ERA-6YEB183V

ERA-6YEB183V PANASONIC | Alldatasheet

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Technical content

Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. E R A Y E B V Metal Film Chip Resistors Product Code Size, Power Rating Type: inches Power Rating 0.1 W 0.125 W Temperature Coefficient Code E H K Resistance Tolerance Code B D Tolerance ±0.1 % ±0.5 % Resistance Value The first two digits are significant figures of resistance and the third one denotes number of zeros following. T.C.R. 3Y : 0603 6Y : 0805 Packaging Methods Code V Packaging Type Punched Carrier Taping 4m m pitch ERA3Y ERA6Y a b t W L Metal Film Chip Resistors 0603, 0805 Type:ERA 3Y, 6Y ■ Features

• Small size and lightweight
• High reliability Low T.C.R. & current noise, excellent non-linearity
• Suitable for both refl ow and fl ow sol der ing
• Reference Standards IEC 60115-8, JIS C 5201-8, EIAJ RC-2133A ■ Explanation of Part Numbers ■ Dimensions in mm (not to scale)■ Construction Protective coating Alumina substrate Electrode (Inner) Electrode (Between) High reliability metal film Electrode (Outer) Type (inches) Dimensions (mm) Mass (Weight) [g/1000 pcs.]LWa b t ERA3Y (0603) 1.60 ±0.20 0.80 ±0.20 0.30 ±0.20 0.30 ±0.20 0.45 ±0.10 ERA6Y (0805) 2.00 ±0.20 1.25 ±0.10 0.40 ±0.25 0.40 ±0.25 0.50 ±0.10 Aug. 2008

Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Metal Film Chip Resistors –40 –20 0 20 40 60 80 100 120 140 1600 180–60 125 °C 70 °C–55 °C Ambient Temperature (°C) 100Rated Load (%) FE W P1 P2 P0T A B Tape running directionChip component Sprocket hole Compartment φD0 φC φA φB W T Type (inches) Power Rating at 70 °C (W) Limiting Element Voltage (Maximum RCWV) (1) (V) Maximum Ov erload Voltage (2) (V) Resistance Tolerance (%) Resistance Range (3) (/L50529) T.C.R. [/L115410–6/°C (ppm/°C)] Category Temperature Range (Operating Temperature Range) (°C) ERA3Y (0603) 0.1 75 150 ±0.5 10 to 91 (E24) ± 50 –55 to +125 100 to 33 k (E24) ± 25 36 k to 33 0 k (E24) ± 100 ±0. 1 100 to 33 k (E24) ± 25 ERA6Y (0805) 0.125 100 200 ±0.5 10 to 91 (E24) ± 50 100 to 100 k (E24) ± 25 110 k to 1 M (E24) ± 100 ±0. 1 100 to 100 k (E24) ± 25 (1) Rate d Continuous Working Voltage (RCWV) shall be de ter mined from RCWV=/L50496Rated Power /L1154 Re sis tance Values , or Limiting Element Voltage (max. RCWV ) list ed above, whichever less. (2) Overload (Short-tim e Overload) Test Voltage (SOTV) shall be de termined from SOTV=2.5 /L1154 Power Rating or max. Over load Volt age list ed above which ev er less. (3) E9 6 series resistance values are also available. Please contact us for details. Part Number of E96 series is shown ERA3E. , ERA6E. ■ Ratings Power Derati ng Curve For resistor s operated in ambient temperatures above 70 °C, powe r rating shall be derated in ac cor dance with the fi gure on the right. ■ Packaging Methods (Taping)

• Standard Quantity Type Kind of Taping Pitch (P 1)Q u a n t i t y ERA3Y Punched Carrier Taping 4 mm 5 000 pcs./reelERA6Y
• Taping Reel● Punched Carrier Taping Dimensions (mm) Type A B W F E Dimensions (mm) Type P 1 P2 P0 φD0 T 6Y 0.84±0.05–0 Dimensions (mm) Type φA φB φC 3Y 180.0 60 min. 13.0 ±1.0 –3.0 Dimensions (mm) Type W T Aug. 2008

Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Chip Resistor c a b Preheating Peak Heating Temperature Time Type (inches) Dimensions (mm) abc ERA3Y (0603) 0.7 to 0.9 2 to 2.2 0.8 to 1 ERA6Y Temperature Time Preheating 140 °C to 160 °C 60 s to 120 s Main heating Above 200 °C 30 s to 40 s Peak 235 ± 5 °C max. 10 s Temperature Time Preheating 150 °C to 180 °C 60 s to 120 s Main heating Above 230 °C 30 s to 40 s Peak max. 260 °C max. 10 s For soldering F or lead-free soldering Temperature Tim eT e m p e r a t u r eT i m e Preheating 140 °C to 180 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s Soldering 245 ± 5 °C 20 s to 30 s max. 260 °C max. 10 s ■ Recommended Soldering Conditions Recommendations and precautions are described below.

• Recommended soldering conditions for refl ow For soldering (Example : Sn/Pb) For lead-free soldering (Example : Sn/Ag/Cu)
• Recommended soldering conditions for fl ow In case of fl ow soldering, the land width must be small er than the Chip Resistor width to properly control the sol der amount properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of refl ow soldering, solder amount can be adjusted, there fore the land width should be set to 1.0 to 1.3 times chip resistor width (W). ■ Recommended Land Pattern Safety Precautions The following ar e precautions for individual products. Please also refer to the precautions common to Fixed Resistors shown on page ER2 of this catalog. 1. Keep th e rated power and ambient temperature within the specifi ed derating curve. * When positioning an d mounting Metal Film Chip Resistors (hereafter called the resistors), make allowance for the effect of heat generated through close contact between the resistors and neigh bor ing components and for the temperature rise of adjacent heat-generating components. 2. If a transien t load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. When applying pulses to the resistors, keep the pulse peak within the rated voltage. 3. Do not us e halogen-based or other high-activity fl ux. Otherwise, the residue may impair the resistors' per for mance and/or reliability. 4. When soldering with a soldering iron, never touch the resist ors' bodies with the tip of th e soldering iron. When using a soldering iron with a high temperature tip, fi nish soldering as quickly as possible (within three seconds at 350 °C max.). 5. As the amount of applied solder becomes larger, the me chanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder. 6. When the resistor s' protective coat ings are chipped, fl awed, or removed, th e characteristics of the resistors may be impaired. Take special care not to apply mechanical shock during automatic mounting or cause damage during handling of the boards with the resistors mounted. 7. Do not appl y shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors' protective coatings and bodies may be chipped, affecting their performance. 8. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress. 9. Do no t immerse the resistors in solvent for a long time. Before using solvent, carefully check the effects of im mer sion.
• Refl ow soldering shall be performed a maximum of two times.
• Please contact us for additional information when used in conditions other than those specifi ed.
• Please meas ure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore ac tu al use. Feb. 2006