ERJB1

ERJA1AJ102U PANASONIC | Alldatasheet

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Technical content

Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. High Power Chip Resistors / Wide Terminal Type E R J A A 6 7 J U Thick Film Chip Resistors Product Code Size, Power Rating Type : inches A1 : 2512 B1 : 2010 B2 : 1206 B3 : 0805 Resistance Value Region A B C D Resistance Value Packaging Methods U V ERJB2 ERJB3 ERJA1 ERJB1 Code Packaging Type Punched Carrier Taping 4m m pitch Embossed Carrier Taping 4m m pitch 10 /L50529< R 0.22 /L50529< R <10 /L50529 0.01 /L50529 < R<0 . 2 2/L50529 0.005 /L50529 < R<0 . 0 1/L50529 Resistance Tolerance ✽ F G J ± 1% ± 2% ± 5% The first two digits are significant figures of resistance and the third one denotes number of zeros following. Decimal point is expressed by “R”. (ex.) 222 /L525102.2 k/L50529 4R7 /L525104.7 /L50529 Power R. 1.33 W 0.5 W 0.33 W, 0.5 W (R < 1 /L50529) ✽ F: ±1% more than 100 m/L50529 (ERJA1) ±1% more than 10 m/L50529 (ERJB1, ERJB2) ±1% more than 20 m/L50529 (ERJB3) E R J A C 6 7 J R Thick Film Chip Resistors Product Code C D Resistance Value U 0.01 /L50529 < R<0 . 2 2/L50529 0.005 /L50529 < R< 0.01 /L50529 Resistance Tolerance ± 1% ± 2% ± 5% Decimal point is expressed by “R” with three figures following it. (ex.) R015 /L52510 0.015 /L50529=1 5m /L50529 Resistance Value Region ✽ F G J Packaging Methods U V ERJB2 ERJB3 ERJA1 ERJB1 Code Packaging Type Punched Carrier Taping 4m m pitch Embossed Carrier Taping 4m m pitch ✽ F: ±1% more than 100 m/L50529 (ERJA1) ±1% more than 10 m/L50529 (ERJB1, ERJB2) ±1% more than 20 m/L50529 (ERJB3) Size, Power Rating Type : inches A1 : 2512 B1 : 2010 B2 : 1206 B3 : 0805 Power R. 1.33 W 0.5 W 0.33 W, 0.5 W (R < 1 /L50529) High Power Chip Resistors / Wide Terminal Type 2512, 2010, 1206, 0805 Type: ERJ A1, B1, B2, B3 ■ Features

• High solder-joint reliability by wide terminal con struc tion
• Excellent heat dissipation characteristics by wide terminal construction ■ Explanation of Part Numbers ■ Recommended Applications
• Automotive electronic circuits including ECUs (Electrical control unit), anti-lock breaking systems and air-bag systems
• Current sensing for power supply circuits in a variety of equipment
• If the case of Resistance value is lower than 100 m /L50529 Oct. 2008

High Power Chip Resistors / Wide Terminal Type Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Protective coating Thick film resistive element Electrode (Inner) Electrode (Between) Electrode (Outer) Alumina substrate l03 bb TL aa W B2 B1 A110–φD W B2 C P TL 102 RR RR R RR R Rl0 bb TL aa W R R20 bb a a TL W R R ■ Construction (Example : ERJA1 type) ■ Dimensions in mm (not to scale) ■ Circuit Confi guration ERJA1 type ERJB1 type ERJA1 type Mass (Weight) [1000 pcs.] : 40 g (ERJA1 type) : 27 g (ERJB1 type) : 11 g (ERJB2 type) : 4.8 g (ERJB3 type) <Marking Confi guration> Resistance value is shown by three or four fi gures. The ma rking is indicated on produc ts with a resistance of 10 ohm higher. Di men sions (mm) LWT a b Di men sions (mm) LWTA 1 B1 Di men sions (mm) A2 B2 P φDC +0.10 0.4 min.–0.20 ERJB2 type ERJB3 type LWT a b 5 m/L50529<R<10 m/L50529 10 m/L50529<R<220 m/L50529 0.50±0.20220 m/L50529<R<1 M/L50529 0.20±0.20 ERJB1 type (Unit : mm) ERJB2 type Di men sions (mm) LWT a b ERJB3 type Oct. 2008

Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. High Power Chip Resistors / Wide Terminal Type –60 –40 –20 0 20 40 60 80 100 120 140 160 180 100 70 °C 155 °C Ambient Temperature (°C) Rated Load (%) –55 °C Power Derati ng Curve For resistors operated in ambient temperature above 70 °C, powe r rating shall be de rated in accordance with the fi gure on the right. (1) Rate d Continuous Working Voltage (RCWV) shall be de ter mined from RCWV=/L50496Power Rating /L1154 Re sis tance Values , or Limiting Element Voltage (max. RCWV ) list ed above, wh ichever less. (2) Overload (Short-tim e Overload) Test Voltage (SOTV) shall be de termined from SOTV=2.5 /L1154 Power Rating or max. Over load Volt age list ed above which ev er less. ■ Ratings Type (inches) ERJA1 (2512) ERJB1 (2010) ERJB2 (1206) ERJB3 (0805) Resistance Range (/L50529) 10 m to 10 k (E24 series standard) 5 m to 1 M 5 m to 9 m : 1 m /L50529 step 10 m to 1 M : E24 series standard 20 m to 10 (E24 series standard) Resistance Tolerance (%) ±1 ✽, ±2 , ±5 ✽±1 % more than 100 m/L50529 ±1 ✽, ±2 , ±5 ✽±1 % more than 10 m/L50529 ±1, ±2, ±5 Power Rating at 70 °C (W) 1.33 1 0.5 0.33, 0.5 (R < 1 /L50529) Limiting Element Voltage (Maximum RCWV) (1) (V) 200 150 Maximum Overload Voltage(2) (V) 400 200 Temperature Coeffi cient Resistance (T.C.R.) R <22 m/L50529 ±350 ±350 0 to +300 R <56 m/L50529 : 0 to +300 56 m/L50529 < R < 1.2 /L50529 : 0 to +200 1.2 /L50529 < R < 10 /L50529 : ±100 (±1 % products) ±200 (±2 %, ±5 % products) 22 m/L50529< R <47 m/L50529 ±200 0 to +200 47 m/L50529< R <100 m/L50529 ±150 0 to +150 100 m/L50529< R <1 /L50529 ±100 (±1 % products) ±200 (±2 %, ±5 % products) 0 to +150 (±1 % products) 0 to +200 (±2 %, ±5 % products) 1 /L50529<R ±100 (±1 % products) ±200 (±2 %, ±5 % products) Category Temperature Range (Operating Temperature Range) (°C) –55 to + 155 ʢʣ Oct. 2008

High Power Chip Resistors / Wide Terminal Type Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. φB W T φA φC T T Punched Carrier Embossed Carrier A P0P2P1 φD0 φD1 (Only Emboss) B F W E 6.4

0.6 Land pattern

Unit : mm 1.71.7 Land pattern Unit : mm Land pattern Unit : mm 5.0 0.75 1.31.3 0.70 0.950.95 3.2 Land pattern Unit : mm 0.55 0.850.85 2.0 ■ Packaging Methods (Taping)

• Standard Quantity Type (inches) Kind of Taping Pitch (P 1)Q u a n t i t y ERJA1 (2512) Embossed Carrier Taping 4 mm 4000 pcs./reel ERJB1 (2010) 5000 pcs./reelERJB2 (1206) Punched Carr ier TapingERJB3 (0805)
• Taping Reel
• Carrier Tape
• ERJA1 type ● ERJB1 type ■ Recommended Land Pattern Type φA φB φCW T ERJA1 ERJB1 ERJB2 9.0±0.10 11.4±0.10 ERJB3 Type A B W F E P 1 P2 P0 φD0 T φD1 ERJA1 3.50 ±0.20 6.80±0.20 1.10±0.20 1.50+0.10 (Unit : mm) (Unit : mm)
• ERJB2 type ● ERJB3 type Jul. 2008

Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. High Power Chip Resistors / Wide Terminal Type Preheating Peak Heating Temperature Time Temperature Time Preheating 140 °C to 160 °C 60 s to 120 s Main heating Above 200 °C 30 s to 40 s Peak 235 ± 5 °C max. 10 s Temperature Time Preheating 150 °C to 180 °C 60 s to 120 s Main heating Above 230 °C 30 s to 40 s Peak max. 260 °C max. 10 s For soldering F or lead-free soldering Temperature Time Temperature Time Preheating 140 °C to 180 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s Soldering 245 ± 5 °C 20 s to 30 s max. 260 °C max. 10 s ■ Recommended Soldering Conditions Recommendations and precautions are described below.

• Recommended soldering conditions for refl ow For soldering (Example : Sn/Pb) For lead-free soldering (Example : Sn/Ag/Cu)
• Recommended soldering conditions for fl ow
• Refl ow soldering shall be performed a maximum of two times.
• Please contact us for additional information when used in conditions other than those specifi ed.
• Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore ac tu al use. Safety Precautions The following ar e precautions for individual products. Please also refer to the precautions common to Fixed Resistors shown on page ER2 of this catalog. 1. Take measures against mechanical stress during and after mounting of High Power Chip Resistors (here af ter called the resistors) so as not to damage their electrodes and protective coatings. 2. If a transien t load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired. 3. Do not us e halogen-based or other high-activity fl ux. Otherwise, the residue may impair the resistors' per for mance and/or reliability. 4. When soldering wi th a soldering iron, never touch the resistors' bodie s with the tip of the soldering iron. When using a soldering iron with a high temperature tip, fi nish soldering as quickly as possible (within three seconds at 350 °C max.). 5. As the amount of applied solder becomes larger, the mech anical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder. 6. Do not appl y shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Oth er wise, the re sis tors' protective coatings and bodies may be chipped, affecting their performance. 7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress. Jul. 2008

– ER3 – Safety Precautions (Common precautions for Fixed Resistors)  When using ou r products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject to change without prior notice.  Do not use the products beyond the specifi cations described in this catalog.  This cata log explains the quality and performance of the products as individual components. Be fore use, check and evaluate their operations when installed in your products.  Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause th e loss of human life or other signifi cant damage, such as damage to vehicles (au to mo bile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating ap pli anc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equip ment. ✽ Systems equipped with a protection circuit and a protection device ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use  These products are designed and manufactured for general and stan dard use in general elec tron ic equipment (e.g. AV equipm ent, home el ectric ap pli anc es, offi ce equipment, information and com mu ni ca tion equipment)  These products are not intended fo r use in the following special conditions. Be fore using the products, care ful ly check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl 2, H2S, NH3, SO2, or NO2 4. Electric Static Discharge (ESD) Environment These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these pr oducts cause dew condensation 7. Sealing or co ating of these products or a printed circuit board on which thes e products are mounted, with resin or other materials  These products generate Joule heat when energized. Carefu lly position th ese products so that their he at will not affect the other components.  Carefully position thes e products so that their temperatures will not exceed the category temperature range due to the effect s of neighboring heat-generating com po nents. Do not mount or place heat-generating com po nents or infl ammables, such as vinyl-coated wires, near these products .  Note that non- cleaning solder, halogen-based highly active fl ux, or wate r-soluble fl ux may dete riorate the performance or reliability of the products.  Carefully select a fl ux cleaning agent fo r use after soldering. An unsuit able agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water res i dues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guar anteed for a year from the date of arrival at your company, provided that they remain packed as they were wh en delivered and stored at a temperature of 5 °C to 35 ° C and a relative humidity of 45 % to 85 %. Even wi thin the above guarantee periods, do not store these products in the fol low ing conditions. Otherwise, their elec tri cal performance and/or solderability may be dete riorated, and the packaging materials (e.g. tap ing ma te ri als) may be de formed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl 2, H2S, NH3, SO2, or NO2 2. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Oct. 2007