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15.04.2013 EPD-740-0-2.5 1 of 2 EPD-740-0-2.5 TECHNICAL DATA Selective Photodiode, TO-39 package AlGaAs/GaAs EPD-740-0-2.5 is a GaAs based photodiode, mounted into a TO -39 housing. This device is featuring a narrow bandwidth and high spectral sensitivity at 650 – 820 nm. Specifications (Unit: mm)

  • Spectral Responsivity (Peak): 740 nm
  • Active Area: 5.8 mm²
  • Package: TO-39 Parameters (TA=25°C) Item Symbol Value Unit Active Area A 5.8 mm² Operating Temperature Topr -30 … +100 °C Storage Temperature Tstg -40 … +125 °C Soldering Temperature *1 Tsld 260 °C *1 must be completed within 3 seconds at 260°C Electro-Optical Characteristics Item Symbol Condition Min. Typ. Max. Unit Dark Current ID VR=1V - 2 10 nA Peak Sensitivity Wavelength λC VR=0V - 740 - nm Responsivity at λC Sλ VR=0V - 0.5 - A/W Sensitivity Range at 50% λmin, λmax VR=0V 650 - 820 nm Spectral Bandwidth at 50% ∆λ0.5 VR=0V - 170 - nm Note: The above specifications are for reference purpose only and subjected to change without prior notice.

15.04.2013 EPD-740-0-2.5 2 of 2 Typical Performance Curves Normalized Spectral Response (preliminary) Precaution for Use 1. Lead Forming

  • Lead forming should be done before soldering.
  • When forming leads, the leads should be bent at a point at least 3 mm from the base of the lead. DO NOT use the base of the lead frame as a fulcrum during lead forming!
  • DO NOT apply any bending stress to the base of the lead. The stress to the base may damage the PD’s characteristics or it may break the PDs.
  • When mounted the PDs onto the printed circuit board, the holes on the circuit board should be exactly aligned with the leads of PDs. If the PDs are mounted with stress at the leads, it causes deterioration of the lead and it will degrade the PDs. 2. Soldering Conditions
  • Solder the PDs no closer than 3 mm from the base of the lead.
  • DO NOT apply any stress to the lead particularly when heat.
  • After soldering the PDs, the lead should be protected from mechanical shock or vibration until the PDs return to room temperature.
  • The PDs must not be reposition after soldering.
  • When it is necessary to clamp the PDs to prevent soldering failure, it is important to minimize the mechanical stress on the PDs.
  • Cut the PD leads at room temperature. Cutting the leads at high temperature may cause the failure of the PDs. Soldering Conditions 3. Static Electricity
  • The PDs are very sensitive to Static Electricity and surge voltage. So it is recommended that a wrist band and/or an anti - electrostatic glove be used when handling the PDs.
  • All devices, equipment and machinery must be grounded properly. It is recommended that precautions should be taken against surge voltage to the equipment that mounts the PDs.