DSC500200L PANASONIC | Alldatasheet
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Ver. EED Publication date: March 2014 DSC5002 Silicon NPN epitaxial planar type For general amplification Complementary to DSA5002 DSC2002 in SMini3 type package Features High forward current transfer ratio hFE with excellent linearity Low collector-emitter saturation voltage VCE(sat) Halogen-free / RoHS compliant (EU RoHS / UL-94 V-0 / MSL: Level 1 compliant) Marking Symbol: C2 Packaging DSC5002×0L Embossed type (Thermo-compression sealing): 3 000 pcs / reel (standard) Absolute Maximum Ratings Ta = 25°C Parameter Symbol Rating Unit Collector-base voltage (Emitter open) VCBO 60 V Collector-emitter voltage (Base open) VCEO 50 V Emitter-base voltage (Collector open) VEBO 5 V Collector current IC 500 mA Peak collector current ICP 1 A Collector power dissipation PC 150 mW Junction temperature Tj 150 °C Operating ambient temperature Topr –40 to +85 °C Storage temperature Tstg –55 to +150 °C Electrical Characteristics Ta = 25°C±3°C Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) VCBO IC = 10 mA, IE = 0 60 V Collector-emitter voltage (Base open) VCEO IC = 2 mA, IB = 0 50 V Emitter-base voltage (Collector open) VEBO IE = 10 mA, IC = 0 5 V Collector-base cutoff current (Emitter open) ICBO VCB = 20 V , IE = 0 0.1 mA Forward current transfer ratio *1 hFE1*2 VCE = 10 V , IC = 150 mA 120 340 hFE2 VCE = 10 V , IC = 500 mA 40 Collector-emitter saturation voltage *1 VCE(sat) IC = 300 mA, IB = 30 mA 0.1 0.6 V Transition frequency fT VCE = 10 V , IC = 50 mA 160 MHz Collector output capacitance (Common base, input open circuited) Cob VCB = 10 V , IE = 0, f = 1 MHz 4.8 15 pF Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *1: Pulse measurement *2: Rank classification Code R S 0 Rank R S No-rank hFE1 120 to 240 170 to 340 120 to 340 Marking Symbol C2R C2S C2 Product of no-rank is not classified and have no marking symbol for rank. Unit: mm 1: Base 2: Emitter 3: Collector Panasonic SMini3-F2-B JEITA SC-85 Code
Ver. EED DSC5002 P C Ta I C VCE h FE IC V CE(sat) IC I C VBE Cob VCB 0 200 160 40 120 80 200 150 100 250 Ambient temperature Ta (°C) Collector power dissipation PC (mW) DSC5002_PC-Ta 0 12 2 10 4 8 6 Collector current IC (mA) Collector-emitter voltage VCE (V) DSC5002_IC-VCE Ta = 25°C IB = 3.0 mA 0.3 mA 0.6 mA 0.9 mA 1.2 mA 1.5 mA 1.8 mA 2.1 mA 2.4 mA 2.7 mA 350 300 250 200 150 100 10 102 103 Forward current transfer ratio hFE Collector current IC (mA) DSC5002_hFE-IC 25°C −40°C Ta = 85°C VCE = 10 V 10−2 10−1 10 102 103 Collector-emitter saturation voltage VCE(sat) (V) Collector current IC (mA) DSC5002_VCEsat-IC 25°C −40°C Ta = 85°C IC / IB = 10 Collector current IC (mA) Base-emitter voltage VBE (V) DSC5002_IC-VBE −40°C 25°C Ta = 85°C VCE = 10 V 10 100 Collector-base voltage VCB (V) DSC5002_Cob-VCB Collector output capacitance (Common base, input open circuited) Cob (pF) IE = 0 f = 1 MHz Ta = 25°C f T IC 0.1 250 200 150 100 1 10 100 Transition frequency fT (MHz) Collector current IC (mA) DSC5002_fT-IC VCE = 10 V Ta = 25°C
Ver. EED DSC5002 SMini3-F2-B Unit: mm Land Pattern (Reference) (Unit: mm)
Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or im- provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202
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