EP3C5 ALTERA | Alldatasheet
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May 2008, version 3.0 Data Sheet DS-CYTHRML-3.0 Cyclone Series Device Thermal Resistance Revision History The following table shows the revision history for this data sheet. Tables 1 through 6 in this data sheet provide θJA (junction-to-ambient thermal resistance) and θJC (junction-to-case thermal resistance) values for Altera® Cyclone® series devices available in Ball-Grid Array (BGA), FineLine® BGA (FBGA), Micro FineLine BGA® (MBGA), Ultra FineLine BGA (UBGA), Pin-Grid Array (PGA), Plastic J-Lead Chip Carrier (PLCC), Plastic Enhanced Quad Flat Pack (EQFP), Thin Quad Flat Pack (TQFP), Plastic Quad Flat Pack (PQFP), and Power Quad Flat Pack (RQFP). f For additional packaging information, refer to the Altera Device Packaging Data Sheet. Date Document Version Changes Made May 2008 3.0 Updated Tables 2, 4, and 5. July 2007 2.2 Updated values for EP3C25 (E144) device in Table 2. May 2007 2.1 Updated values for EP3C10 (E144) device in Table 2 and added Revision History. March 2007 2.0 Added Cyclone III information. April 2006 1.0 Initial release.
a board meeting JEDEC specifications for thermal resistance calculation. Table 1. Thermal Resistance Values for Cyclone III Devices heat sink is not being used. heat sink is not being used. heat sink is not being used. θJC (C/W) Junction-to-case thermal resistance ( θJC) for device. θJB (C/W) Junction-to-board thermal resistance ( θJB) for specific board being used. Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC Specifications (Part 1 of 2)
Table 3 provides board dimension information for each package. Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC Specifications (Part 2 of 2) Table 3. PCB Dimensions Notes (1), (2) (Part 1 of 2)
values for Cyclone III devices on a typical board. Table 3. PCB Dimensions Notes (1), (2) (Part 2 of 2) Table 4. Thermal Resistance of Cyclone III Devices for Typical Board (Part 1 of 2)
(junction-to-case thermal resistance) values for Cyclone II devices. Table 4. Thermal Resistance of Cyclone III Devices for Typical Board (Part 2 of 2) Table 5. Thermal Resistance of Cyclone II Devices
for Cyclone II devices on a typical board. (junction-to-case thermal resistance) values for Cyclone devices. Table 6. Thermal Resistance of Cyclone II Devices Table 7. Thermal Resistance of Cyclone Devices (Part 1 of 2)
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Table 7. Thermal Resistance of Cyclone Devices (Part 2 of 2)