EGF1A GE | Alldatasheet
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Technical content
ULTRAFAST SURFACE MOUNT RECTIFIER Reverse Voltage - 50 to 200 VoltsForward Current -1.0 Ampere
FEATURES
♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ Ideal for surface mount automotive applications ♦ High temperature metallurgically bonded construction ♦ Superfast recovery times for high efficiency ♦ Glass passivated cavity-free junction ♦ Built-in strain relief ♦ Easy pick and place ♦ High temperature soldering guaranteed: 450°C/5 seconds at terminals ♦ Complete device submersible temperature of 265°C for 10 seconds in solder bath MECHANICAL DATA Case: JEDEC DO-214BA molded plastic over glass body Terminals:Solder plated, solderable per MIL-STD-750, Method 2026 Polarity:Color band denotes cathode end Weight: 0.0048 ounces, 0.120 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS EGF1A EGF1B EGF1C EGF1D UNITS Device Marking Code EA EB EC ED Maximum repetitive peak reverse voltage V RRM 50 100 150 200 Volts Maximum RMS voltage V RMS 35 70 105 140 Volts Maximum DC blocking voltage V DC 50 100 150 200 Volts Maximum average forward rectified current at TL=125°C I(AV) 1.0 Amps Peak forward surge current 8.3ms single half sine-wave superimposed on I FSM 30.0 Amps rated load (JEDEC Method) Maximum instantaneous forward voltage at 1.0A V F 1.0 Volts Maximum DC reverse current T A=25°C 5.0 at rated DC blocking voltage T A=125°C IR 50.0 µA Typical reverse recovery time(NOTE 1) trr 50.0 ns Typical junction capacitance(NOTE 2) C J 15.0 pF Typical thermal resistance (NOTE 3) R Θ JA 85.0 R Θ JL 30.0 °C/W Operating junction and storage temperature range T J,TSTG -65 to +175 °C NOTES: (1) Reverse recovery test conditions: IF=0.5A, IR =1.0A, Irr=0.25A (2) Measured at 1.0 MHz and applied VR =4.0 Volts (3) Thermal resistance from junction to ambient and from junction to lead 0.167 (4.24) 0.187 (4.75) 0.0065 (0.17) 0.0105 (0.27) 0.030 (0.76) 0.060 (1.52) 0.006 0.152 TYP. 0.196 (4.98) 0.226 (5.74) 0.094 (2.39) 0.114 (2.90) 0.106 (2.69) 0.118 (3.00) 0.040 (1.02) 0.060 (1.52) 0.098 (2.49) 0.108 (2.74) DO-214B A PATENTED* Dimensions in inches and (millimeters) *Glass-plastic encapsulation technique is covered by Patent No. 3,996,602, brazed-lead assembly by Patent No. 3,930,306 and lead forming by Patent No. 5,151,846
0.5 1.0 25 50 75 125 150 20 80 0.1 100 0 40 60 100 1,000 1 10 5.0 100 0.01 0.1 0.01 0.1 1 10 100 0.1 100 0.1 1 10 100 RATINGS AND CHARACTERISTICS CURVES EGF1A THRU EGF1D FIG. 1 - MAXIMUM FORWARD CURRENT DERATING CURVE LEAD TEMPERATURE, °C AVERAGE FORWARD RECTIFIED CURRENT, AMPERES RESISTIVE OR INDUCTIVE LOAD P .C.B. MOUNTED on COPPER PAD AREAS FIG. 4 - TYPICAL REVERSE CHARACTERISTICS INSTANTANEOUS REVERSE LEAKAGE CURRENT, MICROAMPERES PERCENT OF RATED PEAK REVERSE VOLTAGE, % TJ=25°C TJ=150°C PULSE WIDTH=300 µs 1% DUTY CYCLE FIG. 3 -TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS INSTANTANEOUS FORWARD VOLTAGE, VOLTS INSTANTANEOUS FORWARD CURRENT, AMPERES TJ=TJ max. 8.3ms SINGLE HALF SINE WAVE (JEDEC Method) FIG. 2 - MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT PEAK FORWARD SURGE CURRENT, AMPERES FIG. 6 - TYPICAL TRANSIENT THERMAL IMPEDANCE t, PULSE DURATION, sec. TRANSIENT THERMAL IMPEDANCE, °C/W TJ=25°C f=1.0 MHz Vsig=50mVp-p TJ=150°C TJ=100°C TJ=25°C NUMBER OF CYCLES AT 60 H Z FIG. 5 - TYPICAL JUNCTION CAPACITANCE JUNCTION CAPACITANCE, pF REVERSE VOLTAGE, VOLTS