FCD4B14 ATMEL | Alldatasheet
Document overview
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Technical content
Features
- Sensitive Layer Over a 0.8 µm CMOS Array Image Zone: 0.4 x 14 mm = 0.02" x 0.55" Image Array: 8 x 280 = 2240 pixels Pixel Pitch: 50 µm x 50 µm = 500 dpi Pixel Clock: up to 2 MHz Enabling up to 1780 Frames per Second Die Size: 1.7 x 17.3 mm Operating Voltage: 3V to 5.5V Naturally Protected Against ESD: > 16 kV Air Discharge Power Consumption: 20 mW at 3.3V , 1 MHz, 25°C Operating Temperature Range: 0°C to +70°C: C suffix Resistant to Abrasion: >1 Million Finger Sweeps Chip-On-Board (COB) package or 20-lead Ceramic DIP available for development, with Specific Protective Layer
Applications
PDA (Access Control, Data Protection) Cellular Phones, SmartPhone (Access e-business) Notebook, PC-add on (Access Control, e-business) PIN Code Replacement Automated Teller Machine, POS Building Access Electronic Keys (Cars, Home,...) Portable Fingerprint Imaging for Law Enforcement TV Access Figure 1. Fingerchip Packages
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Table 1. Pin Description For DIP Ceramic Package
2 AVE Analog output
5 RST Digital input
6 OE Digital input
7 De0 Digital output
8 De1 Digital output
9 De2 Digital output
10 De3 Digital output
11 FPL GND
12 Do3 Digital output
13 Do2 Digital output
14 Do1 Digital output
15 Do0 Digital output
16 GND GND
17 ACKN Digital output
18 PCLK Digital input
19 TPE Digital input
20 AVO Analog output
Table 2. Pin Description For Chip-On-Board Package
3 AVO Analog output
5 TPE Digital input
6 VCC Power
8 RST Digital input
9 PCLK Digital input
10 OE Digital input
11 ACKN Digital output
12 De0 Digital output
13 Do0 Digital output
14 De1 Digital output
15 Do1 Digital output
16 De2 Digital output
17 Do2 Digital output
18 De3 Digital output
19 Do3 Digital output
20 FPL GND
21 GND GND
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no optics, no prism and no light source are required. physical effects for fingerprint sensing. software can reconstruct a full 8-bit fingerprint image, if needed. or ceramic dual-in-line package assembly. These facts contribute to a low-cost device. an easy device to include in any system for identification or verification applications. ing conditions. Long exposure to maximum ratings may affect device reliability. Table 3. Absolute Maximum Ratings (1) Table 4. Recommended Conditions Of Use
Table 5. Resistance Table 6. Specifications
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Table 7. 5V. Power supply = +5V; Tamb =2 5°C; FPCLK = 1 MHz; Duty cycle = 50%; Cload 120 pF on digital outputs, analog outputs disconnected otherwise specified.
Table 8. 3.3V. Power supply = +3.3V; T amb =2 5°C; FPCLK = 1 MHz; Duty cycle = 50%;
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Table 9. Switching Performances. Tamb =2 5°C; FPCLK = 1 MHz; Duty cycle = 50%; Table 10. 5.0V. All power supplies = +5 V Table 11. 3.3V. All power supplies = +3.3 V
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Figure 4. Output Enable Figure 5. No data change rent, to reduce the noise level on the power supply.
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the pixel into digital data that can be used by a processor.
- Send 4 clock pulses (due to pipe-line)
- Send clock pulses to skip the first frame
Figure 8. Start Sequence output at a time, a system must send 281x4 = 1124 clock pulses to read one frame. Reset must be low when reading the frames. Clock is taken into account on the falling edge and data are output on the rising edge. to perform using read/write mode. for the analog to digital conversion).
bit is bit #3, least significant is bit #0. Figure 9. Pixel Order first pixel. So, 280 true columns + 1 dummy column are read for each frame. perature information on the last two bytes. pulses), so it is an easy pattern to recognize for synchronization purposes.
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1962C–01/02 Thermometer The dummy bytes DB3 and DB4 contains some internal and temperature information. The even nibble nnnn in DB3 can be used to measure an increase (or decrease) of the chip temperature, using the difference between two measures of the same physical device. The following table gives values in Kelvin. For code 0 and 15, the absolute value is a minimum (saturation). When the image contrast becomes low because of a low temperature difference between the finger and the sensor, it is recommended to use the temperature stabiliza- tion circuitry to increase the temperature of two codes (i.e. from 8 to 10), to get at least an increase >1.4 Kelvin of the sensor. This enables to recover enough contrast to get a proper fingeprint for recognition purpose. nnnn Decimal nnnn Binary Temperature differential with code 8 in Kelvin 15 1111 11.2 14 1110 8.4 13 1101 7 12 1100 5.6 11 1011 4.2 10 1010 2.8 91 0 0 1 1.4 81 0 0 0 0 70 1 1 1 -1.4 60 1 1 0 -2.8 50 1 0 1 -4.2 40 1 0 0 -5.6 30 0 1 1 -7 20 0 1 0 -8.4 10 0 0 1 -11.2 00 0 0 0 <- 1 6 . 8
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Nap Mode Several strategies are possible to reduce power consumption when not in use. The simplest and most efficient is to cut the power supply, using external means.
- Set the reset RST pin to high. Doing this, all analog sections of the device are
- Set the clock PCLK pin to high (or low), thus stopping the entire digital section.
- Set the TPE pin to low or disconnect TPP to stop the temperature stabilization
- Set Output Enable OE pin to high, so that output are forced in HiZ.
Figure 12. Nap Mode power supply, generally less than the tested value. (i.e. it is almost the same from 3V to 5.5V). machine (120 pF load on each I/O), 50 pF maximum is recommended. the internal equivalent resistance given in table 4 and a possible external resistor. in one second. With the 30 Ω typical value, 300 mW is 3V applied on TPP.
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Figure 15. DIL Package (all dimensions in mm)
1962C–01/02
Ordering Information
FC D4B14 C — Atmel prefix Package C: DIP Ceramic 20 pins CB: Chip On Board (COB) Quality level — : st andard Temperature range Com: 0° to +70°C C FingerChip family Device type
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