ECM-TGU-85

ECM-TGU BCM | Alldatasheet

Document overview

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Technical content

Features

11th Gen Intel® Tiger Lake U Core™ SoC i7/i5/i3 & Celeron® BGA Processor Onboard 3.5” SBC

• 11th Gen Intel® Tiger Lake U Core™ SoC i7/i5/i3 & Celeron® BGA Processor Onboard
• 1 x SODIMM DRAM socket supports up to 32GB DDR4 3200MTs SDRAM non-ECC
• 3 x RJ45, Intel® I226-LM/IT Ethernet Controllers
• Supports 4 Independent Displays
• 2 x DP++, 1 x 2CH LVDS, 1 x eDP
• 4 x USB 3.1 Gen 2x1, 4 x USB 2.0
• 6 x COM Ports
• M.2 M-Key, M.2 B-Key, M.2 E-Key
• Onboard TPM 2.0
• 12-24V Wide Range DC Audio Audio Codec Realtek HD Audio Amplifier 3W Amplifier Ethernet LAN Chipset 3 x Intel® I226-LM/IT Ethernet Controllers Interface 3 x 10/100/1000/2500 Base-Tx GbE Compatible Interface 3 x RJ45 External I/O Display 2 x DP++ USB 4 x USB 3.2 Gen 2x1 LAN Port 3 x RJ45 Audio 2-in-1 Audio Jack supports Line-out & Mic-in Internal I/O Display 1 x LVDS, 1 x eDP COM 2 x RS-232/422/485 4 x RS-232 USB 2 x USB 2.0 Headers (4 Ports) GPIO 1 x 8-bit GPIO SATA 1 x SATA III Other Front Panel, Front Audio, CPU Fan, LPC, BIOS SPI, LCD Inverter, Power Connector, Amp Connector for 3W x 2 Speakers, AT/ATX Selector System CPU 11th Gen Intel® Tiger Lake U Processors onboard. Intel® Core™ SoC i7/i5/i3 & Celeron® BGA Processor options: - Intel® Core™ i7-1185G7E (up to 4.4GHz, quad-core, 12M Cache, TDP: 15W) - Intel® Core™ i5-1145G7E (up to 4.1GHz, quad-core, 8M Cache, TDP: 15W) - Intel® Core™ i3-1115G4E (up to 3.9GHz, dual-core, 6M Cache, TDP: 15W) - Intel® Celeron® 6305E (up to 1.8GHz, dual-core, 4M Cache, TDP: 15W) System Memory 1 x 260-pin DDR4 SODIMM Socket supports up to 32GB DDR4 3200MTs SDRAM (non ECC only) BIOS AMI BIOS, 256Mbit SPI Flash ROM I/O Chipset EC ITE IT8882 Expansion 1 x M.2 E-Key 2230 supports WiFi module (with PCIe x1 & USB

2.0 Signal)

1 x M.2 B-Key 3042/2242 (with PCIe x1, SATA and USB 2.0 signal, with 1 x SIM card slot) standard package with 52 to 42 bracket + screw set. Supports 4G, no 5G (no USB 3.0 signal). 1 x M.2 M-Key supports 2260/2242 (with 1 x PCIe Gen4 x4 sig- nal), standard package with 60 to 42 bracket + screw set Storage through 1 x M.2 (B-Key 2242), 1 x SATA III Watchdog Timer H/W Reset, 1sec. ~ 65535sec and 1sec. or 1min./step H/W Status Monitor CPU & system temperature monitoring Voltages monitoring TPM TPM 2.0 Supported OS Win10, Linux Display Chipset Intel® Tiger Lake UP3 SoC Processor integrated Gen12 graphics Resolution DP++: 4096x2160 @ 60Hz Max LVDS: 1920 x 1080 Dual channel 18/24-bits Max eDP1.3: 4096x2160 @ 60Hz Max Multi-Display Supports up to 4 Independent Displays DPDP M.2 M.2 SATA III M.2 2-in-1 Audio Jack 4 x USB 3.2 Gen 2x1 3 x LAN COM 2 COM 3-6 SIM Card Socket LVDS COM 1 2 x USB 2 x USB SODIMM

• All product specifications and images are subject to change without notice. Last update: BCM Advanced Research www.bcmcom.com

11 Chrysler, Irvine, CA 92618 USA

An Industry Leader in Industrial Motherboards & Embedded Computing BCMSales@bcmcom.com (949) 470-1888 ECM-TGU 02/17/2023 Ordering Info ECM-TGU-85 Intel® Core i7-1185G7E SoC Onboard, CPU Cooler, 1 x DDR4 SoDIMM, TPM, Heatsink, 15W, 3 x LAN, 6 x COM, 4 x USB3.0, 4 x USB2.0, 2 x DP++, 18-24LVDS, eDP, 1 x SATAIII, 1 x M.2, +12V~24V ECM-TGU-45 Intel® Core i5-1145G7E SoC Onboard, CPU Cooler, 1 x DDR4 SoDIMM, TPM, Heatsink,15W, 3 x LAN, 6 x COM, 4 x USB3.0, 4 x USB2.0, 2 x DP++, 18-24LVDS, eDP, 1 x SATAIII, 1 x M.2, +12V~24V ECM-TGU-15 Intel® Core i3-1115G4E SoC Onboard, CPU Cooler, 1 x DDR4 SoDIMM, TPM, Heatsink,15W, 3 x LAN, 6 x COM, 4 x USB3.0, 4 x USB2.0, 2 x DP++, 18-24LVDS, eDP, 1 x SATAIII, 1 x M.2, +12V~24V ECM-TGU-6305 Intel® Celeron 6305E SoC Onboard, Heatsink,15W, 1 x DDR4 SoDIMM, TPM, 3 x LAN, 6 x COM, 4 x USB3.0, 4 x USB2.0, 2 x DP++, 18-24LVDS, eDP , 1 x SATAIII, 1 x M.2, +12V~24V Mechanical & Environment Power Requirement DC in +12V ~ +24V ACPI Single power ATX Support S0, S3, S4, S5 ACPI 5.0 Compliant Power Mode AT/ATX (Default Setting: AT) Operating Temp. 0°C ~ 60°C (-4~140°F) with 0.5m/s air flow Storage Temp. -40°C ~ 85°C (-40°F ~ 185°F) Op. Humidity 40°C @ 95% Relative Humidity, Non-condensing Vibration Test 1.5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 30min/Axis, 3 Axis Shock Test 10G, IEC 60068-2-27, Half Sine, 11ms, Z Axis Form Factor 3.5" Single Board Computer (SBC) Dimensions 5.7" x 4" (145mm x 101mm) Weight 0.44lbs (0.2kg) Certification Information CE, FCC Class B, RoHS Compliant 11th Gen Intel® BGA Processor eDP