ECM-EHL BCM | Alldatasheet

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Technical content

Features

  • All product specifications and images are subject to change without notice. Last update: Specifications ECM-EHL 02/17/2023 Intel® Celeron®/Atom™ Elkhart Lake SoC 3.5” Micro Module
  • Intel® Celeron®/Atom™ Elkhart Lake SoC BGA Processor
  • Bottom Layer Soldered Processor
  • 1 x SODIMM socket supports up to 32GB DDR4 3200MTs SDRAM
  • Supports 3 Independent Displays
  • M.2 B-Key, M.2 E-Key, uSIM Card Slot
  • 4 x COM Ports
  • 2 x USB 3.1 Gen 2 (10Gbps), 4 x USB 2.0
  • 2 x Intel® I226-LM 2.5GbE Ethernet Controllers
  • Select SKU supports Extended Temperature -40°C ~ 85°C
  • +9~36V Wide Range DC Input Ordering Info ECM-EHL- J6412 Intel® Celeron J6412 2.0GHz Quad Core Micro Module, Fan - less, 2 x LAN, 4 x COM, 6 x USB, 8-GPIO, +9V~+36V, 0~60C ECM-EHL- J6413 Intel® Celeron J6413 1.8GHz Quad Core Micro Module, Fan - less, 2 x LAN, 4 x COM, 6 x USB, 8-GPIO, +9V~+36V, 0~60C ECM-EHL- x6413E Intel® Celeron J6413 1.8GHz Quad Core Micro Module, Fan - less, 2 x LAN, 4 x COM, 6 x USB, 8-GPIO, +9V~+36V, 0~60C ECM-EHL- x6425RE Intel® ATOM x6425RE 1.9GHz Quad Core Micro Module, Fan - less, 2 x LAN, 4 x COM, 6 x USB, 8-GPIO, +9V~+36V, -40~85C I/O Display 1 x HDMI, 1 x DisplayPort USB 2 x USB 3.1 (Gen2 10Gbps), 4 x USB 2.0 COM Port 1 x RS-422/485, 3 x RS-232 LAN Port 2 x RJ45 SATA 1 x SATA III DIO 1 x 2x6-Pin Header (2.0mm) for 8-bit GPIO, SMBUS, +5V,GND MIO 1 x eSPI Mechanical & Environment Power Requirement Typical 12/24Vdc (+9~ 36Vdc) ACPI Single power ATX Support S0,S3, S4, S5 ACPI 5.0 Compliant Power Type AT/ATX (Default Setting: AT) Operating Tem- perature Standard Temperature: 0°C ~ 60°C with 0.2m/s air flow Wide Temperature: -40°C ~ 85°C with 0.5m/s air flow Storage Temp -40°C ~ 85°C (-40°F ~ 185°F) Operating Humidity 40°C @ 95% Relative Humidity, Non-condensing Form Factor 3.5" Single Board Computer (SBC) Dimension 5.7" x 4" (146mm x 101mm) Weight 0.44lbs (0.2kg) Vibration Test 1.5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 30min/Axis, 3 Axis Shock Test 10G, IEC 60068-2-27, Half Sine, 11ms, Z Axis Drop Test ISTA 2A, IEC-60068-2-32 Test : Ed, 1 Corner, 3 Edges, 6 Faces Certification Information CE FCC Class B System Processor Intel® Pentium®/Celeron®/Atom™ SoC BGA Processor (Elkhart Lake Platform 4.5~12W)- (with CPU Bottom Mounted) Intel® Celeron® J64 13 Processor (1.8M Cache, up to 3.00 GHz) Intel Atom® x64 13E Processor (1.5M Cache, up to 3.00 GHz) Intel Atom® x6425RE Processor (1.9M Cache, up to 1.90 GHz) System Chipset Intel® Elkhart Lake SoC Integrated System Memory 1 x 260-pin DDR4 SODIMM Socket, supports up to 32GB DDR4 3200MTs SDRAM I/O Chip EC ITE IT5571 BIOS AMI BIOS, 256Mbit SPI Flash ROM Expansion 1 x M.2 (B Key, 2242/3042, PCIe x2, or ( PCIe x1 + USB 3.1 GEN 2), or (SATA III + USB 3.1 GEN 2), USB 2.0, uSIM Slot for SSD/LTE/IO Cards) *Default is PCIe x1/SATA III + USB 3.1 GEN 2 1 x M.2 (E Key, 2230, PCIe x1, USB 2.0) Storage via 1 x M.2 (B Key, 2242), 1 x SATA III Watchdog Timer H/W Reset, 1sec. ~ 65535sec and 1sec. or 1min./step TPM NuvoTon_NPCT750AAAYX/ Infineon_SLB9670VQ2.0 TPM 2.0 Supported OS Win 10, Linux Display Chipset Intel® UHD Gen 11 LP Resolution HDMI 2.0b Max resolution 4096x2160@60Hz DP 1.4a Max resolution 4096x2160@60Hz eDP1.3 Max resolution 4096x2160@60Hz Display Output Supports Three Independent Display Audio Chipset Realtek HD Audio Interface Mic-in, Line-in, Line-out in Pin Header Ethernet Chipset 2 x Intel® I226-LM/IT Ethernet Controllers Interface 2 x 10/100/1000/2500 Base-Tx GbE Compatible LAN Port 2 x RJ45 2 x USB 3.1 USB (2 Ports) HDMI COM Port 2 x USB 2.0 Processor (back) uSIM Card Slot DisplayPort M.2 SATA III COM 3 COM 2 COM 4 eDP M.2 2 x LAN