E2560

E2560 AGERE | Alldatasheet

Document overview

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Technical content

Features

■ Integrated electroabsorptive modulator ■ 1.5 µm wavelength ■ Characterized for 10 Gbits/s operation ■ For use up to 80 km at 10 Gbits/s ■ Low modulation voltage ■ T emperature stabilized ■ Available with and without integral driver IC ■ Wavelength selectable to ITU-T standards ■ Ultrastable wavelength aging for DWDM

Applications

■ SONET/SDH applications ■ Ultrahigh capacity WDM system application ■ High-speed data communication ■ Digitized video

Description

The E2560 (without integral driver IC) and E2580 (with integral driver IC) are devices for 10 Gbits/s DWDM or TDM transmission applications, which inte- grate a CW laser with an electroabsorptive modulator in the same semiconductor chip, and are an exten- sion of Lucent T echnologies Microelectronics Groups’ existing E2500 series of devices. Both types use a small-profile Gilbert GPO connector to handle the RF signal. The device is typically coupled with a number of erbium-doped fiber amplifiers, such as Lucent T echnologies' 1724-series, in order to ensure that sufficient optical power reaches the receiver. These devices can replace external modulators which are often bulkier, more expensive, and require more complex drive electronics than the EML. Both E2560 and E2580 are available for transmission dis- tances of 40 km and 80 km. The package also con- tains a thermoelectric cooler, thermistor, rear facet monitor photodiode, and an optical isolator.

stability of wavelength vs. case temperature, with a maximum coefficient of 0.5 pm/°C. Table 1. Module Characteristics Table 2. Pin Descriptions Package T ype E2560: 7-pin package with GPO connector RF input. E2580: 13-pin package with GPO connector RF input. Fiber Standard single-mode fiber. ST ® ; other connectors available on request.

7 TEC– Themoelectric cooler– 7 NC No connect/reserved

6 TEC+ Thermoelectric cooler+ 6 VEA Modular offset (on-state)

5 BACK DET+ Monitor cathode (+) 5 BACK DET+ Monitor cathode (+)

4 BACK DET– Monitor anode (–) 4 BACK DET– Monitor anode (–)

3 LASER+ Laser anode 3 LASER+ Laser anode

2 THERM Thermistor 2 THERM Thermistor

1 THERM, LASER–,

extended periods can adversely affect device reliability. Table 3. Absolute Maximum Ratings Table 4. Optical and Electrical Specifications (Chip operating temp. = 15 °C to 35 °C, except where noted.)

• Over 720 ps/nm (40 km version), 1440 ps/nm (80 km version).

• Over 720 ps/nm (40 km version), 1440 ps/nm (80 km version).

10 Gbits/s (E2580)

10 Gbits/s (E2560)

10 Gbits/s

Table 4. Optical and Electrical Specifications (Chip operating temp. = 15 °C to 35 °C, except

Lucent Technologies Inc. 5 Advance Data Sheet January 1999 E2560/E2580-Type 10 Gbits/s EML Modules Outline Diagram 1-1006(F).r1 0.291 (7.38) 0.215 (5.47) 0.291 (7.384) 0.100 (2.54) 0.020 (0.508) 0.350 (8.89) 0.500 (12.7) 0.551 (13.99) 0.50 (12.7) LEAD 7 LEAD 1 TRADEMARK CODE LASER SERIAL NUMBER AND DATE CODE LABEL IN AREA SHOWN BEND LIMITER 0.498 (12.64) 1.025 (26.04) ∅ 0.106 (2.7) 0.190 (4.822) E2560: 0.078 (1.98) 0.050 (1.27) 0.020 (0.51) 0.350 (8.89) 0.500 (12.7) 0.551 (13.99) (12.7) LEAD 13 LEAD 1 TRADEMARK CODE LASER SERIAL NUMBER AND DATE CODE LABEL IN AREA SHOWN BEND LIMITER 0.498 (12.64) 1.025 (26.04) ∅ 0.106 (2.7) 0.190 (4.82) E2580:

12 PLACES

1.180 (29.97) 2.032 (51.61) 0.820 (20.83) TBD 0.56 (1.42) 0.365 (9.27) 0.180 (4.56) 0.030 (0.75) 0.228 (5.78) 0.98 (2.5) 0.260 (6.6) 0.200 (5.08) 0.078 (1.98) 0.010 ± 0.002 (0.25 ± 0.064) MIN

3 PLACES

4 PLACES

0.215 (5.45)

E2560/E2580-Type 10 Gbits/s EML Modules January 1999 For additional information, contact your M icroelectronics Group Account M anager or the following: IN TERNE T: http://www .lucent.com/micro, or for Optoelectronics inform ation, http://www .lucent.com/micro/opto E-M AIL: docm aster@mi cro.lucent.com N. AM ERICA: Microelectronics Group, Lucent Technologies Inc., 555 Union Boulevard, Room 30L-15P-BA, Allentown , PA 18103 1-800-372-2447, FAX 610-712-4106 (In C AN ADA: 1-800-553-2448, FAX 610-712-4106) ASIA PACIFIC : Microelectronics Group, Lucent Technologies Singapore Pte. Ltd., 77 Science Park Drive, #03-18 Cintech III, Singapore 118256 Tel. (65) 778 8833, FAX (65) 777 7495 C HIN A: M icroelectronics Group, Lucent Technologies (C hina) C o., Ltd., A-F2, 23/F, Zao Fong Universe Building, 1800 Zhong Shan Xi Road, Shanghai 200233 P. R. C hina Tel. (86) 21 6440 0468, ext. 316, FAX (86) 21 6440 0652 JAPAN: M icroelectronics Group, Lucent Technologies Japan Ltd., 7-18, H igashi-G otanda 2-chom e, Shinagaw a-ku, Tokyo 141, Japan Tel. (81) 3 5421 1600, FAX (81) 3 5421 1700 EU R O PE : D ata Requests: M ICR O ELEC TR O N ICS GR OU P DATALIN E: Tel. (44) 1189 324 299, FAX (44) 1189 328 148 Technical Inquiries:OP TOE LEC TR O N IC S M AR KETING: (44) 1344 865 900 (Ascot U K) Lucent Technologies Inc. reserves the right to ma ke changes to the product(s) or inform ation contained herein without notice. No liability is assum ed as a result of their use or application. No rights under any patent accompa ny the sale of any such product(s) or inform ation. ST is a registered trademark of Lucent T echnologies Inc. Co pyright © 1999 Lucent Technologies Inc. All Rights Reserved January 1999 DS99-078LWP Printed On Recycled Paper Laser Safety Information Class IIIb Laser Product This product com plies with 21 CFR 1040.10 and 1040.11. Single-mode connector W avelength = 1.5 µm Maxim um power = 10 mW Because of size constraints, laser safety labeling is not affixed to the module but attached to the outside of the ship- ping carton. Product is not shipped with power supply. Caution: Use of controls, adjustments, and procedures other than those specified herein may result in hazardous laser radiation exposure.