN bus transceiver, we recommend the SN65HVD230 from Texas Instruments. For a more detailed description of the ESP32 peripherals along with peripherals not currently supported by our firmware, please check the ESP32 datasheet.

7.1 RTC

Our modules by default all use the internal RC oscillator at 150kHz for the RTC. If you require better accuracy/ stability you can connect a 32.768 kHz crystal (or TCXO) externally on pins P19 and P20 (or P19 for a TXCO) Peripheral Count Pins UART 3 Remappable to any GPIO. Note: P13–18 can only be mapped to RX or CTS since they are input only. I2C 2 Remappable to any GPIO except P13–18 since they are input only and I2C is bi–directional. SPI 3 Remappable to any GPIO. Note: P13–18 can only be mapped to MISO since they are input only. CAN* 1 Remappable to any GPIO. Note: P13–18 can only be mapped to RX since they are input only. JTAG 1 TDO = P4, TDI = P9, TCK = P10, TMS = P24 PWM 1 All GPIO except P13–18 which are input only ADC 18 Fixed mapping, see Table 1, Only ADC 1 is supported in our micropython firmware. DAC 2 Only available on P21 and P22 SD 1 DAT0 = P8, SCLK = P23, CMD = P4

8.0 Programming the device

8.1 UART

By default, the modules run an interactive python REPL on UART0 which is connected to P0 (RX) and P1 (TX) running at 115200 baud. Code can be run via this interactive REPL or you can use our PyMakr plugin for Atom or Visual Studio Code to upload code to the board.

8.2 Wi–Fi

By default, the G01 also acts as a Wi–Fi access point SSID: gpy–wlan–XXXX Password: www.pycom.io Once connected to the G01’s Wi–Fi network you can access it in two ways.

8.2.1 Telnet

Running on port 23 is a telnet server. This acts in a very similar way to the UART. It presents you with an interactive REPL and can also be used to upload code via PyMakr.

8.2.2 FTP

The G01 also runs a FTP server that allows you to copy files to and from the device, include an SD card if one is connected. To connect to this FTP server, you need to use plain FTP (un–encrypted) with the following credentials: User: micro Password: python

9.0 Boot modes

9.1 Bootloader mode

In order to update the firmware of the G01 device, it needs to be placed into bootloader mode. In order to do this, P2 needs to be connected to ground when the device reboots. Once in bootloader mode you can use the Pycom firmware update tool to update to the latest official firmware. If you are developing your own firmware based on our open–source firmware, a flashing script is provided with the source code.

9.2 Safe boot

The micropython firmware features a safe boot feature that skips the boot.py and main.py scripts and goes straight to the REPL. This is useful if the device is programmed with code that causes the device to crash or become inaccessible. To access this mode, you need to connect P12 to 3.3V and reset the device. Upon entering safe boot mode, the on–board LED will begin to blink orange. Depending on the duration the pin is held at 3.3V, a different firmware will be run. Table 3 – Boot modes 0–3 Seconds 3–6 Seconds Current firmware without running boot.py or main.py Previous firmware if the firmware was uploaded via OTA (without running boot.py and main.py)

10.1 Current consumption by power modes/features running at 3.7V Table 4 – Power consumption by feature * More details can be found in section 14.2

10.0 Power

The G01 features an on–board voltage regulator that takes 3.5V – 5.5V from the VIN pin and regulates it to 3.3V. It is important to only use the 3.3V as an output and not try to feed 3.3V into this pin as this could damage the regulator. Mode Min Avg. Max Units Idle (no radios) – 37 – mA LTE Transmit – TBD – mA WiFi AP – 117 – mA WiFi client – 130 – mA Bluetooth – 113 – mA Deep sleep – 87.1 – μA

11.0 Memory Map

11.1 Flash

11.2 RAM

11.3 ROM and eFuses

Table 5 – Flash memory map Table 6 – RAM memory map Table 7 – Miscellaneous memory Name Description Start address Size NVS Non–volatile RAM area. Used by the NVS API 0x9000 0x7000 Firmware Slot 0 First firmware slot. Factory firmware is flashed here 0x10000 0x180000 OTA info Information about the current active firmware 0x190000 0x1000 Firmware Slot 1 Second firmware slot 0x1A0000 0x180000 File system 504KB file system on devices with 4MB flash 0x380000 0x7F000 Config Config area for LoRa, Sigfox and LTE 0x3FF000 0x1000 File system (2) 4MB file system on devices with 8MB flash 0x400000 0x400000 Name Description Size On–chip SRAM Internal RAM memory used by the 2 xtensa CPUs 520KB Fast RTC RAM Fast RAM area accessible by the xtensa cores during boot and sleep modes 8KB Slow RTC RAM Slow RAM area accessible by the Ultra–Low Power Coprocessor during deep sleep 8KB External pSRAM External QSPI RAM memory clocked @ 40MHz 4MBName Description Size On–chip ROM Contains core functions and boot code. 448KB eFuse 256 bits are used for the system (MAC address and chip configuration) and the remaining 768 bits are reserved for customer applications, including Flash– Encryption and Chip–ID 1kbit

12.0 WiFi

12.1 Supported features

– 802.11 b/g/n/e/i – 802.11 n (2.4 GHz), up to 150 Mbps – 802.11 e: QoS for wireless multimedia technology – WMM–PS, UAPSD – A–MPDU and A–MSDU aggregation – Block ACK – Fragmentation and defragmentation – Automatic Beacon monitoring/scanning – 802.11 i security features: pre–authentication and TSN – Wi–Fi Protected Access (WPA/WPA2/WPA2– Enterprise/Wi–Fi Protected Setup (WPS) – Infrastructure BSS Station mode/SoftAP mode – Wi–Fi Direct (P2P), P2P Discovery, P2P Group Owner mode and P2P Power Management

12.2 Specifications

Table 8 – WiFi specifications Description Min Typ. Max Unit Input Frequency 2412 – 2484 MHz Tx power Output power of PA for 72.2 Mbps 13 14 15 dBm Output power of PA for 11b mode 19.5 20 20.5 dBm Sensitivity DSSS, 1Mbps – – 98 dBm CCK, 11 Mbps – – 91 dBm OFDM, 6 Mbps – – 93 dBm OFDM, 54 Mbps – – 75 dBm HT20, MCS0 – – 93 dBm HT20, MCS7 – – 73 dBm HT40, MCS0 – – 90 dBm HT40, MCS7 – – 70 dBm MCS32 – – 89 dBm Adjacent channel rejection OFDM, 6 Mbps – 37 – dB OFDM, 54 Mbps – 21 – dB HT20, MCS0 – 37 – dB HT20, MCS7 – 20 – dB

13.0 Bluetooth

13.1 Supported features

– Compliant with Bluetooth v4.2 BR/EDR and BLE specification – Class–1, class–2 and class–3 transmitter without external power amplifier – Enhanced power control – +12 dBm transmitting power – NZIF receiver with –97 dBm sensitivity – Adaptive Frequency Hopping (AFH) – Standard HCI based on SDIO/SPI/UART – High–speed UART HCI, up to 4 Mbps – BT 4.2 controller and host stack – Service Discover Protocol (SDP) – General Access Profile (GAP) – Security Manage Protocol (SMP) – ATT/GATT – HID – All GATT–based profile supported – SPP–like GATT–based profile – BLE Beacon – A2DP/AVRCP/SPP, HSP/HFP, RFCOMM – CVSD and SBC for audio codec – Bluetooth Piconet and Scatternet

13.2 Specification

13.2.1 Receiver – Basic Data Rate

Table 9 – Receiver (basic data rate) specifications Parameter Min Typ. Max Unit Sensitivity @0.1% BER – –94 – dBm Maximum received signal @0.1% BER 0 – – dBm Co–channel C/I – +7 – dB Adjacent channel selectivity C/I F = F0 + 1 MHz – – –6 dB F = F0 – 1 MHz – – –6 dB F = F0 + 2 MHz – – –25 dB F = F0 – 2 MHz – – –33 dB F = F0 + 3 MHz – – –25 dB F = F0 – 3 MHz – – –45 dB Out–of–band blocking performance 30Mhz ~ 2000MHz –10 – – dBm 2000MHz ~ 2400MHz –27 – – dBm 2500MHz ~ 3000MHz –27 – – dBm 3000MHz ~ 12.5GHz –10 – – dBm Intermodulation –36 – – dBm

Table 10 – Receiver (basic data rate) specifications

13.2.2 Receiver – Enhanced Data Rate

Parameter Min Typ. Max Unit π/4 DQPSK Sensitivity @0.1% BER – –90 – dBm Maximum received signal @0.1% BER – 0 – dBm Co–channel C/I – 11 – dB Adjacent channel selectivity C/I F = F0 + 1 MHz – –7 – dB F = F0 – 1 MHz – –7 – dB F = F0 + 2 MHz – –25 – dB F = F0 – 2 MHz – –35 – dB F = F0 + 3 MHz – –25 – dB F = F0 – 3 MHz – –45 – dB 8DPSK Sensitivity @0.1% BER – –84 – dBm Maximum received signal @0.1% BER – –5 – dBm C/I c–channel – 18 – dB Adjacent channel selectivity C/I F = F0 + 1 MHz – 2 – dB F = F0 – 1 MHz – 2 – dB F = F0 + 2 MHz – –25 – dB F = F0 – 2 MHz – –25 – dB F = F0 + 3 MHz – –25 – dB F = F0 – 3 MHz – –38 – dB

Table 11 – Receiver (BLE) specifications

13.2.3 Receiver – Bluetooth LE

Parameter Min Typ. Max Unit Sensitivity @30.8% PER – –97 – dBm Maximum received signal @30.8% PER 0 – – dBm Co–channel C/I – +10 – dB Adjacent channel selectivity C/I F = F0 + 1MHz – –5 – dB F = F0 – 1MHz – –5 – dB F = F0 + 2MHz – –25 – dB F = F0 – 2MHz – –35 – dB F = F0 + 3MHz – –35 – dB F = F0 – 3MHz – –45 – dB Out–of–band blocking performance 30MHz ~ 2000MHz –10 – – dB 2000MHz ~ 2400MHz –27 – – dBm 2500MHz ~ 3000MHz –27 – – dBm 3000MHz ~ 12.5GHZ –10 – – dBm Intermodulation –36 – – dBm

Table 12 – Transmitter (basic data rate) specifications

13.2.4 Transmitter – Basic Data Rate

Parameter Min Typ. Max Unit RF transmit power – 0 – dBm Gain control step – ±3 – dBm RF power control range –12 – +12 dBm +20 dB bandwidth – 0.9 – MHz Adjacent channel transmit power F = F0 + 1 MHz – –24 – dBm F = F0 – 1 MHz – –16.1 – dBm F = F0 + 2 MHz – –40.8 – dBm F = F0 – 2 MHz – –35.6 – dBm F = F0 + 3 MHz – –45.7 – dBm F = F0 – 3 MHz – –40.2 – dBm F = F0 + >3 MHz – 45.6 – dBm F = F0 – >3 MHz – 44.6 – dBm Δf1avg – – 155 KHz Δf2max 133.7 KHz Δf2avg/Δf1avg – 0.92 – – ICFT – –7 – KHz Drift rate – 0.7 – KHz/50μs Drift (1 slot packet) – 6 – KHz Drift (5 slot packet) – 6 – KHz

Table 13 – Transmitter (enhanced data rate) specifications

13.2.5 Transmitter – Enhanced Data Rate

Parameter Min Typ. Max Unit RF transmit power – 0 – dBm Gain control step – ±3 – dBm RF power control range –12 – +12 dBm π/4 DQPSK max w0 – –0.72 – KHz π/4 DQPSK max wi – –6 – KHz π/4 DQPSK max |wi + w0| – –7.42 – KHz 8DPSK max w0 – 0.7 – KHz 8DPSK max wi – –9.6 – KHz 8DPSK max |wi + w0| –10 KHz π/4 DQPSK modulation accuracy RMS DEVM – 4.28 – % 99% DEVM – – 30 % Peak DEVM – 13.3 – %

8 DPSK modulation accuracy

RMS DEVM – 5.8 – % 99% DEVM – 20 % Peak DEVM – 14 – % In–band spurious emissions F = F0 + 1MHz – –34 – dBm F = F0 – 1MHz – –40.2 – dBm F = F0 + 2MHz – –34 – dBm F = F0 – 2MHz – –36 – dBm F = F0 + 3MHz – –38 – dBm F = F0 – 3MHz – –40.3 – dBm F = F0 ± >3MHz – – –41.5 dBm EDR differential phase coding – 100 – %

Table 14 – Transmitter (BLE) specifications

13.2.6 Transmitter – Bluetooth LE

Parameter Min Typ. Max Unit RF transmit power – 0 – dBm Gain control step – ±3 – dBm RF power control range –12 – +12 dBm Adjacent channel transmit power F = F0 + 1MHz – –14.6 – dBm F = F0 – 1MHz – –12.7 – dBm F = F0 + 2MHz – –44.3 – dBm F = F0 – 2MHz – –38.7 – dBm F = F0 + 3MHz – –49.2 – dBm F = F0 – 3MHz – –44.7 – dBm F = F0 + >3MHz – –50 – dBm F = F0 – >3MHz – –50 – dBm Δf1avg – – 265 KHz Δf2max 247 – – KHz Δf2avg/Δf1avg – –0.92 – – ICFT – –10 – KHz Drift rate – 0.7 – KHz/50μs Drift – 2 – KHz

14.0 LTE CAT–M1/NB–IoT

14.1 Supported features

– 12 bands supported from 699Mhz to 2690Mhz (Total worldwide support) – 3GPP release 13 LTE Advanced Pro – Supports narrowband LTE UE categories M1/NB1 – Integrated baseband, RF, RAM memory and power management – Reduced TX power class option – Extended DRX (eDRX) and PSM features for long sleep duration use cases Table 15 – LTE modem performance Parameter Min Typ. Max Unit Data rate LTE Cat M1 in 1.4 Mhz, HD–FDD – DL – 300 – kbps LTE Cat M1 in 1.4 Mhz, HD–FDD – UP – 375 – kbps LTE Cat NB1 in 200 kHz, HD–FDD – DL – 40 – kbps LTE Cat NB1 in 200 kHz, HD–FDD – UL – 55 – kbps Table 16 – Supported LTE bands Table 17 – SIM card specificiations Table 18 – Certified carriers

14.2.1 Supported LTE bands

14.3 SIM Card requirements

14.4 Certified carriers

Bands TX Frequencies RX Frequencies Low Bands 5, 8, 12, 13, 18, 19, 20, 28 699 to 915 MHz 729 to 960 MHz Mid Bands 1, 2, 3, 4 1710 to 1980 MHz 1805 to 2170 MHz Parameter Min Typ. Max Unit Form factor – Nano–SIM – – Variant – USIM – – Supply Voltage – 1.8 – v Carrier Country Network Verizon US United States LTE CAT–M1

15.0 Electrical Characteristics

15.1 Absolute maximum ratings

Table 19 – Absolute maximum ratings Parameter Symbol Min Typ. Max Unit Supply Input Voltage VIN 3.5 – 5.5 V Supply Output Current IOUT – – 1.2 A Supply Output Voltage V3V3 – 3.3 – V Storage Temperature TSTR – – – °C Operating Temperature TOPR –40 – 85 °C Moisture Sensitivity Level MSL – 1 – – Table 20 – Input/Output characteristics

15.2 Input/Output characteristics

Parameter Symbol Min Typ. Max Unit Input low voltage VIL –0.3 – 0.25×V3V3 V Input high voltage VIH 0.75×V3V3 – V3V3+0.3 V Max Input sink current ISINK – 6 12 mA Input leakage current IIL – – 50 nA Input pin capacitance Cpin – – 2 pF Output low voltage VOL 0.1×V3V3 – – V Output high voltage VOH 0.8×V3V3 – – V Max Output source current ISOURCE – 6 12 mA

16.0 Minimum Recommended Circuit

Figure 4 – Minimum required circuit

17.0 Mechanical Specifications

18.0 Recommended Land Patterns

Figure 5 – Mechanical drawing (top down view) Figure 6 – Recommended land pattern

19.0 Design Considerations

19.1 Antenna Impedance

Our OEM modules are intended to be used with a 50–ohm antenna. They are also required to be connected to the antenna by a 50–ohm grounded co–planar waveguide (as shown in the reference design below with the yellow lines) or a microstrip.

19.2 Deep sleep power

When selecting a voltage regulator for your application ensure that it has a low power mode, and that this is enabled when the device enters deep sleep. We also recommend cutting off power to all non–essential components such as LEDs, logic gates, sensors etc. when the device is in deep sleep. This can be done using the circuit shown right: This circuit uses the 1.8V output of the module to cut off supply to non–essential circuitry. The 1.8V output is only active when the module is running, when it goes to deep sleep it drops to 0V. The non–essential circuitry is then powered from the “ACTIVE_POWER” bus Figure 7 – 50–ohm impedance antenna connections Figure 8 – Power switch for deep sleep mode

19.3 Reference layout

Below you will find the designs for our universal reference board that fits all of our OEM modules. The design files can be downloaded from our website. Figure 9 – PCB layers for reference design – Units: mm

20.0 Soldering Profile

Figure 10 – Reflow soldering temperature profile The above profile is based on Alpha CVP–390 solder paste, which has been successfully tested with our devices. Table 21– Soldering profile temperatures Stage Duration/Rate Temperature Ramp to soak 2°C/s Ambient – 185°C Soak 60s 185°C Ramp to peak 1°C/s 240°C Reflow 45s >225°C Cool down 2°C/s

21.0 Ordering Information

Table 22 – Ordering information Figure 11 – Mechanical drawing of reel – Units: mm Figure 12 – Mechanical drawing of reel tape – Units: mm Figure 13 – Mechanical drawing of reel box – Units: mm Product EAN Description 0700461341598 G01 – OEM version of GPy 1.0

0700461908845 Reel of 250 G01 OEM modules

0700461908968 Reel of 500 G01 OEM modules

22.0 Packaging

22.1 Reel

22.2 Tape

22.3 Box

23.0 Certification

IC 22263–G01R CE 0700 Copies of the certificates can be found on our website.

24.0 Regulator Information

24.1 EU Regulatory Conformance

Hereby, Pycom Ltd declares that this device is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC

24.2 Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference. 2. This device must accept any interference received, including interference that may cause undesired operation. CAUTION: Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: – Reorient or relocate the receiving antenna. – Increase the separation between the equipment and receiver. – Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. – Consult the dealer or an experienced radio/TV technician for help.

24.2.1 RF Warning Statement

To comply with FCC RF exposure compliance requirements, the antennas used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co–located or operating in conjunction with any other antenna or transmitter.

24.2.2 OEM integrator conditions

This device is intended only for OEM integrators under the following conditions: 1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2. The transmitter module may not be co–located with any other transmitter or antenna. As long as the two conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end–product for any additional compliance requirements required with this module installed. To ensure compliance with all non–transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. The module is limited to OEM installation ONLY. The module is limited to installation in mobile or fixed application. We hereby acknowledge our responsibility to provide guidance to the host manufacturer in the event that they require assistance for ensuring compliance with the Part 15 Subpart B requirements.

IMPORTANT NOTE: In the event that these conditions cannot be met (for example certain laptop configurations or co–location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re– evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

24.2.3 End Product Labelling

This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labelled in a visible area with the following: “Contains FCC ID: 2AJMTG01R”. The grantee’s FCC ID can be used only when all FCC compliance requirements are met. The following FCC part 15.19 statement has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: 1. this device may not cause harmful interference and 2. this device must accept any interference received, including interference that may cause undesired operation.

24.2.4 Manual Information to the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. In the user manual of the end product, the end user has to be informed that the equipment complies with FCC radio–frequency exposure guidelines set forth for an uncontrolled environment. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate this equipment. The end user manual shall include all required regulatory information/warning as show in this manual. The maximum operating ambient temperature of the equipment declared by the manufacturer is –40~+85C Receiver category 3

25.0 Revision History

Table 23 – Document revision history Version 1.0 Initial Release