ERJ2BW0402

ERJ14BQF1R0U PANASONIC | Alldatasheet

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Technical content

Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Thick Film Chip Resistors / Low Resistance Type E R J R 5 6 Q F R V Thick Film Chip Resistors Product Code Size, Power Rating Type: inches 0.125 W 0.1 W 0.2 W 0.125 W 0.25 W 0.25 W 0.33 W 0.25 W 0.5 W 0.5 W Power R. Resistance Value Code S Q 0.1 /L50529to 0.2 /L50529 0.22 /L50529to 9.1 /L50529 Resistance Tolerance Code F G J Tolerance ± 1% ± 2% ± 5% Shown by 3 digits or letters. (Ex.) R22 : 0.22 /L50529 Resistance Value Packaging Methods Code Packaging Type Punched Carrier Taping 4m m pitch Embossed Carrier Taping 4m m pitch 2B : 0402 3R : 0603 3B : 0603 6R : 0805 6B : 0805 8R : 1206 8B : 1206 14R : 1210 14B : 1210 12R : 1812 1TR : 2512 Res. Value V X U Punched Carrier Taping 2m m pitch ERJ2BS ERJ2BQ ERJ3R/3B ERJ6R/6B ERJ8R/8B ERJ14R/14B ERJ12R ERJ1TR ✽ 2B : 0.22 /L50529to 1.0 /L50529 Thick Film Chip Resistors / Low Resistance Type ERJ R, B: 0402, 0603, 0805, 1206, 1210, 1812, 2512 ERJ L : 0603, 0805, 1206, 1210, 1812, 2010, 2512 Type: ERJ 2B, 3R, 3B, 6R, 6B, 8R, 8B, 14R, 14B, 12R, 1TR ERJ L03, L06, L08, L14, L12, L1D, L1W ■ Features

• Small size an d lightweight
• High reliability Metal glaze thick fi lm resistive element and three layers of electrodes
• Suitable for both refl ow and fl ow sol der ing
• Low Resistance Value ERJ2BW Type : 47 m /L50529 t o 9 1 m/L50529 ERJ6BW, 8BW Type : 10 m /L50529 to 10 0 m /L50529 ERJ2BS, 2BQ Type : 0.1 /L50529 to 1.0 /L50529 ERJ3R, 3B, 6R, 6B, 8R, 8B, 14R, 14B, 12R, 1TR Type : 0.1 /L50529 to 9.1 /L50529 ERJL03, L06, L08 Type : 47 m /L50529 to 10 0 m /L50529 ERJL14, L12 Type : 20 m /L50529 to 10 0 m /L50529 ERJL1D, L1W Type : 40 m /L50529 to 10 0 m /L50529
• Reference Standards IEC 60115-8, JIS C 5201-8 ■ Explanation of Part Numbers
• ERJ2BS/2BQ, 3R, 3B, 6R , 6B, 8R, 8B, 14R, 14B, 12R, 1TR Series Jun. 2008

Thick Film Chip Resistors / Low Resistance Type Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. E R J L K J M U Thick Film Chip Resistors Product Code Size, Power Rating Type: inches 0.1 W 0.125 W 0.25 W 0.33 W 0.5 W 0.5 W Power R. Code K U Resistance Tolerance Code F J Tolerance ± 1% ± 5% Shown by 3 digits or letters. (Ex.) 50 M:50 m/L50529,1 0 C:100 m/L50529 Resistance Value Packaging Methods Code V U Packaging Type Punched Carrier Taping 4m m pitch Embossed Carrier Taping 4m m pitch ERJL03 ERJL06 ERJL08 ERJL14 ERJL12 ERJL1D ERJL1W Std. 20 m/L50529to 100 m/L50529 Res. Value L03 : 0603 L06 : 0805 L08 : 1206 L14 : 1210 L12 : 1812 L1D : 2010 L1W : 2512 20 m/L50529,2 2m /L50529,3 3m /L50529, 39 m/L50529,4 7m /L50529,5 0m /L50529, 100 m/L50529 ✽ L03, L06, L08 : 47 m/L50529to 100 m/L50529 L1D, L1W : 40 m/L50529to 100 m/L50529 E R J B 5 6 W G R X Thick Film Chip Resistors Product Code Resistance Tolerance Code F G J Tolerance ± 1% ± 2% ± 5% Shown by 4 digits or letters. (Ex.) R047 : 0.047 /L50529=47 m/L50529 Resistance Value Packaging Methods Code Packaging Type X Pressed Carrier Taping 2m m pitch ERJ2BW ERJ6BW ERJ8BW V Punched Carrier Taping 4m m pitch Code 2BW 6BW 8BW Size:inches 0402 0805 1206 0.125 W 0.33 W 0.5 W Power Rating Resistance Value 47 m/L50529to 91 m /L50529 10 m/L50529to 100 m/L50529 10 m/L50529to 100 m/L50529 a b t W L ■ Construction ■ Dimensions in mm (not to scale) Protective coating Alumina substrate Electrode (Inner) Electrode (Between) Thick film resistive element Electrode (Outer) Type (inches) Dimensions (mm) Mass(Weight) [g/1000 pcs.]LWa b t ERJ3R ERJ3B (0603) ERJL03 1.60 ERJ6R ERJ6B (0805) ERJL06 2.00 ERJ8R ERJ8B (1206) ERJL08 3.20 ERJ14R ERJ14B (1210) ERJL14 3.20 ERJ1TR (2512)ERJL1W

• ERJL03, L06, L08, L14, L12, L1D, L1W Series
• ERJ2BW, 6BW, 8BW Series –0.20 –0. 15 –0.05 –0.05 –0.05 Mar. 2008

Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Thick Film Chip Resistors / Low Resistance Type Type (inches) Power Rating at 70 °C (W) Resistance Tolerance (%) Resistance Range (/L50529) T.C.R. Category Temperature Range (Operating Temperature Range) (°C) ERJL03 (0603) 0.1 (0.2) ✽1 ±1, ±5 47 m to 100 m ✽2 ±200 –55 to +125 ERJL06 (0805) 0.125 (0.25) ✽1 ±1,±5 47 m to 100 m ✽2 ±100 –55 to +125 ERJL08 (1206) 0.25 (0.33) ✽1 ±1, ±5 47 m to 100 m ✽2 ±100 –55 to +125 ERJL14 (1210) 0.33 ±1, ±5 20 m to 100 m ✽2 R<47 m/L50529:±300 R>47 m/L50529:±100 –55 to +125 ERJL12 (1812) 0.5 ±1, ±5 20 m to 100 m ✽2 –55 to +125 ERJL1D (2010) 0.5 ±1, ±5 40 m to 100 m ✽2 –55 to +125 ERJL1W (2512) 1± 1 , ± 5 4 0 m to 100 m ✽2 –55 to +125 Type (inches) Power Rating at 70 °C (W) Resistance Tolerance (%) Resistance Range (/L50529) T.C.R. Category Temperature Range (Operating Temperature Range) (°C) ERJ2BW (0402) ERJ3BS (0603) 0.2 ±1, ±2, ±5 0.10 to 0.20 (E24) ±300 –55 to +125ERJ3BQ (0603) 0.22 to 0.91 (E24) 1.0 to 9.1 (E24) ±200 ERJ6BW (0805) 0.33 ±1, ±2, ±5 0.01 to 0.1 (E24) R<0.015 /L50529:±300 R>0.015 /L50529:±200 –55 to +155 ERJ6BS (0805) 0.25 0.10 to 0.20 (E24) ±250 –55 to +125ERJ6BQ (0805) 0.22 to 0.91 (E24) 1.0 to 9.1 (E24) ±200 0.010 /L50529 < R < 0.020 /L50529 : ±200 0.020 /L50529 < R < 0.047 /L50529 : ±150 0.047 /L50529 < R < 0.100 /L50529 : ±100 –55 to +155 ERJ8BS (1206) 0.33 ±1, ±2, ±5 0.10 to 0.20 (E24) ±250 –55 to +125ERJ8BQ (1206) 0.22 to 0.91 (E24) 1.0 to 9.1 (E24) ±200 ERJ14BS (1210) 0.5 ±1, ±2, ±5 0.10 to 0.20 (E24) ±200 –55 to +125ERJ14BQ (1210) 0.22 to 0.91 (E24) 1.0 to 9.1 (E24) ±100 Type (inches) Power Rating at 70 °C (W) Resistance Tolerance (%) Resistance Range (/L50529) T.C.R. Category Temperature Range (Operating Temperature Range) (°C) ERJ3RS (0603) 0.1 ±1, ±2, ±5 0.10 to 0.20 (E24) ±300 –55 to +125ERJ3RQ (0603) 0.22 to 0.91 (E24) 1.0 to 9.1 (E24) ±200 ERJ6RS (0805) 0.125 ±1, ±2, ±5 0.10 to 0.20 (E24) ±250 –55 to +125ERJ6RQ (0805) 0.22 to 0.91 (E24) 1.0 to 9.1 (E24) ±200 ERJ8RS (1206) 0.25 ±1, ±2, ±5 0.10 to 0.20 (E24) ±250 –55 to +125ERJ8RQ (1206) 0.22 to 0.91 (E24) 1.0 to 9.1 (E24) ±200 ERJ14RS (1210) 0.25 ±1, ±2, ±5 0.10 to 0.20 (E24) ±200 –55 to +125ERJ14RQ (1210) 0.22 to 0.91 (E24) 1.0 to 9.1 (E24) ±100 ERJ12RS (1812) 0.5 ±1, ±2, ±5 0.10 to 0.20 (E24) ±200 –55 to +125ERJ12RQ (1812) 0.22 to 0.91 (E24) 1.0 to 9.1 (E24) ±100 ERJ1TRS (2512) 1± 1 , ±2, ±5 0.10 to 0.20 (E24) ±200 –55 to +125ERJ1TRQ (2512) 0.22 to 0.91 (E24) 1.0 to 9.1 (E24) ±100 ■ Ratings <Low resistance type> <High power type> <Standard type> ✽1 Please contact us when resistors with guaranteed high power are needed. Jun. 2008

Thick Film Chip Resistors / Low Resistance Type Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. –40 –20 0 20 40 60 80 100 120 140 160 180–60 155 °C 70 °C Ambient Temperature (°C) 100Rated Load (%) –55 °C 2B, 3R, 3B, 6R, 6B, 8R, 8B, 14R, 14B, 12R, 1TR, L03, L06, L08, L14, L12, L1D, L1W 6BW, 8BW 125 °C φB W T φA φC TT T A P0P2P1 φD0 φD1 (Only Emboss) B F W E (2 mm pitch)

• Taping Reel ■ Packaging Methods (Taping)
• Standard Quantity
• Carrier Tape Type Kind of Taping Pitch (P 1)Q u a n t i t y ERJ2BW Pressed Carrier Taping 2 mm 10000 pcs./reelERJ2BS, 2BQ Punched Carr ier TapingERJ3R, 3B, L03 4 mm 5000 pcs./reel ERJ6R, 6B, L06 ERJ8R, 8B, L08 ERJ14R, 14B, L14 Embossed Carrier Taping ERJ12R, L12 ERJL1D ERJ1TR 4000 pcs./reel ERJL1W 3000 pcs./reel (Unit : mm) Type φA φB φC WT ERJ2B 180.0+0 60 min. 13.0 ±1.0 9.0±1.0 11.4±1.0 ERJ3R, 3B, L03 ERJ6R, 6B, L06 ERJ8R, 8B, L08 ERJ14R, 14B, L14 ERJ12R, L12 13.0 ±1.0 15.4±2.0ERJL1D ERJ1TR ERJL1W (Unit : mm) –3.0 Type A B W F E P 1 P2 P0 φD0 T φD1 ERJ2BW 0.67±0.10 1.17±0.10 8.00±0.20 3.50±0.05 1.75±0.10 2.00±0.10 0.61±0.05 – ERJ3R, 3B, L03 1.10±0.10 1.90±0.05 4.00±0.10 0.70±0.05 – ERJ6BW 1.55±0.15 2.30±0.20 0.84±0.05 ERJ6R, 6B, L06 1.65±0.15 2.50±0.20 – ERJ8BW, 8R, 8B, L08 2.00±0.15 3.60±0.20 – 1.00±0.10 1.0+0.10 ERJ12R, L12 3.50±0.20 4.80±0.20 ERJL1D 2.80±0.20 5.30±0.20 ERJ1TR 3.60±0.20 6.90±0.20 Power Derati ng Curve For resistors operated in ambient temperatures above 70 °C, powe r rating shall be de rated in accordance with the fi gure on the right. Pressed Carrier Punched Carrier Embossed Carrier Feb. 2007

Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Thick Film Chip Resistors / Low Resistance Type Preheating Peak Heating Temperature Time Chip Resistor c a b Temperature Time Preheating 140 °C to 160 °C 60 s to 120 s Main heating Above 200 °C 30 s to 40 s Peak 235 ± 5 °C max. 10 s Temperature Time Preheating 150 °C to 180 °C 60 s to 120 s Main heating Above 230 °C 30 s to 40 s Peak max. 260 °C max. 10 s For soldering F or lead-free soldering Temperature Tim eT e m p e r a t u r eT i m e Preheating 140 °C to 180 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s Soldering 245 ± 5 °C 20 s to 30 s max. 260 °C max. 10 s ■ Recommended Land Pattern In case of fl ow soldering, the land width must be smaller than the Chip Resistor width to control the sol der amount properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of refl ow soldering, solder amount can be adju sted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W). ■ Recommended Soldering Conditions Recommendations and precautions are described below.

• Recommended soldering conditions for refl ow For soldering (Example : Sn/Pb) For lead-free soldering (Example : Sn/Ag/Cu)
• Recommended soldering conditions for fl ow Type (inches) Dimensions (mm) abc ERJ3R, 3B, L03 (0603) 0.7 to 0.9 2 to 2.2 0.8 to 1 ERJ8BW (1206) 1.2 4.4 to 5 1 .3 to 1.8 ERJ8R, 8B, L08 (1206) 2 to 2.4 4.4 to 5 1.2 to 1.8 ERJ14R, 14B, L14 (1210) 2 to 2.4 4.4 to 5 1.8 to 2.8 ERJL1D (2010) 3.6 to 4 6.2 to 7 1.8 to 2.8
• Refl ow soldering shall be performed a maximum of two times.
• Please contact us for additional information when used in conditions other than those specifi ed.
• Please meas ure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore ac tu al use. Safety Precautions The following ar e precautions for individual products. Please also refer to the precautions common to Fixed Resistors shown on page ER2 of this catalog. 1. Take measures against mechanical stress during and after mounting of Thick Film Chip Resistors (here af ter called the resistors) so as not to damage their electrodes and protective coatings. 2. If a transien t load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired. 3. Do not us e halogen-based or other high-activity fl ux. Otherwise, the residue may impair the resistors' per for mance and/or reliability. 4. When soldering wi th a soldering iron, never touch the resistors' bodie s with the tip of the soldering iron. When using a soldering iron with a high temperature tip, fi nish soldering as quickly as possible (within three seconds at 350 °C max.). 5. As the amount of applied solder becomes larger, the me chanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder. 6. Do not appl y shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Oth er wise, the re sis tors' protective coatings and bodies may be chipped, affecting their performance. 7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress. Feb. 2007

– ER3 – Safety Precautions (Common precautions for Fixed Resistors)  When using ou r products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject to change without prior notice.  Do not use the products beyond the specifi cations described in this catalog.  This cata log explains the quality and performance of the products as individual components. Be fore use, check and evaluate their operations when installed in your products.  Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause th e loss of human life or other signifi cant damage, such as damage to vehicles (au to mo bile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating ap pli anc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equip ment. ✽ Systems equipped with a protection circuit and a protection device ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use  These products are designed and manufactured for general and stan dard use in general elec tron ic equipment (e.g. AV equipm ent, home el ectric ap pli anc es, offi ce equipment, information and com mu ni ca tion equipment)  These products are not intended fo r use in the following special conditions. Be fore using the products, care ful ly check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl 2, H2S, NH3, SO2, or NO2 4. Electric Static Discharge (ESD) Environment These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these pr oducts cause dew condensation 7. Sealing or co ating of these products or a printed circuit board on which thes e products are mounted, with resin or other materials  These products generate Joule heat when energized. Carefu lly position th ese products so that their he at will not affect the other components.  Carefully position thes e products so that their temperatures will not exceed the category temperature range due to the effect s of neighboring heat-generating com po nents. Do not mount or place heat-generating com po nents or infl ammables, such as vinyl-coated wires, near these products .  Note that non- cleaning solder, halogen-based highly active fl ux, or wate r-soluble fl ux may dete riorate the performance or reliability of the products.  Carefully select a fl ux cleaning agent fo r use after soldering. An unsuit able agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water res i dues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guar anteed for a year from the date of arrival at your company, provided that they remain packed as they were wh en delivered and stored at a temperature of 5 °C to 35 ° C and a relative humidity of 45 % to 85 %. Even wi thin the above guarantee periods, do not store these products in the fol low ing conditions. Otherwise, their elec tri cal performance and/or solderability may be dete riorated, and the packaging materials (e.g. tap ing ma te ri als) may be de formed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl 2, H2S, NH3, SO2, or NO2 2. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Oct. 2007