DS5000 DALLAS | Alldatasheet

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b4YE D MM 2614130 0007454 722 MBDAL Dss000(T) DALLAS SEMICONDUCTOR CORP SEMICONDUCTOR Soft Microcontroller FEATURES PIN ASSIGNMENT © 8-bit 8051 compatible uC adapts to task—at-hand: vo [PE Vee ~ 8 or 32 Kbytes of nonvolatile RAM for program pit [Be 2065] pooapo and/or data memory storage pi2 Bs 388 pos an — Initial downloading of software in end system pis |B4 37] Pozane via on-chip serial port pia ls 36 | P09 ADs — Capable of moditying its own program and/or ois Igo 3 | Po ADs data memory in end use ots |g? 346i] Pos aps © Crashproof operation: Puy |Ge 33] P06 ADs — Maintains all nonvolatile resources for 10 years mxoree [oso = F ie inthe absence of Voc Txops [B11 30 B} ate — Power-tail reset Wropa2 |G 12 208] PSEN — Early warning power-fail interrupt iTipsa (B18 2B] Po7ats — Watchdog timer Topas |} 14 27 Bi] P2cats r . T1P35 |B 45 26 | P2sais © Software Security Feature: anras [Bie eal peaate — Executes encrypted software to prevent unau- Roar IBiz 2a Ol] Posan thorized disclosure xra2 [Bt 2B pazato ‘© On-chip, full-duplex serial VO ports xmaLt |B 19 228) P21A9 eno [B20 21B) Paoas © Two on-chip timer/event counters 40-Pin Encapsulated Package © 32 parallel VO lines © Compatible with industry standard 8051 instruction ‘set and pinout © Optional Permanently Powered RealTime Clock (DS5000T)

DESCRIPTION

The DS5000(T) Soft Microcontroller is afully 8051. com- _is implemented using either BK or 32K bytes of nonvola- patible 8-bit CMOS microcontroller that offers “soft- tile CMOS SRAM. Furthermore, intemal data registers ness" in all aspects of its application. This is accom- and key configuration registers are also nonvolatile. An plished through the comprehensive use of nonvolatile optional realtime clock gives permanently powered technology to preserve all information inthe absence of timekeeping. The clock keeps time to a hundredth of a system Voc. The internal progranvdata memory space _second using an on-board crystal. o4zi9 118 229

Dss000(7) ; S4E D MM 2614130 oO074S5S5 ba MEDAL DALLAS SEMICONDUCTOR CORP ORDERING INFORMATION - PART NUMBER MAX CRYSTAL SPEED TIMEKEEPING? ee [Dssoomere | keys ewe [ossoco-e-1e [eK tee TN [pssoooses | saxyes few «eid [pssowo-se1@ | _sekbyes [awe fe [pssooo-see | saxbyes | ewe «fe DSnOOT-F8 [ossooore1@ | exbyes few me [ossooor-e1e | keyes | tem es [ossooorsee [sekbyes [ewe eS DsstooT-se-12 Dssooor-s216 | 2&Kbyes-|__t6mie it Yr Operating information is contained in the User's Guide section of the Soft Microcontroller Data Book. This data sheet provides ordering information, pinout, and electrical specification. DS5000(T) BLOCK DIAGRAM Figure 1 DSS000(T) Porro Vee | | Veco. | P0007 | 9 | CLL LLL oe | Pron | ADORESS BUS | CZ7Z772) fazer Zezzry ok oR 20K | 20-27 | 4 OZZZZZLI Y ir pacar | (Dss000FP Ky RE | easton eA ! Y 1 ALE 4 fal : 5 4 EA I 4 (2850007) | MAL aon tnd ' we | RERTE | ono! | ee oon | I 1 | @) 1 t onerse 2ne 230

B4E D MM 2614130 OOO74Sb STS MEDAL Oss000(T) DALLAS SEMICONDUCTOR CORP FIN DESUrir nur PIN NUMBER DESCRIPTION 1-8 P1.0-P1.7 General purpose /O Port 1 RST Active high reset input. A logic 1 applied to this pin will activate a reset state. This pin is pulled down internally so this pin can be left unconnected if not used. P3.0 RXD General purpose I/O port pin 3.0. Also serves as the receive signal for the on board UART. This pin shoud not be connected directly toa PC. COM port. P3.1TXD Genera! purpose I/O port pin 3.1. Also serves as the transmit signal for the on board UART. This pin should not be connected directly toa PC COM port. P3.2 INTO General purpose /O port pin 3.2. Also serves as the active low External Inter- rupt 0. P3.3 INTI General purpose /O port pin 3.3. Also serves as the active low External Inter- rupt 1 14 P3.4T0 General purpose VO port pin 3.4. Also serves as the Timer 0 input. P3.5T1 General purpose VO port pin 3.5. Also serves as the Timer 1 input. P3.6WR General purpose I/O port pin. Also serves as the write strobe for Expanded bus operation. 17 P3.7 RD General purpose V/O port pin. Also serves as the read strobe for Expanded bus operation. 18,19 XTAL2, XTAL1 Used to connect an external crystal to the internal oscillator. XTAL1 is the input to an inverting amplifier and XTAL2 is the output. GND Logic ground, P2.0-P2.7 General purpose VO Port 2. Also serves as the MSB of the Expanded Address bus, sets 318 231

Dss000(T) b4E D MM 2624230 GOO7457? 431 MEDAL DALLAS SEMICONDUCTOR CORP PSEN Program Store Enablo. This active low signal is used to enable an external program memory when using the Expanded bus. It is normally an output and should be unconnected if not used. PSEN also is used to invoke the Bootstrap Loader. At this time, PSEN will be pulled down extemally. This should only be done once the DS5000 is already in a reset state. The device that pulls down should be open drain since it must not interfere with PSEN under normal opera- tion.

1 ALE

‘Address Latch Enable. Used to de-multiplex the multiplexed Expanded ‘Address/Data bus on Port 0. This pin is normally connected to the clock input on a'373 type transparent latch. When using a parallel programmer, this pin also assumes the PROG function for programming pulses. EA ; External Accoss. This pin forces the DS5000 to behave like an 8031. No inter- nal memory (or clock) will be available when this pin is at a logic low. Since this pin is pulled down internally, it should be connected to +5V to use NVRAM. In a parallel programmer, this pin also serves as Vpp for super voltage pulses. 32-39 P0.7-P0.0 General purpose VO Port 0. This port is open-drain and can not drive a logic 4. It requires external pull-ups. Port 0 is also the muttiplexed Expanded Address/Data bus. When used in this mode, it does not require pull-ups. a (oe +5 volts. INSTRUCTION SET machineis 16bits, a maximum of 64 Kbytes of program ‘The D$5000 executes an instruction set which is object memory and 64 Kbytes of data memory can be ac- code compatible with the industry standard 8051 micro- cessed by the DS5000 CPU. The 8K or 32K byte RAM controller, Asa result, software development packages _area inside of the DS5000 canbe used to contain both Which have been written for the 8051 are compatible —_ program and data memory. with the DS5000, including cross~assomblors, high— level language compilers, and debugging tools. The Real-time Clock (RTC) in the DS5000T is reached in the memory map by setting a SFR bit. The MCON.2 A.complete description for the DS5000 instruction setis _bit (ECE2) is used to select an alternate data memory available in the User's Guide section of the Soft Micro- map. While ECE2=1, all MOVXs will be routed to this controller Data Book. alternate memory map. The real-time clock is a serial device that resides in this area. A full description of the RIC access and example softwareis given inthe User's MEMORY ORGANIZATION | Guide section of the Soft Microcontroller Data Book. If Figure 2 illustrates the address spaces which are ae- the ECE2 bit is set on a DS5000 without a timekeeper, cessed by the DS5000. Asillustratedinthefigure, Sep- the MOVXs will simply go to a nonexistent memory. arate address spaces exist for program and data #tware execution would not be affected otherwise. memory. Since the basic addressing capability of the a wees ane 232

64E D MM 2614130 0007458 378 MMDAL Dsso0a(T) DALLAS SEMICONDUCTOR CORP DS5000 LOGICAL ADDRESS SPACES Figure 2 oo - “Wy k= a J Yj SERS Y | ADR Wve |

255 PROGRAM;

INTERNAL REGISTERS: LEGEND: = vemaMEnonr PROGRAM LOADING ‘The DS5000 is placed in its Program Load configuration The Program Load Modes allow initialization of the by simultaneously applying a logic 1 to the RST pin and NVRAM ProgramData Memory. This initialization may forcing the PSEN line to a logic 0 level. Immediately fol- be performed in one of two ways: lowing this action, the DS5000 will look for a parallel Program Load pulse, or a serial ASCII carriage return 1. Serial Program Loading which is capable of per- —_ (0DH) character received at 9600, 2400, 1200, or 300 forming Bootstrap Loading of the DS5000(T). This _bps over the serial port. feature allows the loading of the application program to be delayed until the DS5000(T) is installed in the The hardware configurations used to select these end system. modes of operation are illustrated in Figure 3. 2. Parallel Program Load cycles which perform the ini- tial loading from parallel address/data information presented on the V/O port pins. this mode is timing- set compatible with the 8751H microcontroller pro- gramming mode. ee comme 233

9500007) _ BYE D MM 2624130 0007459 204 MMDAL P PROGRAM LOADING CONFIGURATIONS Figure3 «DALLAS SEMICONDUCTOR COR Veo GND Veo GND Dss000 088000 PROGRAM, — -| PROGRAM — | asta) "B35 "Ba ‘ave-ate PROGRAM "Bio Ba EAVep ° P26 x . ALEPROG ° por en |__| ORNP!| Rszaec CONTROL par P26 pas Rex | 3 nea amar ST XTALY rst 7 PSEN| 11.050 MHz ‘PSEN| XTAL2 } XTAL2 % PARALLEL SERIAL LOADING LOADING Table 1 summarizes the selection of the available Paral-_programin an Intel hex representation to be loaded into Jel Program Load cycles. The timing associated with and read back from the device. Intel hex is the typical these cycles is illustrated in the electrical specs. format which existing 8051 cross~assemblers output. The serial loader responds to single character com- mands which are summarized below: SERIAL BOOTSTRAP LOADER The Serial Program Load Mode is the easiest, fastest, COMMAND FUNCTION most reliable, and most complete method of initially CRO-16 checksum of loading application software into the DS5000 nonvola- c Return ne sum of em- tile RAM. Communication can be performed over a Dump |i Mee Fil standard asynchronous serial communications port. A 4 one nt ne nea block with typical application would use a simple RS232C serial in- F enn terfaceto program the DS5000 as a final productionpro- . cedure. The hardware configuration which is required ‘ road oo rt it Eneryption Koy for the Serial Program Load mode is illustrated in Figure Loac neu 3. Port pins 2.7 and 2.6 must be either open or pullled R Read wo paaaed Intel Hox highto avoid placing the $5000 ina parallelload cycle. we (Echo) incoming Although an 11.0592 MHz crystal is shown in Figure 3, variety of crystal frequencies and leader baud rates are y oe Seou rity tort AM with supported, shown in Table 2. The serial loader is de- ferity =mbedded in signed to operate across a three-wire interface from a wwite con fox standard UART. The receive, transmit, and ground w ome ° (easter wires are all that are necessary to establish commu- z Security v cation with tho DSS000. P Put a value to a port. G Get a value from a port. The Serial Bootstrap Loader implements an easy—to— use command line interface which allows an application a owei0s ene 234

64E D MM 2624130 0007460 T2b mMDAL 2880007) PARALLEL PROGRAM LOAD CYCLES Table 1 MODE RST PSEN PROG EA P27 P26 P25 Program 1 ° ° Vpp 1 0 x Security Set 1 ° 0 Vpp 1 1 x Verify 1 x x 1 ° oO x Prog Expanded 1 0 ° Vpp 0 1 0 Verify Expanded 1 ° 1 1 0 1 0 Prog MCON or Key ragisters 1 () ° Ver ° 1 1 Verify MCON registers 1 [) 1 1 0 1 1 The Parallel Program Cycle is used to load a byte of program memory. The next 4 Kbytes of Embedded data into a register or memory location within the RAM are mapped as Data Memory. $5000. The Verify Cycle is used to read this byte back for comparison with the originally loaded value to verify In order to program more than 4 Kbytes of program properloading. The Security Set Cycle may beusedto code, the Program/Verify Expanded cycles can be enable and the Software Security feature of the used. Upto32 Kbytes of program code can be entered DS5000. Onemay also enter bytes forthe MCONregis- and verified. Note that the expanded 32 Kbyte Program’ ter or for the five encryption registers usingthe Program —_Verity cycles take much longer than the normal 4 Kbyte MCON cycle. When using this cycle, the absoluteregis- Program/Verify cycles. ter address must be presented at Ports 1 and 2 as inthe normal program cycle (Port 2 should be 00H). The A typical parallel loading session would follow this pro- MCON contents can likewise be verified usingthe Verify cedure. First, set the contents of the MCON register MCON cycle. with the correct range and partition only if using expand- ed programming cycles. Next, the encryption registers When the DS5000 first detects a Parallel Program canbe loaded to enable encryption of the program/data ‘Strobe pulse or a Security Set Strobe pulse while in the memory (not required). Then, program the DS5000 us- Program Load Mode following a Power On Reset, the —_ing either normal or expanded program cycles and internal hardware of the DS5000 is initialized so thatan check the memory contents using Verify cycles. The existing 4 Kbyte program can be programmed into a __last operation would be to tum on the security lock fea- DS5000 with little or no modification. This initialization ture by either a Security Set cycle or by explicitly writing automatically sets the Range Address for 8 Kbytes and _to the MCON register and setting MCON.0 to a1. maps the lowest 4 Kbyte bank of Embedded RAM as DALLAS SEMICONDUCTOR CORP Ee o4ates 778 235

Dsso00(r) BYE D MM 2614130 O0074b1 be MBDAL . SERIAL LOADER BAUD RATES FOR DIFFERENT CRYSTAL FREQUENCIES Table 2 FREQ (He BAUD RATE CRYSTAL mn [00 Tva00 T2000 [o000 [10200 [soo |

14.7456 Y Y Y Y

11.0592 Y Y Y Y Y Y

9.21600 Y Y Y Y

7.37280 Y Y Y Y

5.52960 Y Y Y Y

1.84320 Y Y Y Y

ADDITIONAL INFORMATION Kit allows the user to download Intel hex formatted code ‘Acomplete description for all operational aspects ofthe _ directly to the DS5000 from a PC-XT/AT or compatible . $5000, is provided in the User's Guide section of the computer. The kit consists of a DS5000T-32-12, anin- Soft Microcontroller Data Book. terface pod, demo software, and an RS232 connector that attaches to the COM1 or COM2 serial port of a PC. See the User's Guide for further details. DEVELOPMENT SUPPORT Dallas Semiconductor offers a kit package for develop- ing and testing user code. The DS5000TK Evaluation DALLAS SEMICONDUCTOR CORP onzies ane 236

BYE D MM 2614130 O0074b2 arg MEDAL BSs000(T) ABSOLUTE MAXIMUM RATINGS* Voltage on Any Pin Relative to Ground 0.3V to7.0V Operating Temperature 0°C to +70°C Storage Temperature 40°C to 70°C ‘Soldering Temperature 260°C for 10 seconds * This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maxi- mum rating conditions for extended periods of time may affect reliability. DC CHARACTERISTICS (ta = 0°C to70°C; Voc = SV + 5%) [rewiowvenwse +t va [es [| os | v | 1 _| a a Output Low Voltage @ Iq.=1.6mA. Vou v (Ports 1, 2, 3) Output Low voltage @ ly =3.2mA Vowz v (Ports 0, ALE, l) Output High Voltage @ Iou=-80nA Vout 24 Vv (Ports 1, 2, 3) ‘Output High Votage @ loy—400 pA | Vone v (Ports 0, ALE, PSEN) Input Low Current Vin = 0.45V (Ports. pA 1,2,3) Transition Current; 1 to 0 In HA Viy = 2.0V (Ports 1, 2, 3) Input Leakage Current h pA 0.45 < Vin < Voc (Port 0) a Programming Supply Voltage Vpp v (Parallel Program Mode) [resensunivcwen | we [| [| @ | = [mm [| Operating Current DS5000-8K@8 MHz 25.2 mA DS5000-32K @ 12 MHz 35.7 DS5000T-32-16 @ 16 MHz 45.6 fae voseCoren@ remne | oe |] «8 [oa] mm [3] DALLAS SEMICONDUCTOR CORP 237

se00(7) BYE D MM 2614130 0007463 735 MMDAL DALLAS SEMICONDUCTOR CORP AC CHARACTERISTICS EXPANDED BUS MODE TIMING SPECIFICATIONS (ta = 0°C to70°C; Voc = 5V + 5%) [+ [PARAMETER swweou_[ ww [wax | UNTs | Oscillator Frequency tei 8 (-8) 12(-12) 16 (-16) | 2 [ALE Pulse Wisth ee ee ee [2 [Adsiss aictoALE Low ftw tee | | | | 4 _[Aderess Hold After ALE Low [twa [tox [ns ‘ALE Low to Valid Instr. In taut AtouK -150 @16 MHz 4touK -90 [6 [ALE Low to PSEN Low [ture | toes | ns | [7 [PSERPucowom id trop fea | | PSEN Low to Valid Instr. in tpswvi BtorK -150 | @16 MHz Stork -90 [2 |Impwtinst.HokdaterPSENGongHigh | twew [| 9 [ns [10" [npn Fat ater PEW Going High | weex [|__| taxed |_| [it [poses Heater PSENongtigh [wow | exe | | | ‘Address Valid to Valid Instr. In tat BtciK -150 @16 MHz Stor -90 [is [PSENLowieAdtossFet | wae fo | |_| [4 [Ro Pus wan «tor | eae t00 | |_| [is [wiirusowan | mw fox | |_| RD Low to Valid Data In trDLov Stok “165 @16 MHz Stork -105 Data Hold aftor RD High ee ee ee | 12 | Data Fat after RD High [wow [| oro [ns | ‘ALE Low to Valid Data In taLtvo 8cuk -150 @16 MHz BtciK -90 Valid Addr. to Valid Data In tavov StoLK -165 @16 MHz Stoik -105 | 21 [ALE Low to RD or WR Low TALLROL Btax-50 | Stax+50 | ns | Adress Valid to RD or WR Low toro | ateux-t30 [ns | [25 [aa vaistoWRGangtow | town | tees? | | os _| Data Valid to WR High Thou -150 @16 MHz Tteux -90 [25 [am vaicanorWHh | wmv | tues? | | | 26 [RD Low to Address Float ee ee [ 27_[RD or WR High to ALE High [trowan | toux-40 | tax+so [ns | a 042109 10718 238

b4E D) mm 2614130 ooo? 4ey 671 MMDAL Dss000(T) DALLAS SEMICONDUCTOR CORP EXPANDED PROGRAM MEMORY READ CYCLE ALE ® ® —{—2-} Fak 0} ® ® ©) (ORR) © aes = ee n>) ae, (2) = eX EXPANDED DATA MEMORY READ CYCLE @ ws y = ® L a ay — = r\\b oe] / 5 am ® poker Fe | ® N iN roms] nitfen | Yeoman Ca) C5 L__ -_ 20) rome | ravmaconneumoum Kner 042183 1198 239

64E D MM 2634130 OOO74bS SOS MDAL DSS000(T) EXPANDED DATA MEMORY WRITE CYCLE DALLAS SEMICONDUCTOR CORP ALE L/ PSEN (8) Wa @-+| @ a re —— | (ae T= HF EXTERNAL CLOCK TIMING = Lo ==e_— Soo OS 240

BYE D MM 2614130 OOO74bb 444 MEDAL sso0er) “——~ DALLAS SEMICONDUCTOR CORP AC CHARACTERISTICS (cont'd) EXTERNAL CLOCK DRIVE (ta = 0°C to70°C; Voc = SV + 5%) [* [ranawerer | sven [omy [wax | uns el Da @16 MHz id Ce ee @16 MHz ae a @16 MHz Ea Da @16 MHz AC CHARACTERISTICS (cont'd) POWER CYCLING TIMING {ta = 0°C t070°C; Voc = SV + 5%) [+ [ranaweren SS SSvwmoL [mW [wax | unre | [2a |seowRatotonveonmeaay |e | | | = _| [es [eneaisanvptme | ee | me | [se [PowerOnResctOeay | won| «dete | tc SERIAL PORT TIMING - MODE 0 INSTRUCTION be torte tet et ete tr de | ALE cLock k-@)41 DATAQUT. = ® Pe Vel XK De Xs XK XK 8X7 serm MEU RRister @ ® INPUT DATA KX XX XXX HX XX XX XK se + VALID VALID VALID: VAUD VALID. VALID: VALID CLEAR Ri 042199 1318 241

BYE D MM 2614130 0007467? 380 MEDAL DALLAS SEMICONDUCTOR CORP AC CHARACTERISTICS (cont'd) SERIAL PORT TIMING — MODE 0 {ty = 0°C to70°C; Voc = 5V + 5%) [# [raraweren [swoon [wn [max [unr | [25 [seiaiPonoetine tora | ax | | | [2s [owpuOaa sonpioRicg Gharciee | toon [rome [|r _| [27 [ouputOaa Het aterFicng CoacEape | towo [aan | |_| [ae [ina AsngEapotinpaamvate | tomy | | axtea | oe | [ce [inp Data Had atorRisngGoxesxe | tow [© | | = | POWER CYCLE TIMING Mi t-4a--— a --4--- SERVICE Le osc | | Lye INTERNAL ay RESET | Se 242

64E D MM 2614130 0007468 217? MEDAL ossooom DALLAS SEMICONDUCTOR CoRR AC CHARACTERISTICS (cont'd) PARALLEL PROGRAM LOAD TIMING (ta = 0°C to70°C; Veco = SV + 5%) fanaweren | wwor [wn [max | ONT] a a [a [Aster oterPRESHGR [wn [| 0 |_| | [ [oamsamerRGiow [ton f 0 |} | [+ [oamraaanmr rma | wmv | 0 | |_| [as rar anasswmwver | vane |» [J] [ee Wir soipte PROG [vm | | fd [a7 [ort PRGR Lew [wns [oP Pd [ae [PRoswamiow [tom anf de] [@ [Pemcwwstonaameves [wor [|e | Je [pmowstonrerin [orm fe | [A [pmaeneereriin [vm Pe 1800" [ [Fonwenetmwe [tow [re | Power On * [iter ereeerimene | wm ee Vpp High [= [Yrs aon Fegan Orie) | werns [00 |_| ew | [= Prmememme Le we PT * Second set of numbers refers to expanded memory programming up to 32K bytes. Fae 243

oessoam GYE D MM 2614130 OOO74ES 153 MMDAL DALLAS SENICO PARALLEL PROGRAM LOAD TIMING NDUCTOR CORP as |e ~—(=[}-Ca| He seat : © Laie ; }@) @ | " LJ ENpp Vn al be “fe 10 vee / |. @ | © ret PSEN CAPACITANCE (test frequency = 1 MHz; ta = 25°C) [PARAMETER —=s«[svMBoL| MIN | T¥P | max | unrts | NoTES | a a a ee [imeutGapactanco | oc | UT | to a aso vee 244

BYE D MM 2614130 0007470 97S MMDAL DS5000(T) ™~ DALLAS SEMICONDUCTOR CORP DS5000 TYPICAL Icc VS. FREQUENCY i y 2 150 4 OPERATION . -—— FREQUENCY OF OPERATION (MHz) ‘Weoms5V. tan25°C) Normal operation is measured using: 1) External crystals on XTAL1 and 2 2) Allport pins disconnected 3) RST=0 volts and EA=Vog 4) Part performing endless loop writing to internal memory. Idle mode operation is measured using: 1) External clock source at XTAL1; XTAL2 floating 2) Allport pins disconnected 3) RST=0 volts and EA=Vog 4) Part set in IDLE mode by software, 245

b4—E D em 2614130 0007471 601 MMDAL DALLAS SEMICONDUCTOR CORP NOTES: 4. All voltages are referenced to ground. 2. Maximum operating lec is measured with all output pins disconnected; XTAL1 driven with tCLKR, teaxp=10 ns, Vj. = 0.5V; XTAL2 disconnected; EA = RST = PORTO = Voc. 3. Idle mode Icg is measured with all output pins disconnected; XTAL1 driven with toxe, toKr = 10 ns, Vp. = 0.5V; XTAL2 disconnected; EA = PORTO = Vcc, RST = Vss. 4, Stop mode Icc is measured with all output pins disconnected; EA = PORTO = Vcc; XTAL2 not connected; RST = Ves. | 5. Crystal start up time is the time required to gat the mass of the crystal into vibrational motion from the time that power is first applied to the circuit until the first clock pulse is produced by the on-chip oscillator. The user should check with the crystal vendor for the worst case spec on this time. PACKAGE DRAWING | [am | aoe | es | [em [om | we | cm | oa | on Pom [oe | ow | eo | ne T [ella E eanyyyrrTrIrYYTY — = f —e- 6 =| D F 1.900 /— , — | ' oo ee nates 18718 246