FC654601 PANASONIC | Alldatasheet
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Ver. AED This product complies with the RoHS Directive (EU 2002/95/EC). Publication date: January 2011 1 FC654601 Silicon N-channel MOS FET For switching circuits Overview FC654601 is N-channel dual type small signal MOS FET employed small size surface mounting package. Features Low drain-source ON resistance: RDS(on) typ. = 6 W (VGS = 4.0 V) High-speed switching Small size surface mounting package: SMini6-F3-B Contributes to miniaturization of sets, reduction of component count. Eco-friendly Halogen-free package Packaging Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard) Absolute Maximum Ratings Ta = 25°C Parameter Symbol Rating Unit FET1 FET2 Drain-source surrender voltage VDSS 60 V Gate-source surrender voltage VGSS ±12 V Drain current ID 100 mA Peak drain current IDP 200 mA Overall Total power dissipation PT 150 mW Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C Package Code SMini6-F3-B Pin Name 1: Source (FET1) 4: Source (FET2) 2: Gate (FET1) 5: Gate (FET2) 3: Drain (FET2) 6: Drain (FET1) Marking Symbol: V6 Internal Connection (D2) (S2) (S1) (G1) (D1) (G2) FET1 FET2
Ver. AED This product complies with the RoHS Directive (EU 2002/95/EC). FC654601 Electrical Characteristics Ta = 25°C±3°C Parameter Symbol Conditions Min Typ Max Unit Drain-source surrender voltage VDSS ID = 1 mA, VGS = 0 60 V Drain-source cutoff current IDSS VDS = 60 V, VGS = 0 1.0 mA Gate-source cutoff current IGSS VGS = ±10 V, VDS = 0 ±10 mA Drain-source ON resistance RDS(on) ID = 10 mA, VGS = 2.5 V 8 15 W ID = 10 mA, VGS = 4.0 V 6 12 W Forward transfer admittance Yfs ID = 10 mA, VDS = 3.0 V 20 60 mS Short-circuit input capacitance (Common source) Ciss VDS = 3 V, VGS = 0, f = 1 MHz 12 pF Short-circuit output capacitance (Common source) Coss 7 pF Reverse transfer capacitance (Common source) Crss 3 pF Turn-on time * ton VDD = 3 V, VGS = 0 V to 3 V, ID = 10 mA 100 ns Turn-off time * toff VDD = 3 V, VGS = 3 V to 0 V, ID = 10 mA 100 ns Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Test circuit VDD = 3 V ID = 10 mA RL = 300 Ω VOUT VIN D G S 50 Ω VIN 90% 10% 10% 90% VOUT ton toff VGS = 0 V to 3 V
Ver. AED This product complies with the RoHS Directive (EU 2002/95/EC). FC654601 ID VDS ID VGS RDS(on) VGS 100 FC654601_ ID-VDS Drain-source voltage VDS (V) Drain current ID (mA) 2.1 V 2.5 V VGS = 4.0 V 1.8 V Ta = 25°C 10−3 10−2 10−1 102 FC654601_ ID-VGS Gate-source voltage VGS (V) Drain current ID (mA) Ta = 85°C −30°C 25°C VDS = 3 V 0 102 4 6 8 10−1 102 FC654601_ RDS(on)-VGS Gate-source voltage VGS (V) Drain-source ON resistance RDS(on) (Ω) Ta = 25°C ID = 0.01 A FC654601_ RDS(on)-ID Drain current ID (mA) Drain-source ON resistance RDS(on) (Ω) 1 1 0 1 02 10−1 102 10−1 VGS = 2.5 V 4.0 V Ta = 25°C 0 105 15 2 0 FC654601_Ciss , Crss , Coss -VDS Drain-source voltage VDS (V) Short-circuit input capacitance (Common source) Ciss , Reverse transfer capacitance (Common source) Crss , Short-circuit output capacitance (Common source) Coss (pF) Ciss Crss Coss Ta = 25°C FC654601_|Yfs|-ID Forward transfer admittance |Yfs | (S) Drain current ID (mA) 10−3 10−2 10−1 1 1 0 1 02 103 Ta = 25°C VDS = 3 V RDS(on) ID PT Ta Ciss , Crss , Coss VDS Yfs ID 0 40 12080 160 100 200 150 FC654601_ PT-Ta Total power dissipation PT (mW) Ambient temperature Ta (°C)
Ver. AED This product complies with the RoHS Directive (EU 2002/95/EC). FC654601 SMini6-F3-B Unit: mm (0.65) (0.65) 2.0 ±0.1 52.1 ± 01.0 1.2 ± 1.0 6 5 4 321 01.0ot0 )524.0( 0.13 +0.05 −0.020.20 ±0.05 1.3 ±0.1 7.0 ± 1.0 )51.0(
Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or im- provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202