FMA500 FILTRONIC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

Preliminary Data Sheet FMA500 OC-192 MODULATOR PRE-DRIVER AMPLIFIER Phone: (408) 988-1845 http:// www.filss.com Revised: 3/15/02 Fax: (408) 970-9950 Email: sales@filss.com

  • FEATURES ♦ DC – 23 GHz Frequency Bandwidth ♦ 13 dB Small Signal Gain ♦ 4 Vpp Output Voltage ♦ -12 dB input/output return loss ♦ Chip Size: 1.18 x 1.50 mm
  • DESCRIPTION AND APPLICATIONS The Filtronic Solid State FMA500 is a high-gain pre-driver pHEMT amplifier that operates from DC to 23 GHz. This five-stage travelling wave amp lifier provides 13 dB nominal small signal gain and 4 V peak-to-peak NRZ output at bit rates to 12.5 Gb /sec. The FMA500 is designed as the pre-driver stage for OC-192 MZ modulator driv er amplifiers for optical data communication applications, and can be cascaded with the FMA501 Driver MMIC to provide 30 dB of voltage gain. The FMA500 can also be used as an EA driver amplifier or as a transimpedance amplifier (TIA) for photoreceiver applications.
  • ELECTRICAL SPECIFICATIONS @ TAmbient = 25°C (VDD = +4.0V, VGG = -3.0V; VGC = +1.5V; ZIN = ZOUT = 50Ω) Parameter Symbol Test Conditions Min Typ Max Units 3dB Operating Bandwidth BW 23 GHz Small Signal Gain S 21 13 dB Operating Current I OP 100 mA Input Return Loss S 11 -12 dB Output Return Loss S 22 -12 dB Gain Control GC V GC = 0V to 1.5V 6 dB Group Delay Variation ∆τgrp Over Bandwidth ±20 ps Rise/Fall time, 20%-80% τR/F 20 30 ps Output Voltage at Saturation V OUT 10Gb/sec, NRZ, VIN = 2Vpp 4 V Saturated Output Power P SAT VIN = 2Vpp 20 dBm

Preliminary Data Sheet FMA500 OC-192 MODULATOR PRE-DRIVER AMPLIFIER Phone: (408) 988-1845 http:// www.filss.com Revised: 3/15/02 Fax: (408) 970-9950 Email: sales@filss.com

  • ABSOLUTE MAXIMUM RATINGS Parameter Symbol Test Conditions Min Max Units Drain Voltage V DD TAmbient = 22 ± 3 °C 5.0 V Operating Current I OP TAmbient = 22 ± 3 °C 150 mA RF Input Power P IN TAmbient = 22 ± 3 °C 12 dBm Channel Operating Temperature T CH TAmbient = 22 ± 3 °C 150 ºC Storage Temperature T STG —- 6 5 1 6 5 º C Maximum Assembly Temperature (1 min. max.) TMAX —3 0 0 º C Notes:
  • Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device.
  • Recommended Continuous Operating Limits should be observed for reliable device operation.
  • This PHEMT is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices.
  • MEASURED PERFORMANCE: 10 Gb/s NRZ Eye Test (VDD = +4.0V, VGG = -3.0V; VGC = +1.5V; ZIN = ZOUT = 50Ω)

Preliminary Data Sheet FMA500 OC-192 MODULATOR PRE-DRIVER AMPLIFIER Phone: (408) 988-1845 http:// www.filss.com Revised: 3/15/02 Fax: (408) 970-9950 Email: sales@filss.com

  • ASSEMBLY DIAGRAM Notes:
  • Apply VGG first, then VGC and VDD.
  • Disconnect VGC first, then VDD and VGG when turning off.
  • Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is recommended. Ultrasonic bonding is not recommended.
  • The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150°C for 45 minutes.
  • Bond on bond or stitch bonds acceptable.
  • Conductor over conductor acceptable. Conductors must not short. Gate bias: VGG = -3.0 V Gain control: VGC = +1.5 V Inductor for drain = 300uH Chip capacitor: 100nF GND VDD=3~5V

Preliminary Data Sheet FMA500 OC-192 MODULATOR PRE-DRIVER AMPLIFIER Phone: (408) 988-1845 http:// www.filss.com Revised: 3/15/02 Fax: (408) 970-9950 Email: sales@filss.com

  • MECHANICAL OUTLINE Notes:
  • All units are in microns (µm).
  • All pads are 100 X 100 µm2.
  • HANDLING PRECAUTIONS To avoid damage to the devices care should be exercised during hand ling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500 V). Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. All information and specifications are subject to change without notice.