EGP50A GE | Alldatasheet
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Technical content
GLASS PASSIVATED FAST EFFICIENT RECTIFIER Reverse Voltage - 50 to 400 Volts Forward Current -5.0 Amperes
FEATURES
♦ Plastic package has Underwriters Laboratories Flammability Classification 94V-0 ♦ Glass passivated cavity-free junction ♦ Superfast recovery time for high efficiency ♦ Low forward voltage, high current capability ♦ Low leakage current ♦ High surge current capability ♦ High temperature metallurgically bonded construction ♦ High temperature soldering guaranteed: 300°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension MECHANICAL DATA Case: Molded plastic over solid glass body Terminals:Axial leads, solderable per MIL-STD-750, Method 2026 Polarity:Color band denotes cathode end Mounting Position:Any Weight:0.03 ounce, 0.8 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. EGP EGP EGP EGP EGP EGP SYMBOLS 50A 50B 50C 50D 50F 50G UNITS Maximum recurrent peak reverse voltage V RRM 50 100 150 200 300 400 Volts Maximum RMS voltage V RMS 35 70 105 140 210 280 Volts Maximum DC blocking voltage V DC 50 100 150 200 300 400 Volts Maximum average forward rectified current 0.375" (9.5mm) lead length at TL=55°C I(AV) 5.0 Amps Peak forward surge current 8.3ms single half sine-wave superimposed on rated load I FSM 150.0 Amps Maximum instantaneous forward voltage at 5.0A V F 0.95 1.25 Volts Maximum DC reverse current T A=25°C 5.0 at rated DC blocking voltage T A=125°C IR 50.0 µA Maximum reverse recovery time (NOTE 1) trr 50.0 ns Typical thermal resistance (NOTE 2) R Θ JA 20.0 R Θ JL 5.0 °C\\W Typical junction capacitance (NOTE 3) C J 95 75 pF Operating junction and storage temperature range T J, TSTG -65 to +150 °C NOTES: (1) Reverse recovery test conditions: IF=0.5A, IR =1.0A, Irr=0.25A (2) Thermal resistance from junction to ambient and from junction of lead at 0.375” (9.5mm) lead length, both leads measured attached to heat sinks (3) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts Case Style GP20 Dimensions in inches and (millimeters) *Glass-plastic encapsulation technique is covered by Patent No. 3,996,602, brazed-lead assembly by Patent No. 3,930,306 PATENT ED* 0.210 (5.3) 0.190 (4.8) DIA. 0.042 (1.07) 0.037 (0.94) DIA. 1.0 (25.4) MIN. 0.375 (9.5) 0.285 (7.2) 1.0 (25.4) MIN.
6.0 0 25 50 75 100 125 150 175 1.0 2.0 3.0 4.0 5.0 0.01 0.1 0.2 0.01 0.1 1 10 100 0.1 1.0 100 0.1 1 10 100 1,000 120 150 180 210 02 04 06 08 0 1 0 0 0.001 0.01 0.1 100 FIG. 1 - MAXIMUM FORWARD CURRENT DERATING CURVE LEAD TEMPERATURE, °C AVERAGE FORWARD RECTIFIED CURRENT, AMPERES FIG. 2 - MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT NUMBER OF CYCLES AT 60 H Z PEAK FORWARD SURGE CURRENT, AMPERES FIG. 3 - TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS FIG. 4 - TYPICAL REVERSE LEAKAGE CHARACTERISTICS INSTANTANEOUS FORWARD CURRENT, AMPERES INSTANTANEOUS REVERSE LEAKAGE CURRENT, MICROAMPERES INSTANTANEOUS FORWARD VOLTAGE, VOLTS PERCENT OF RATED PEAK REVERSE VOLTAGE, % FIG. 5 - TYPICAL JUNCTION CAPACITANCE JUNCTION CAPACITANCE, pF REVERSE VOLTAGE, VOLTS TJ=TJ max. 8.3ms SINGLE HALF SINE-WAVE (JEDEC Method) TJ=150°C TJ=125°C TJ=75°C TJ=25°C TJ=25°C TJ=150°C PULSE WIDTH=300 µs 1% DUTY CYCLE TJ=25°C f=1.0 MHZ Vsig=50mVp-p RESISTIVE OR INDUCTIVE LOAD COPPER HEATSINKS 0.375" (9.5mm) TL RATINGS AND CHARACTERISTIC CURVES EGP50A THRU EGP50G EGP50A - EGP50D EGP50F & EGP50G EGP50A-EGP50D EGP50F & EGP50G FIG. 6 - TYPICAL TRANSIENT THERMAL IMPEDANCE TRANSIENT THERMAL IMPEDANCE, °CW t, PULSE DURATION, sec. L