ES2A HDSEMI | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

Features

o

  • VRRM 50V-600V
  • High surge current capability

Applications

  • Rectifier From A To JX Marking Polarity: Color band denotes cathode Glass passivated chip ● ES2X H igh Diode Semiconductor SMB er Notes: copper pad areas ES2A THRU ES2J Electrical Characteristics (Ta=25℃ Unless otherwise specified） ES2 Item Symbol Unit Test Conditions A B C D F G H J Repetitive Peak Reverse Voltage V RRM V 50 100 150 200 300 400 500 600 Average Forward Current I F(AV) A 60HZ Half-sine wave, Resistance load, T L =110℃ 2.0 Surge(Non-repetitive)Forward Current I FSM A 60Hz Half-sine wave ,1 cycle , Ta =25℃ Junction Temperature T J ℃ -55~+150 Storage Temperature T STG ℃ -55 ~ +150 ES2 Item Symbol Unit Test Condition A B C D F G H J Peak Forward Voltage V F V I F Maximum reverse recovery time t rr ns I F =0.5A,I R =1.0A,I rr =0.25A 35 I RRM1 Ta =25℃ 5.0 Peak Reverse Current I RRM2 μA V RM RRM Ta =100℃ 100 R θJ-A Between junction and ambient 75 Thermal Resistance(Typical) R θJ-L ℃/W Between junction and terminal 20 Maximum RMS V RMS V Vo ltage 35 70 105 140 210 280 350 420

H igh Diode Semiconductor V R D R L I F IF I R I RR t t rr I FIG.5: Diagram of circuit and Testing wave form of reverse recovery time FIG.1: FORWARD CURRENT DERATING CURVE IO(A) 60Hz Resistive or Inductive Load (7.0mm×7.0mm)Copper Pad Areas TL( 70 90 110 130 150 0.5 1.0 1.5 2.0 2.5 3.0 3.5 IFSM(A) Number of Cycles FIG.2: MAXIMUM NON-REPETITIVE FORWARD URGE CURRENT 8.3ms Single Half Sine Wave 1 10 100 IF(A) FIG.3: TYPICAL FORWARD CHARACTERISTICS 0.01 VF(V) 0.4 TJ=25 Pulse width=300us 1% Duty Cycle 0.1 1.0 100 ES2A-D ES2F-G ES2H-J FIG.4 TYPICAL REVERSE CHARACTERISTICS Voltage(%) IR(uA) Tj=150 0 20 40 60 80 100 0.1 1.0 100 1000 Tj=25 Tj=100 10000 Tj=125

H igh Diode Semiconductor Dimensions in inches and (millimeters) 0.087 (2.20) 0.071 (1.80) 0.180(4.57) 0.160(4.06) 0.155(3.94) 0.130(3.30) 0.060(1.52) 0.030(0.76) 0.220(5.59) 0.205(5.21) 0.012(0.305) 0.006(0.152) 0.008(0.203)MAX. 0.096(2.44) 0.084(2.13) 4.26 1.8 SMB SMB

Reel Taping Specifications For Surface Mount Devices-SMB H igh Diode Semiconductor