ERJ-1GEF223C

ERJ-1GEJ220C PANASONIC | Alldatasheet

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Precision Thick Film Chip Resistors Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. E R J R B D V Product Code Thick Film Chip Resistors Size, Power Rating Type: inches 1R : 0201 2R : 0402 3R : 0603 6R : 0805 Power R. 0.05 W 0.063 W 0.063 W 0.1 W T.C.R. Marking T.C.R.Code H B K E ±50/L115410 –6/˚C(ppm/˚C) (1R, 2R) ±50/L115410–6/˚C(ppm/˚C) (3R, 6R) (1R, 2R) (3R, 6R) Resistance Value ✽ Resistance Tolerance Code D Tolerance ±0.5 % Packaging Methods Code C X V Pressed Carrier Taping 2m m pitch Punched Carrier Taping 2m m pitch Punched Carrier Taping 4m m pitch ERJ1R ERJ2R ERJ3R ERJ6R Packaging Type The first three digits are significant figures of resistance and the last one denotes number of zeros following. Example: 1002 /L5251010 k/L50529 Precision Thick Film Chip Resistors ERJ G : 01005, 0201 ERJ R : 0201, 0402, 0603, 0805 ERJ E : 0603, 0805, 1206, 1210, 1812, 2010, 2512 Type: ERJ XG, 1G ERJ 1R, 2R, 3R, 6R ERJ 3E, 6E, 8E, 14, 12, 1T ■ Features

• Small size and lightweight
• High reliability Metal glaze thick fi lm resistive element and three layers of electrodes
• Compatible with placement machines Taping packaging available
• Suitable for both refl ow and fl ow soldering ■ Explanation of Part Numbers
• Low Resistance Tolerance
• Reference Standards IEC 60115-8, JIS C 5201-8
• ERJ1R, 2R, 3R , 6R Series, ±0.5 % type ✽ For existing customers, we continue to use the three-digit resistance code in the part numbers. Mar. 2008

Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Precision Thick Film Chip Resistors E R J E N F V Product Code Thick Film Chip Resistors Size, Power Rating Type: inches 2R : 0402 3E : 0603 6E : 0805 8E : 1206 14 : 1210 12 : 1812 12 : 2010 1T : 2512 Power R. 0.1 W 0.1 W 0.125 W 0.25 W 0.5 W 0.75 W 0.75 W Marking MarkingCode K N S No marking (2R, 3E) 4 digit marking 4 digit marking [12(2010 inches)] The first three digits are significant figures of resistance and the 4th one denotes number of zeros following. Resistance Value ✽ Resistance Tolerance Code F Tolerance ±1% Packaging Methods Code X V U Punched Carrier Taping 2m m pitch Punched Carrier Taping 4m m pitch Embossed Carrier Taping 4m m pitch ERJ2R ERJ3E ERJ6E ERJ8E ERJ14 ERJ12 ERJ1T Packaging Type E R J G E 6 7 F 11 12 C Thick Film Chip Resistors Product Code Size, Power Rating XGN : 01005 0.031 W 1GE : 0201 0.050 W Power R. Resistance Tolerance Code F Tolerance ±1% Resistance Value Packaging Methods Code Y C Type ERJXGN Packaging Pressed Carrier Taping 2m m pitch, 20000 pcs. ERJ1GEPressed Carrier Taping 2m m pitch, 15000 pcs. Type : inches The first three digits are significant figures of resistance and the last one denotes number of zeros a b t W L

• ERJ2R, 3E, 6E, 8E, 14, 12, 1T Series, ±1 % type
• ERJXG, 1G Seri es, ±1 % type ■ Construction ■ Dimensions in mm (not to scale) Protective coating Alumina substrate Electrode (Inner) Electrode (Between) Thick film resistive element Electrode (Outer) –0.05 Type (inches) Dimensions (mm) Mass (Weight) [g/1000 pcs.]LWa b t ERJXG (01005) 0.40 ±0.02 0.20 ±0.02 0.10 ±0.03 0.10 ±0.03 0.13 ±0.02 0.04 ERJ1G, 1R (0201) 0.60 ±0.03 0.30 ±0.03 0.10 ±0.05 0.15 ±0.05 0.23 ±0.03 0.15 ERJ2R/L52408 (0402) 1.00 ±0.05 0.50 ±0.05 0.20 ±0.10 0.25 ±0.05 0.35 ±0.05 0.8 ERJ3R/L52408 (0603) 1.60 ±0.15 0.80 +0.15 0.30 ±0.20 0.30 ±0.15 0.45 ±0.10 ERJ6R/L52408 (0805) 2.00 ±0.20 1.25 ±0.10 0.40 ±0.20 0.40 ±0.20 0.60 ±0.10 ERJ3EK (0603) 1.60 ±0.15 0.80 +0.15 0.30 ±0.20 0.30 ±0.15 0.45 ±0.10 ERJ6EN (0805) 2.00 ±0.20 1.25 ±0.10 0.40 ±0.20 0.40 ±0.20 0.60 ±0.10 ERJ8EN (1206) 3.20 +0.05 1.60 +0.05 0.50 ±0.20 0.50 ±0.20 0.60 ±0.10 ERJ14N (1210) 3.20 ±0.20 2.50 ±0.20 0.50 ±0.20 0.50 ±0.20 0.60 ±0.10 ERJ12N (1812) 4.50 ±0.20 3.20 ±0.20 0.50 ±0.20 0.50 ±0.20 0.60 ±0.10 ERJ12S (2010) 5.00 ±0.20 2.50 ±0.20 0.60 ±0.20 0.60 ±0.20 0.60 ±0.10 ERJ1TN (2512) 6.40 ±0.20 3.20 ±0.20 0.65 ±0.20 0.60 ±0.20 0.60 ±0.10 –0.05 –0. 15–0.20 Jul. 2008

Precision Thick Film Chip Resistors Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. –40 –20 0 20 40 60 80 100 120 140 1600 180–60 70 °C–55 °C Ambient Temperature (°C) 100Rated Load (%) 125 °C 155 °C XG, 1G, 1R, 2RH, 2RK, 3R, 6R 2RK, 3E, 6E, 8E, 14, 12, 1T Type (inches) Power Rating at 70 °C (W) Limiting Element Voltage (Maximum RCWV) (1) (V) Maximum Ov erload Voltage (2) (V) Resistance Tolerance (%) Resistance Range (/L50529) T.C.R. [/L115410–6/°C (ppm/°C)] Category Temperature Range (O perating Temperature Range) (°C) ERJ1RH (0201) 0.05 15 30 ±0.5 1 k to 100 k (E24, E96) ±50 –55 to +125 ERJ1RK (0201) 0.05 15 30 ±0.5 100 to 976 (E24, E96) ±100 –55 to +125 ERJ2RH (0402) 0.063 50 100 ±0.5 100 to 100 k (E24, E96) ±50 –55 to +125 ERJ2RK (0402) 0.063 50 100 ±0.5 10 to 97.6 102 k to 1 M (E24, E96) ±100 –55 to +125 ERJ3RB (0603) 0.063 50 100 ±0.5 100 to 100 k (E24, E96) ±50 –55 to +125 ERJ3RE (0603) 0.063 50 100 ±0.5 10 to 97.6 102 k to 1 M (E24, E96) ±100 –55 to +125 ERJ6RB (0805) 0.1 150 200 ±0.5 100 to 100 k (E24, E96) ±50 –55 to +125 ERJ6RE (0805) 0.1 150 200 ±0.5 10 to 97.6 102 k to 1 M (E24, E96) ±100 –55 to +125 (1) Rate d Continuous Working Voltage (RCWV) shall be de ter mined from RCWV=/L50496Power Rating /L1154 Re sis tance Values , or Limiting Element Voltage (max. RCWV ) list ed above, wh ichever less. (2) Overload (Short-tim e Overload) Test Voltage (SOTV) shall be de termined from SOTV=2.5 /L1154 Power Rating or max. Over load Volt age list ed above whichever less. (3) Please contact us when you need a type with a resistance of less than 10 /L50529. ■ Ratings <±0.5 %> Type (inches) Power Rating at 70 °C (W) Limiting Element Voltage (Maximum RCWV) (1) (V) Maximum Ov erload Voltage (2) (V) Resistance Tolerance (%) Resistance Range (/L50529) T.C.R. [/L115410–6/°C (ppm/°C)] Category Temperature Range (O perating Temperature Range) (°C) ERJXG (01005) 0.031 15 30 ±1 10 to 1 M (E24, E96) <100 /L50529 : ±300 100 /L50529 < : ±200 –55 to + 125 ERJ1G (0201) 0.05 25 50 ±1 10 to 1 M(3) (E24, E96) ±200 –55 to +125 ERJ2RK (0402) 0.1 50 100 ±1 10 to 1 M (E24, E96) ±100 –55 to +155 ERJ3EK (0603) 0.1 75 150 ±1 10 to 1 M (E24, E96) ±100 –55 to +155 ERJ6EN (0805) 0.125 150 200 ±1 10 to 2.2 M (E24, E96) ±100 –55 to +155 ERJ8EN (1206) 0.25 200 400 ±1 10 to 2.2 M (E24, E96) ±100 –55 to +155 ERJ14N (1210) 0.5 200 400 ±1 10 to 1 M (E24, E96) ±100 –55 to +155 ERJ12N (1812) 0.75 200 500 ±1 10 to 1 M (E24, E96) ±100 –55 to +155 ERJ12S (2010) 0.75 200 500 ±1 10 to 1 M (E24, E96) ±100 –55 to +155 ERJ1TN (2512) 12 0 0 5 0 0 ± 1 10 to 1 M (E24, E96) ±100 –55 to +155 <±1 %> Power Derati ng Curve For resistors operated in ambient temperatures above 70 °C, powe r rating shall be derated in ac cor dance with the fi gure on the right. Jul. 2008

Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Precision Thick Film Chip Resistors φB W T φA φC TT T A P0P2P1 φD0 φD1 (Only Emboss) B F W E (2 mm pitch)

• Taping Reel ■ Packaging Methods (Taping)
• Standard Quantity
• Carrier Tape Type Kind of Taping Pitch (P 1)Q u a n t i t y ERJXG Pressed Carrier Taping 2 mm 20000 pcs./reel ERJ1G, ERJ1R 15000 pcs./reel ERJ2RH, ERJ2RK Punched Carr ier Taping 10000 pcs./reel ERJ3R/L52408, ERJ3EK 4 mm 5000 pcs./reel ERJ6R/L52408, ERJ6EN ERJ8EN ERJ14N Embossed Carrier TapingERJ12N ERJ12S ERJ1TN 4000 pcs./reel (Unit : mm) Type φA φB φC WT ERJXG 180.0+0 60 min. 13.0 ±1.0 9.0±1.0 11.4±1.0 ERJ1G, ERJ1R ERJ2RH, ERJ2RK ERJ3R/L52408, ERJ3EK ERJ6R/L52408, ERJ6EN ERJ8EN ERJ14N ERJ12N 13.0 ERJ1TN (Unit : mm) –3.0 Type A B W F E P 1 P2 P0 φD0 T φD1 ERJXG 0.24±0.03 0.45±0.03 8.00±0.20 3.50±0.05 1.75±0.10 2.00±0.10 0.31±0.05 – ERJ3R/L52408, ERJ3EK 1.10±0.10 1.90±0.10 4.00±0.10 0.70±0.05 – ERJ6R/L52408, ERJ6EN 1.65±0.15 2.50±0.20 0.84±0.05 ERJ8EN 2.00±0.15 3.60±0.20 – 1.00±0.10 1.0+0.10 ERJ12N 3.50±0.20 4.80±0.20 ERJ1TN 3.60±0.20 6.90±0.20 Pressed Carrier Punched Carrier Embossed Carrier Feb. 2006

Precision Thick Film Chip Resistors Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Preheating Peak Heating Temperature Time Chip Resistor c a b Type (inches) Dimensions (mm) abc ERJ3R, 3EK (0603) 0.7 to 0.9 2 to 2.2 0.8 to 1 ERJ8EN (1206) 2 to 2.4 4.4 to 5 1.2 to 1.8 ERJ14N (1210) 2 to 2.4 4.4 to 5 1.8 to 2.8 ERJ12S (2010) 3.6 to 4 6.2 to 7 1.8 to 2.8 Temperature Time Preheating 140 °C to 160 °C 60 s to 120 s Main heating Above 200 °C 30 s to 40 s Peak 235 ± 5 °C max. 10 s Temperature Time Preheating 150 °C to 180 °C 60 s to 120 s Main heating Above 230 °C 30 s to 40 s Peak max. 260 °C max. 10 s For soldering F or lead-free soldering Temperature Tim eT e m p e r a t u r eT i m e Preheating 140 °C to 180 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s Soldering 245 ± 5 °C 20 s to 30 s max. 260 °C max. 10 s ■ Recommended Land Pattern In case of fl ow soldering, the land width must be smaller than the Chip Resistor width to control the sol der amount properly. Generally, the land w i d t h s h o u l d b e 0.7 to 0.8 times (W) of the width of chip resistor. In case of refl ow soldering, solder amount can be adju sted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W). ■ Recommended Soldering Conditions Recommendations and precautions are described below.

• Recommended soldering conditions for refl ow
• Refl ow soldering shall be performed a maximum of two times.
• Please contact us for ad ditional information when used in conditions other than those specifi ed.
• Please meas ure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore ac tu al use. For soldering (Example : Sn/Pb) For lead-free soldering (Example : Sn/Ag/Cu)
• Recommended soldering conditions for fl ow Safety Precautions The following ar e precautions for individual products. Please also refer to the precautions common to Fixed Resistors shown on page ER2 of this catalog. 1. Take measures ag ainst mechanical stress during and after mounting of Precision Thick Film Chip Resistors (here af ter called the resistors) so as not to damage their electrodes and protective coatings. 2. If a transien t load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired. 3. Do not us e halogen-based or other high-activity fl ux. Otherwise, the residue may impair the resistors' per for mance and/or reliability. 4. When soldering wi th a soldering iron, never touch the resistors' bodie s with the tip of the soldering iron. When using a soldering iron with a high temperature tip, fi nish soldering as quickly as possible (within three seconds at 350 °C max.). 5. As the amount of applied solder becomes larger, the mech anical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder. 6. Do not appl y shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Oth er wise, the re sis tors' protective coatings and bodies may be chipped, affecting their performance. 7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress. Feb. 2006

– ER3 – Safety Precautions (Common precautions for Fixed Resistors)  When using ou r products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject to change without prior notice.  Do not use the products beyond the specifi cations described in this catalog.  This cata log explains the quality and performance of the products as individual components. Be fore use, check and evaluate their operations when installed in your products.  Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause th e loss of human life or other signifi cant damage, such as damage to vehicles (au to mo bile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating ap pli anc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equip ment. ✽ Systems equipped with a protection circuit and a protection device ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use  These products are designed and manufactured for general and stan dard use in general elec tron ic equipment (e.g. AV equipm ent, home el ectric ap pli anc es, offi ce equipment, information and com mu ni ca tion equipment)  These products are not intended fo r use in the following special conditions. Be fore using the products, care ful ly check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl 2, H2S, NH3, SO2, or NO2 4. Electric Static Discharge (ESD) Environment These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these pr oducts cause dew condensation 7. Sealing or co ating of these products or a printed circuit board on which thes e products are mounted, with resin or other materials  These products generate Joule heat when energized. Carefu lly position th ese products so that their he at will not affect the other components.  Carefully position thes e products so that their temperatures will not exceed the category temperature range due to the effect s of neighboring heat-generating com po nents. Do not mount or place heat-generating com po nents or infl ammables, such as vinyl-coated wires, near these products .  Note that non- cleaning solder, halogen-based highly active fl ux, or wate r-soluble fl ux may dete riorate the performance or reliability of the products.  Carefully select a fl ux cleaning agent fo r use after soldering. An unsuit able agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water res i dues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guar anteed for a year from the date of arrival at your company, provided that they remain packed as they were wh en delivered and stored at a temperature of 5 °C to 35 ° C and a relative humidity of 45 % to 85 %. Even wi thin the above guarantee periods, do not store these products in the fol low ing conditions. Otherwise, their elec tri cal performance and/or solderability may be dete riorated, and the packaging materials (e.g. tap ing ma te ri als) may be de formed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl 2, H2S, NH3, SO2, or NO2 2. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Oct. 2007

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