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Technical content
© August 2009 Altera Corporation MAX II Device Handbook 6. Reference and Ordering Information Software MAX® II devices are supported by the Altera® Quartus® II design software with new, optional MAX+PLUS® II look and feel, which provides HDL and schematic design entry, compilation and logic synthesis, full simulation and advanced timing analysis, and device programming. Refer to the Design Software Selector Guide for more details about the Quartus II software features. The Quartus II software supports the Windows XP/2000/NT, Sun Solaris, Linux Red Hat v8.0, and HP-UX operating systems. It also supports seamless integration with industry-leading EDA tools through the NativeLink interface. Device Pin-Outs Printed device pin-outs for MAX II devices are available on the Altera website (www.altera.com).
Ordering Information
Figure 6–1 describes the ordering codes for MAX II devices. For more information about a specific package, refer to the Package Information chapter in the MAX II Device Handbook. Figure 6–1. MAX II Device Packaging Ordering Information Package Type Thin quad flat pack (TQFP) FineLine BGA 240: 570: 1270: 2210: Speed Grade Family Signature EPM: MAX II Operating Temperature Pin Count Device Type
240 Logic Elements
570 Logic Elements
1,270 Logic Elements 2,210 Logic Elements ES: Optional Suffix Engineering sample Indicates specific device options or shipment method 3, 4, 5, 6, 7, or 8, with 3 being the fastest Number of pins f or a particular package Commercial temperature (TJ = 0° C to 85° C) Industrial temperature (TJ = -40° C to 100° C) Automotive temperature (TJ = -40° C to 125° C) EPM 240 G T 100 C 3 ES Product-Line Suffix Blank (no identifier): Indicates device type 1.8-V VCCINT low-power device 1.8-V VCCINT zero-power device 2.5-V or 3.3-V VCCINT device N: Lead-free packaging M: Micro FineLine BGA MII51006-1.6
6–2 Chapter 6: Reference and Ordering Information Referenced Documents MAX II Device Handbook © August 2009 Altera Corporation Referenced Documents This chapter references the following document: ■ Package Information chapter in the MAX II Device Handbook Document Revision History Table 6–1 shows the revision history for this chapter. Table 6–1. Document Revision History Date and Revision Changes Made Summary of Changes August 2009, version 1.6 ■ Updated Figure 6–1. Added information for speed grade –8 October 2008, version 1.5 ■ Updated New Document Format. — December 2007, version 1.4 ■ Added “Referenced Documents” section. ■ Updated Figure 6–1. Updated document with MAX IIZ information. December 2006, version 1.3 ■ Added document revision history. — October 2006, version 1.2 ■ Updated Figure 6-1. — June 2005, version 1.1 ■ Removed Dual Marking section. —