DTP3205

DTP3205 DIN-TEK | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 7

Technical content

N-Channel 55 V (D-S) MOSFET

FEATURES

• Halogen-free According to IEC 61249-2-21 Definition  TrenchFET ® Power MOSFET  100 % R g and UIS Tested  Compliant to RoHS Directive 2002/95/EC

APPLICATIONS

 Power Supply - Secondary Synchronous Rectification  DC/DC Converter Notes: a. Duty cycle  1 %. b. See SOA curve for voltage derating. c. When mounted on 1" square PCB (FR-4 material). d. Package limited. PRODUCT SUMMARY VDS (V) R DS(on) () ID (A)d Qg (Typ.) 0.0063 at VGS = 10 V 110 870.0071 at VGS = 4.5 V 90 TO-220AB GDS N-Channel MOSFET G D S ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) Parameter Symbol Limit Unit Drain-Source Voltage VDS 55 V Gate-Source Voltage VGS ± 20 Continuous Drain Current (TJ = 150 °C) TC = 25 °C ID 110d A TC = 70 °C 90d Pulsed Drain Current IDM 330 Avalanche Current IAS 60 Single Avalanche Energya L = 0.1 mH EAS 180 mJ Maximum Power Dissipationa TC = 25 °C PD 125b W TA = 25 °Cc 3.1 Operating Junction and Storage Temperature Range TJ, Tstg - 55 to 150 °C THERMAL RESISTANCE RATINGS Parameter Symbol Limit Unit Junction-to-Ambient (PCB Mount)c RthJA 40 °C/W Junction-to-Case (Drain) RthJC 1 DTP3205 www.din-tek.jp

a. Pulse test; pulse width  300 µs, duty cycle  2 %. b. Guaranteed by design, not subject to production testing. c. Independent of operating temperature. Stresses be yond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. SPECIFICATIONS (TJ = 25 °C, unless otherwise noted) Parame ter Symbol Test Conditions Min. Typ. Max. Unit Static Drain-Source Breakdown Voltage VDS VDS = 0 V, ID = 250 µA 55 V Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250 µA 1 4 Gate-Body Leakage IGSS VDS = 0 V, VGS = ± 20 V ± 250 nA Zero Gate Voltage Drain Current IDSS VDS = 55 V, VGS = 0 V 1 µAVDS = 55 V, VGS = 0 V, TJ = 12 5 °C 50 VDS = 55 V, VGS = 0 V, TJ = 150 °C 250 On-State Drain Currenta ID(on) VDS 10 V, VGS = 10 V 50 A Drain-Source On-State Resistancea RDS(on) VGS = 10 V, ID = 22 A 0.0063 VGS = 4.5 V, ID = 20 A 0.0071 Forward Transconductancea gfs VDS = 15 V, ID = 20 A 169 S Dynamicb Input Capacitance Ciss VGS = 0 V, VDS = 20 V , f = 1 MHz 5286 pFOutput Capacitance Coss 705 Reverse Tr ansfer Capacitance Crss 283 Total Gate Chargec Qg VDS = 20 V, VGS = 10 V, ID = 20 A 87 131 nCGate-Sou rce Chargec Qgs 15.3 Gate-Dra in Chargec Qgd 12.2 Gate Re sistance Rg f = 1 MHz 0.5 2. 7 5.4  Tur n-On Delay Timec td(on) VDD = 20 V, RL = 2  ID  10 A, VGEN = 10 V, Rg = 1  11 20 nsRise Timec tr 71 4 Turn -Off Delay Timec td(off) 45 68 Fall Timec tf 71 4 Drain-Source Body Diode Ratings and Characteristics TC = 25 °Cb Continuous Current IS 110 A Pulsed Current ISM 330 Forward Voltagea VSD IF = 10 A, VGS = 0 V 0.72 1.2 V Reverse Recovery Time trr IF = 10 A, dI/dt = 100 A/µs 42 63 ns Peak Reverse Recovery Current IRM(REC) 2.5 3.8 A Reverse Recovery Charge Qrr 52 78 nC DTP3205 www.din-tek.jp

HARACTERISTICS (25 °C, unless otherwise noted) Output Char acteristics Transfer Characteristics Transconductance 0 0.5 1.0 1.5 2.0 120 160 VDS - Drain-to-Source V oltage (V) ID - Drain Current (A) 3 V VGS = 10 V thru 4 V 0 0.6 1.2 1.8 2.4 3.0 VGS - Gate-to-Source V oltage (V) ID - Drain Current (A) TC = 25 °C TC = 125 °C TC = - 55 °C 0 1 63 24 86 48 0 180 270 360 450 ID - Drain Current (A) gfs - Transconductance ( TC = 125 °C TC = 25 °C TC = - 55 °C On-Re sistance vs. Drain Current On-Resistance vs. Gate-to-Source Voltage Gate Charge 0.0020 0 2 04 06 08 0 1 0 0 0.0050 0.0070 0.0075 0.0080 ID - Drain Current (A) RDS(on) - On-Resistance (Ω) VGS = 4.5 V VGS = 10 V 02 648 10 0.008 0.007 0.005 0.002 0.010 VGS - Gate-to-Source V oltage (V) RDS(on) - On-Resistance (Ω) ġTJ = 150 °C TJ = 25 °C 0 1 53 04 56 07 59 0 VGS - Gate-to-Source V oltage (V) Qg - Total Gate Charge VDS = 15 V ID = 24 A VDS = 24 V VDS = 8 V DTP3205 www.din-tek.jp

PICAL CHARACTERISTICS (25 °C, unless otherwise noted) Sou rce-Drain Diode Forward Voltage Capacitance On-Resistance vs. Junction Temperature 0.1 0.0 0.3 0.90.6 1.2 100IS - Sour ce Current (A) VSD - Sour ce-to-Drain Voltage (V) TJ = 150 °C TJ = 25 °C 102 03 04 0 2000 4000 6000 8000 VDS - Drain-to-Sour ce Voltage (V) C - Capacitance (pF) Crss Ciss Coss 0.5 - 50 - 25 25 75 1250 50 100 150 175 0.8 1.4 1.1 1.7 2.0 RDS(on) - On-Resistance (Normalized) TJ - Junction T emperature (°C) ID = 22 A VGS = 4.5 V VGS = 10 V Thresh old Voltage Drain Source Breakdown vs. Junction Temperature Current Derating 0.2 - 50 - 25 25 75 1250 50 100 150 175 0.7 1.7 1.2 2.2 TJ - Junction T emperature (°C) VGS(th) (V) ID = 250 μA - 50 - 25 25 75 1250 50 100 150 VDS - Drain-to-Sour ce Voltage (V) TJ - Junction T emperature (°C) ID = 250 μA 25 50 75 100 150125 120 160 TC - Case T emperature (°C) ID - Drain Curr ent (A) Package Limited DTP3205 www.din-tek.jp

L CHARACTERISTICS (25 °C, unless otherwise noted) Sing le Pulse Avalanche Current Capability vs. Time 0.00001 0.0001 0.001 0.01 0.1 100 Time (s) IDA V (A) TJ = 25 °C TJ = 150 °C Safe Ope rating Area 0.01 0.1 1 10010 0.1 1000 100 VDS - Drain-to-Sour ce Voltage (V) * VGS > minimum VGS at which RDS(on) is specified ID - Drain Curr ent (A) 100 μs 1 ms 10 ms Limited by RDS(on)* 100 ms, 1 s 10 s, DC BVDSS LimitedTA = 25 °C Single Pulse Norm alized Thermal Transient Impedance, Junction-to-Case 10-4 10-3 10-2 10-1 1 0.1 Squar e Wave Pulse Duration (s) Normalized Ef fective Transient Thermal Impedance Single Pulse 0.05 0.02 Duty Cycle = 0.5 0.2 0.1 DTP3205 www.din-tek.jp

s * M = 1.32 mm to 1.62 mm (dim ension including protrusion) Heatsink hole for HVM 321 L L(1) D H(1) Q Ø P A F J(1) b(1) e(1) e E b C MILLIMETERS INCH ES A 4.25 4.65 0.167 0.183 b 0.69 1.01 0.027 0.040 b(1) 1.20 1.73 0.047 0.068 c 0.36 0.61 0.014 0.024 D 14.85 15.49 0.585 0.610 E 10.04 10.51 0.395 0.414 e 2.41 2.67 0.095 0.105 e(1) 4.88 5.28 0.192 0.208 F 1.14 1.40 0.045 0.055 H(1) 6.09 6.48 0.240 0.255 J(1) 2.41 2.92 0.095 0.115 L 13.35 14.02 0.526 0.552 L(1) 3.32 3.82 0.131 0.150 Ø P 3.54 3.94 0.139 0.155 Q 2.60 3.00 0.102 0.118 ECN: X12-0208-Rev. N, 08-Oct-12 DWG: 5471

Package Information

www.din-tek.jp

ALL PROD UCT, PRODU CT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Din-Tek Intertechnology, Inc., its affiliates, agents, and employee s, and all persons acting on it s or their behalf (collectivel y, “Din-Tek”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Din-Tek makes no warranty, repres entation or guarantee regarding the suitabilit y of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Din-Tek disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation specia l, consequential or incidental damages, and (iii) any and all i mplied warranties, including warra nties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain type s of applications are based on Din-Tek’s knowledge of typical requirements that are often placed on Din-Tek products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsib ility to validate that a particu lar product with the properties descri bed in the product specification is suitable fo r use in a particular application. Parameters provided in datasheets and/or specification s may vary in different applications an d performance may vary over time. All operating parameters, including typical pa rameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Din-Tek’s terms and condit ions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicate d in writing, Din-Tek products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Din-Tek product could result in personal injury or death. Customers using or selling Din-Tek products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Din-Tek personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual prope rty rights is granted by this document or by any conduct of Din-Tek. Product names and markings noted herein may be trademarks of their respective owners. Material Category Policy Din-Tek Intertechnology, Inc. hereby certi fies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The Euro pean Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant. Please note that some Din-Tek documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU. Din-Tek Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Din-Tek documentation may still make reference to the IEC 61249-2-21 definition. We co nfirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Legal Disclaimer Notice www.din-tek.jp