DSS4X | DigiCamel IC Datasheet

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DSS4X TTELEC | Alldatasheet

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Absolute tolerances to ±0.1% Tight TCR tracking to ±5ppm/°C Ratio match tolerances to ±0.05% Ultra-stable tantalum nitride resistors IRC’s TaNSil® network array resistors are ideally suited for applications that demand a small footprint. The small wire bondable chip package provides higher component density, lower resistor cost and high reliability. The tantalum nitride film system on silicon provides precision tolerance, exceptional TCR tracking and low cost. Excellent performance in harsh, humid environments is a trademark of IRC’s self-passivating TaNSil® resistor film. For applications requiring high performance resistor networks in a low cost, wire bondable package, specify IRC network array die. Wire Bondable Resistor Network Arrays Chip Network Array Series Absolute tolerances to ±0.1% Tight TCR tracking to ±5ppm/°C match tolerances to ±0.05% Ultra-stable tantalum nitride resistors IRC’s TaNSil® network array resistors are ideally suited for that demand a small footprint. The small wire bondable chip package provides higher component density, lower resistor cost and high reliability. The tantalum nitride system on silicon provides precision tolerance, TCR tracking and low cost. Excellent performance in harsh, humid environments is a trademark of IRC’s TaNSil® resistor For requiring high performance resistor networks in a low cost, wire bondable package, specify IRC network array die. General Note IRC reserves the right to make changes in product speciﬁcation without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of TT electronics plc© IRC Advanced Film Division Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

4222 South Staples Street • Corpus Christi Texas 78411 USA Wire Bondable Resistor Network Arrays
Absolute tolerances to ±0.1%
Tight TCR tracking to ±5ppm/°C
Ratio match tolerances to ±0.05%
Ultra-stable tantalum nitride resistors Chip Network Array Series IRC’s TaNSil® network array resistors are ideally suited for applications that demand a small footprint. The small wire bondable chip package provides higher component density, lower resistor cost and high reliability. The tantalum nitride ﬁlm system on silicon provides precision tolerance, exceptional TCR tracking and low cost. Excellent performance in harsh, humid environments is a trademark of IRC’s self-passivating TaNSil® resistor ﬁlm. For applications requiring high performance resistor networks in a low cost, wire bondable package, specify IRC network array die. WBC Series Issue January 2009 Sheet 1 of 4 Absolute TCR Commercial Code MIL Inspection Code* ±300ppm/°C 00 04 ±100ppm/°C 01 05 ±50ppm/°C 02 06 ±25ppm/°C 03 07 TCR/Inspection Code Table *Notes: Product supplied to Class H of MIL-PRF 38534 include 100% visual inspection Power Derating Data Electrical Data Isolated Bussed Resistance Range 10Ω to 2.5MΩ 10Ω to 1.25MΩ Absolute Tolerance to ±0.1% Ratio Tolerance to R1 to ±0.05% to ±0.1% Absolute TCR to ±25ppm/°C Tracking TCR to ±5ppm/°C Element Power Rating 100mW @ 70°C 50mW @ 70°C Package Power Rating 8-Pad 400mW @ 70°C 16-Pad 800mW @ 70°C 24-Pad 1.0W @ 70°C Rated Operating Voltage (not to exceed P x R) 100V Operating Temperature -55°C to +150°C Noise <-30dB Substrate Material Oxidized Silicon (10KÅ SiO2 minimum) Substrate Thickness 0.016˝ ±0.001 (0.406mm ±0.01) Bond Pad Metallization Aluminum 10KÅ minimum Gold1 15KÅ minimum Backside Silicon (gold available1) Passivation Silicon Dioxide or Silicon Nitride Resistors All parts are Pb-free and comply with EU 2011/65/EU (RoHS2) 11.17 General Note All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc http://www.ttelectronics.com/resistors BI Technologies IRC Welwyn Note 1: Not recommended for new designs Resistors All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2) 11.17 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc http://www.ttelectronics.com/resistors BI Technologies IRC Welwyn

4222 South Staples Street • Corpus Christi T exas 78411 USA Wire Bondable Resistor Network Arrays Manufacturing Capabilities Data Absolute TCR (±ppm/°C) Isolated schematic A Bussed schematic B Ohmic range (Ω) Available tolerances Available ratio tolerances Best TCR tracking (±ppm/°C) Ohmic range (Ω) Available tolerances Available ratio tolerances Best TCR tracking (±ppm/°C) 300 10 - 25 F G J F G 50 10 - 25 F G J F G 200 26 - 50 D F G J C D F 10 26 - 50 F G J D F G 100 51 - 200 C D F G J C D F G 5 51 - 100 D F G J C D F G 50 201 - 2.5M B C D F G J A B C D F G 5 101 - 200 D F G J B C D F G 25 201 - 500 B C D F G J B C D F G 20 501 - 1.25M B C D F G J A B C D F G 5 100 26 - 50 D F G J C D F G 10 26 - 50 F G J D F G 100 51 - 200 C D F G J C D F G 5 51 - 100 D F G J C D F G 50 201 - 2.5M B C D F G J A B F G 5 101 - 200 D F G J B C D F G 25 201 - 500 B C D F G J B C D F G 20 501 - 350K B C D F G J A B C D F G 5 26 - 50 D F G J C D F G 10 51 - 100 D F G J C D F G 50 51 - 200 C D F G J C D F G 5 101 - 200 D F G J B C D F G 25 201 - 2.5M B C D F G J A B F G 5 201 - 500 B C D F G J B C D F G 20 501 - 1.25M B C D F G J A B C D F G 5 51 - 200 C D F G J C D F G 5 201 - 500 B C D F G J B C D F G 20 201 - 2.5M B C D F G J A B F G 5 501 - 1.25M B C D F G J A B C D F G 5 WBC Series Issue January 2009 Sheet 2 of 4 11.17 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc http://www.ttelectronics.com/resistors BI Technologies IRC Welwyn

4222 South Staples Street • Corpus Christi T exas 78411 USA Wire Bondable Resistor Network Arrays Physical Data DSS4X DSS8X 2 43 15 14 13 65 7 12 11 10 16 1415 45 6 1213 11 23 4 67 5 DSS4A DSS4B DSS8A DSS8B 0.004˝ min Bond Pads 0.140˝ ±0.001 (3.556mm ±0.025) 0.080˝ ±0.001 (2.032mm ±0.025) 0.004˝ min Bond Pads 0.070˝ ±0.001 (1.778mm ±0.025) 0.070˝ ±0.001 (1.778mm ±0.025) Pad 1 Pad 1 WBC Series Issue January 2009 Sheet 3 of 4 Wire Bondable Resistor Network Arrays Chip Network Array Series 11.17 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc http://www.ttelectronics.com/resistors BI Technologies IRC Welwyn

4222 South Staples Street • Corpus Christi T exas 78411 USA Wire Bondable Resistor Network Arrays WBC Series Issue January 2009 Sheet 4 of 4 Ordering Data Prefix WBD DSS8 - B - 01 - 1002 - F - B Style DSS4 = 8-pad Network DSS8 = 6-pad Network DQSC = 24-pad Network Schematic and Termination A = Isolated; B = Bussed TCR/Inspection Code Reference TCR/Inspection Code Table Resistance Code 4-Digit Resistance Code Ex: 1002 = 10KΩ, 50R1 = 50.1Ω Absolute Tolerance Code Ratio Tolerance Code (optional) Packaging Standard packaging is 2˝ x 2˝ chip tray. For additional information or to discuss your speciﬁc requirements, please contact our Applications Team using the contact details below. DQSCX Physical Data 12 34 5 24 23 22 21 20 10867 9 1211 151718 16 1314 32 54 2223 2021 15 10876 9 1718 16 11 12 14 13 DQSCA DQSCB 0.004˝ min Bond Pads 0.115˝ ±0.001 (2.921mm ±0.025) 0.086˝ ±0.001 (2.184mm ±0.025)Pad 1 Test Method Max ∆R Typical ∆R Thermal Shock MIL-STD-202 Method 107 Test condition F ±0.1% ±0.02% High Temperature Exposure MIL-STD-883 Method 1008 150°C, 1000 hours ±0.1% ±0.05% Low Temperature Storage -55°C, 1000 hours ±0.03% ±0.01% Life MIL-STD-202 Method 108 70°C, 1000 hours ±0.5% ±0.01% Life at Elevated Temperature MIL-STD-202 Method 108 125°C, 1000 hours ±0.5% ±0.05% Environmental Data Wire Bondable Resistor Network Arrays Chip Network Array Series 11.17 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc http://www.ttelectronics.com/resistors BI Technologies IRC Welwyn

Product Information

DSS4X specifications and overview.

Summary

Wire Bondable Resistor Network Arrays

Description

Wire Bondable Resistor Network Arrays

Source title DSS4X Datasheet(PDF) - TT Electronics.

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